THIMM; Alfred

Patent Applications and Registrations

Patent applications and USPTO patent grants for THIMM; Alfred.The latest application filed is for "module with connection lugs for supply lines".

Company Profile

1.16.25

THIMM; Alfred - Wunsiedel DE
THIMM; Alfred - Marktredwitz DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Module with Connection Lugs for Supply Lines App 20210384115 - THIMM; Alfred ; et al.	2021-12-09
Method for producing multi-level metalization on a ceramic substrate Grant 10,568,214 - Adler , et al. Feb	2020-02-18
Metal coating on ceramic substrates Grant 10,207,958 - Herrmann , et al. Feb	2019-02-19
Method for metalizing vias Grant 10,165,681 - Thimm , et al. Dec	2018-12-25
Multi-level Metalization On A Ceramic Substrate App 20170290169 - Adler; Sigurd ; et al.	2017-10-05
Ceramic printed circuit board comprising an al cooling body Grant 9,730,309 - Dohn , et al. August 8, 2	2017-08-08
Homogeneous liquid cooling of LED array Grant 9,494,370 - Schreir-Alt , et al. November 15, 2	2016-11-15
Extruded molded functional body made of highly thermally conductive ceramic Grant 9,394,203 - Gunthner , et al. July 19, 2	2016-07-19
Metal Coating On Ceramic Substrates App 20160115088 - Herrmann; Klaus ; et al.	2016-04-28
LED driver circuit Grant 9,301,362 - Dohn , et al. March 29, 2	2016-03-29
Multi-level Metalization On A Ceramic Substrate App 20150366075 - ADLER; Sigurd ; et al.	2015-12-17
Method For Metalizing Vias App 20150282318 - Thimm; Alfred ; et al.	2015-10-01
Light Reflecting Substrate For Led Applications App 20150194582 - Dohn; Alexander ; et al.	2015-07-09
Ceramic material with a composition which is matched to a coefficient of thermal expansion specified by a metallic material Grant 8,889,273 - Thimm , et al. November 18, 2	2014-11-18
Embedded Metal Structures In Ceramic Substrates App 20140290985 - Dohn; Alexander ; et al.	2014-10-02
Led Lamp Comprising An Led As The Luminaire And A Glass Or Plastic Lampshade App 20140022784 - Dohn; Alexander ; et al.	2014-01-23
Ceramic Printed Circuit Board Comprising An Al Cooling Body App 20140016330 - Dohn; Alexander ; et al.	2014-01-16
Injection-molded Lamp Body With Ceramic Cooling Apparatuses And Leds App 20140009946 - Dohn; Alexander ; et al.	2014-01-09
Coil Bodies Having A Ceramic Core App 20130342302 - Dohn; Alexander ; et al.	2013-12-26
Array of scalable ceramic diode carriers with LEDs Grant 8,545,054 - Dohn , et al. October 1, 2	2013-10-01
Method For Joining Two Partners To Be Joined, I.e. Ceramic And Metal/ceramic Materials, Using A Laser Beam App 20130248499 - Dohn; Alexander ; et al.	2013-09-26
Led Light Comprising An Integrated Driver App 20130241426 - Dohn; Alexander ; et al.	2013-09-19
Led Driver Circuit App 20130241425 - Dohn; Alexander ; et al.	2013-09-19
Extruded Molded Functional Body Made Of Highly Thermally Conductive Ceramic App 20120263896 - Gunthner; Gerhard ; et al.	2012-10-18
Array Of Scalable Ceramic Diode Carriers Having Leds App 20120223344 - Dohn; Alexander ; et al.	2012-09-06
Homogeneous Liquid Cooling Of Led Array App 20120145355 - SCHREIR-ALT; Thomas ; et al.	2012-06-14
Ceramic Material With A Composition Which Is Matched To A Coefficient Of Thermal Expansion Specified By A Metallic Material App 20100233497 - Thimm; Alfred ; et al.	2010-09-16
Process for producing ceramic heating elements Grant 5,560,851 - Thimm , et al. October 1, 1	1996-10-01

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