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Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layer Grant 7,220,635 - Brask , et al. May 22, 2 | 2007-05-22 |
CMOS device with metal and silicide gate electrodes and a method for making it Grant 7,153,734 - Brask , et al. December 26, 2 | 2006-12-26 |
Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layer App 20060183277 - Brask; Justin K. ;   et al. | 2006-08-17 |
Atomic layer deposition of high quality high-k transition metal and rare earth oxides App 20060045968 - Metz; Matthew V. ;   et al. | 2006-03-02 |
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Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions App 20060006071 - Che; Guangli ;   et al. | 2006-01-12 |
Method of electroless introduction of interconnect structures Grant 6,977,224 - Dubin , et al. December 20, 2 | 2005-12-20 |
Cmos Device With Metal And Silicide Gate Electrodes And A Method For Making It App 20050148136 - Brask, Justin K. ;   et al. | 2005-07-07 |
Seed layer treatment App 20050112856 - Dubin, Valery M. ;   et al. | 2005-05-26 |
Apparatus and method for electroless spray deposition Grant 6,843,852 - Dubin , et al. January 18, 2 | 2005-01-18 |
Apparatus and method for electroless spray deposition App 20050008786 - Dubin, Valery M. ;   et al. | 2005-01-13 |
Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions App 20040245107 - Che, Guangli ;   et al. | 2004-12-09 |
Method of treating an electroless plating waste Grant 6,733,679 - Dubin , et al. May 11, 2 | 2004-05-11 |
Seed layer treatment App 20040058139 - Dubin, Valery M. ;   et al. | 2004-03-25 |
Interconnect structures and a method of electroless introduction of interconnect structures Grant 6,696,758 - Dubin , et al. February 24, 2 | 2004-02-24 |
Semiconductor device using an interconnect App 20040026786 - Leu, Jihperng ;   et al. | 2004-02-12 |
Method of making semiconductor device using an interconnect Grant 6,605,874 - Leu , et al. August 12, 2 | 2003-08-12 |
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Method of treating an electroless plating waste App 20030085177 - Dubin, Valery M. ;   et al. | 2003-05-08 |
Interconnect structures and a method of electroless introduction of interconnect structures App 20030071355 - Dubin, Valery M. ;   et al. | 2003-04-17 |
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