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Patent applications and USPTO patent grants for Thin Materials AG.The latest application filed is for "method for separating a layer system comprising a wafer".
Patent | Date |
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Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front Grant 8,951,886 - Richter February 10, 2 | 2015-02-10 |
Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement Grant 8,911,583 - Jakob December 16, 2 | 2014-12-16 |
Bonding method Grant 8,641,859 - Richter February 4, 2 | 2014-02-04 |
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer Grant 8,173,522 - Jakob , et al. May 8, 2 | 2012-05-08 |
Method For Separating A Layer System Comprising A Wafer App 20120028438 - Richter; Franz | 2012-02-02 |
Bonding Method App 20110272092 - Richter; Franz | 2011-11-10 |
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