Thomas; Clint

Patent Applications and Registrations

Patent applications and USPTO patent grants for Thomas; Clint.The latest application filed is for "method and systems for cleaning a substrate".

Company Profile

0.12.9

Thomas; Clint - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
Method and Systems for Cleaning A Substrate App 20150040947 - Freer; Erik M. ; et al.	2015-02-12
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Method and apparatus for removing contamination from substrate Grant 8,555,903 - Freer , et al. October 15, 2	2013-10-15
Apparatus and system for cleaning a substrate Grant 8,522,799 - Freer , et al. September 3, 2	2013-09-03
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Method and Apparatus for Removing Contamination from Substrate App 20100059088 - Freer; Erik M. ; et al.	2010-03-11
Method and apparatus for removing contamination from substrate Grant 7,648,584 - Freer , et al. January 19, 2	2010-01-19
Apparatus And System For Cleaning A Substrate App 20090308413 - Freer; Erik M. ; et al.	2009-12-17
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Method and apparatus for removing contamination from substrate App 20070079848 - Freer; Erik M. ; et al.	2007-04-12

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