Thompson; Erica J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Thompson; Erica J..The latest application filed is for "etchstop regions in fins of semiconductor devices".

Company Profile

5.3.7

Thompson; Erica J. - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant Grant 11,443,983 - Chowdhury , et al. September 13, 2	2022-09-13
Semiconductor device having fin-end stress-inducing features Grant 10,964,800 - Ho , et al. March 30, 2	2021-03-30
Etchstop Regions In Fins Of Semiconductor Devices App 20200279941 - HUANG; Cheng-Ying ; et al.	2020-09-03
Non-planar Integrated Circuit Structures Having Mitigated Source Or Drain Etch From Replacement Gate Process App 20200105757 - KANG; Jun Sung ; et al.	2020-04-02
Void-free High Aspect Ratio Metal Alloy Interconnects And Method Of Manufacture Using A Solvent-based Etchant App 20200098626 - CHOWDHURY; Shaestagir ; et al.	2020-03-26
Semiconductor Device Having Fin-end Stress-inducing Features App 20200058761 - HO; Byron ; et al.	2020-02-20
Nanowire Transistor Structure And Method Of Shaping App 20190393350 - Thompson; Erica J. ; et al.	2019-12-26
Technology for selectively etching titanium and titanium nitride in the presence of other materials Grant 9,472,456 - Thompson , et al. October 18, 2	2016-10-18
Technology For Selectively Etching Titanium And Titanium Nitride In The Presence Of Other Materials App 20150179510 - THOMPSON; ERICA J. ; et al.	2015-06-25

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