loadpatents
Patent applications and USPTO patent grants for Thorkelsson; Kari.The latest application filed is for "low temperature direct copper-copper bonding".
Patent | Date |
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Low Temperature Direct Copper-copper Bonding App 20220018036 - Banik, II; Stephen J. ;   et al. | 2022-01-20 |
Dynamic modulation of cross flow manifold during elecroplating Grant 11,047,059 - Thorkelsson , et al. June 29, 2 | 2021-06-29 |
Electro-oxidative Metal Removal In Through Mask Interconnect Fabrication App 20200279754 - Thorkelsson; Kari ;   et al. | 2020-09-03 |
Electro-oxidative metal removal in through mask interconnect fabrication Grant 10,692,735 - Thorkelsson , et al. | 2020-06-23 |
Dynamic Modulation Of Cross Flow Manifold During Elecroplating App 20190301042 - Thorkelsson; Kari ;   et al. | 2019-10-03 |
Dynamic modulation of cross flow manifold during elecroplating Grant 10,364,505 - Thorkelsson , et al. | 2019-07-30 |
Multibath Plating Of A Single Metal App 20190122890 - Thorkelsson; Kari ;   et al. | 2019-04-25 |
Electro-oxidative Metal Removal In Through Mask Interconnect Fabrication App 20190035640 - Thorkelsson; Kari ;   et al. | 2019-01-31 |
Wide Lipseal For Electroplating App 20180251907 - Thorkelsson; Kari ;   et al. | 2018-09-06 |
Modulation Of Applied Current During Sealed Rotational Electroplating App 20170342590 - Thorkelsson; Kari ;   et al. | 2017-11-30 |
Dynamic Modulation Of Cross Flow Manifold During Elecroplating App 20170342583 - Thorkelsson; Kari ;   et al. | 2017-11-30 |
Direct hierarchical assembly of nanoparticles Grant 8,785,123 - Xu , et al. July 22, 2 | 2014-07-22 |
Direct Hierarchical Assembly of Nanoparticles App 20120309904 - Xu; Ting ;   et al. | 2012-12-06 |
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