loadpatents
name:-0.029819011688232
name:-0.016839981079102
name:-0.0015301704406738
Thomas; Christopher D. Patent Filings

Thomas; Christopher D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Thomas; Christopher D..The latest application filed is for "methods & apparatus for electroless plating dispense".

Company Profile
0.12.19
  • Thomas; Christopher D. - Portland OR
  • Thomas; Christopher D. - Aloha OR
  • Thomas; Christopher D. - Swansea GB7
  • Thomas; Christopher D. - Woodbridge GB2
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods & Apparatus For Electroless Plating Dispense
App 20210375662 - Reddy; Harinath ;   et al.
2021-12-02
Method For Depositing Gate Metal For CMOS Devices
App 20110147851 - Thomas; Christopher D. ;   et al.
2011-06-23
CMOS device with metal and silicide gate electrodes and a method for making it
Grant 7,883,951 - Brask , et al. February 8, 2
2011-02-08
Cmos Device With Metal And Silicide Gate Electrodes And A Method For Making It
App 20090280608 - Brask; Justin K. ;   et al.
2009-11-12
Cmos Device With Metal And Silicide Gate Electrodes And A Method For Making It
App 20080124857 - Brask; Justin K. ;   et al.
2008-05-29
Semiconductor device using an interconnect
Grant 7,320,935 - Leu , et al. January 22, 2
2008-01-22
Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layer
Grant 7,220,635 - Brask , et al. May 22, 2
2007-05-22
CMOS device with metal and silicide gate electrodes and a method for making it
Grant 7,153,734 - Brask , et al. December 26, 2
2006-12-26
Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layer
App 20060183277 - Brask; Justin K. ;   et al.
2006-08-17
Atomic layer deposition of high quality high-k transition metal and rare earth oxides
App 20060045968 - Metz; Matthew V. ;   et al.
2006-03-02
Seed layer treatment
Grant 7,001,641 - Dubin , et al. February 21, 2
2006-02-21
Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions
App 20060006071 - Che; Guangli ;   et al.
2006-01-12
Method of electroless introduction of interconnect structures
Grant 6,977,224 - Dubin , et al. December 20, 2
2005-12-20
Cmos Device With Metal And Silicide Gate Electrodes And A Method For Making It
App 20050148136 - Brask, Justin K. ;   et al.
2005-07-07
Seed layer treatment
App 20050112856 - Dubin, Valery M. ;   et al.
2005-05-26
Apparatus and method for electroless spray deposition
Grant 6,843,852 - Dubin , et al. January 18, 2
2005-01-18
Apparatus and method for electroless spray deposition
App 20050008786 - Dubin, Valery M. ;   et al.
2005-01-13
Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions
App 20040245107 - Che, Guangli ;   et al.
2004-12-09
Method of treating an electroless plating waste
Grant 6,733,679 - Dubin , et al. May 11, 2
2004-05-11
Seed layer treatment
App 20040058139 - Dubin, Valery M. ;   et al.
2004-03-25
Interconnect structures and a method of electroless introduction of interconnect structures
Grant 6,696,758 - Dubin , et al. February 24, 2
2004-02-24
Semiconductor device using an interconnect
App 20040026786 - Leu, Jihperng ;   et al.
2004-02-12
Method of making semiconductor device using an interconnect
Grant 6,605,874 - Leu , et al. August 12, 2
2003-08-12
Apparatus and method for electroless spray deposition
App 20030134047 - Dubin, Valery M. ;   et al.
2003-07-17
Method Of Making Semiconductor Device Using An Interconnect
App 20030111729 - Leu, Jihperng ;   et al.
2003-06-19
Method of treating an electroless plating waste
App 20030085177 - Dubin, Valery M. ;   et al.
2003-05-08
Interconnect structures and a method of electroless introduction of interconnect structures
App 20030071355 - Dubin, Valery M. ;   et al.
2003-04-17
Interconnect structures and a method of electroless introduction of interconnect structures
App 20020084529 - Dubin, Valery M. ;   et al.
2002-07-04
Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
App 20020064592 - Datta, Madhav ;   et al.
2002-05-30
Synchronizer clutch assembly for multiple ratio gearing
Grant 5,531,305 - Roberts , et al. July 2, 1
1996-07-02
Jointing armoured submarine cables
Grant 4,722,590 - Thomas February 2, 1
1988-02-02

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