Thorkelsson; Kari

Patent Applications and Registrations

Patent applications and USPTO patent grants for Thorkelsson; Kari.The latest application filed is for "low temperature direct copper-copper bonding".

Company Profile

6.5.9

Thorkelsson; Kari - Portland OR
Thorkelsson; Kari - Berkeley CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low Temperature Direct Copper-copper Bonding App 20220018036 - Banik, II; Stephen J. ; et al.	2022-01-20
Dynamic modulation of cross flow manifold during elecroplating Grant 11,047,059 - Thorkelsson , et al. June 29, 2	2021-06-29
Electro-oxidative Metal Removal In Through Mask Interconnect Fabrication App 20200279754 - Thorkelsson; Kari ; et al.	2020-09-03
Electro-oxidative metal removal in through mask interconnect fabrication Grant 10,692,735 - Thorkelsson , et al.	2020-06-23
Dynamic Modulation Of Cross Flow Manifold During Elecroplating App 20190301042 - Thorkelsson; Kari ; et al.	2019-10-03
Dynamic modulation of cross flow manifold during elecroplating Grant 10,364,505 - Thorkelsson , et al.	2019-07-30
Multibath Plating Of A Single Metal App 20190122890 - Thorkelsson; Kari ; et al.	2019-04-25
Electro-oxidative Metal Removal In Through Mask Interconnect Fabrication App 20190035640 - Thorkelsson; Kari ; et al.	2019-01-31
Wide Lipseal For Electroplating App 20180251907 - Thorkelsson; Kari ; et al.	2018-09-06
Modulation Of Applied Current During Sealed Rotational Electroplating App 20170342590 - Thorkelsson; Kari ; et al.	2017-11-30
Dynamic Modulation Of Cross Flow Manifold During Elecroplating App 20170342583 - Thorkelsson; Kari ; et al.	2017-11-30
Direct hierarchical assembly of nanoparticles Grant 8,785,123 - Xu , et al. July 22, 2	2014-07-22
Direct Hierarchical Assembly of Nanoparticles App 20120309904 - Xu; Ting ; et al.	2012-12-06

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