Thompson; Patrick Francis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Thompson; Patrick Francis.The latest application filed is for "coated semiconductor dies".
- Thompson; Patrick Francis - Allen TX
- Thompson; Patrick Francis - Wylie TX
| Patent | Date |
|---|---|
| Brass-coated metals in flip-chip redistribution layers Grant 11,410,947 - Sridharan , et al. August 9, 2 | 2022-08-09 |
| Coated Semiconductor Dies App 20220068744 - WYANT; Michael Todd ; et al. | 2022-03-03 |
| Electronic Devices In Semiconductor Package Cavities App 20220059423 - MANACK; Christopher Daniel ; et al. | 2022-02-24 |
| Semiconductor Package Including Undermounted Die With Exposed Backside Metal App 20210398882 - Thompson; Patrick Francis ; et al. | 2021-12-23 |
| Integrated Circuit With Metal Stop Ring Outside The Scribe Seal App 20210210440 - Manack; Christopher Daniel ; et al. | 2021-07-08 |
| Chip Scale Package With Redistribution Layer Interrupts App 20210210462 - Sridharan; Vivek Swaminathan ; et al. | 2021-07-08 |
| Brass-coated Metals In Flip-chip Redistribution Layers App 20210193600 - SRIDHARAN; Vivek Swaminathan ; et al. | 2021-06-24 |
| Interconnect For Electronic Device App 20210066229 - THOMPSON; PATRICK FRANCIS ; et al. | 2021-03-04 |
| Interconnect for electronic device Grant 10,833,036 - Thompson , et al. November 10, 2 | 2020-11-10 |
| Interconnect For Electronic Device App 20200211992 - THOMPSON; PATRICK FRANCIS ; et al. | 2020-07-02 |
| Semiconductor Wire Bonding And Method App 20160379953 - Thompson; Patrick Francis ; et al. | 2016-12-29 |
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