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Patent applications and USPTO patent grants for Third Dimension Semiconductor, Inc..The latest application filed is for "process for high voltage superjunction termination".
Patent | Date |
---|---|
Process for high voltage superjunction termination Grant 7,759,204 - Hshieh , et al. July 20, 2 | 2010-07-20 |
Technique for forming the deep doped columns in superjunction Grant 7,015,104 - Blanchard March 21, 2 | 2006-03-21 |
Semiconductor high-voltage devices Grant 6,936,867 - Chen August 30, 2 | 2005-08-30 |
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