THIE; William

Patent Applications and Registrations

Patent applications and USPTO patent grants for THIE; William.The latest application filed is for "multi-location gas injection to improve uniformity in rapid alternating processes".

Company Profile

1.43.43

THIE; William - Fremont CA
Thie; William - Mountain View CA
Thie; William - Sunnyvale CA
Thie; William - Mountain Viiew CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-location Gas Injection To Improve Uniformity In Rapid Alternating Processes App 20220108875 - THIE; William ; et al.	2022-04-07
High aspect ratio etch Grant 9,997,364 - Thie , et al. June 12, 2	2018-06-12
High Aspect Ratio Etch App 20180108531 - THIE; William ; et al.	2018-04-19
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
Controlled ambient system for interface engineering Grant 9,117,860 - Boyd , et al. August 25, 2	2015-08-25
Processes And Systems For Engineering A Barrier Surface For Copper Deposition App 20150214093 - Dordi; Yezdi ; et al.	2015-07-30
System And Method For Forming Patterned Copper Lines Through Electroless Copper Plating App 20150034589 - Lee; Alan ; et al.	2015-02-05
Methods for removing a metal oxide from a substrate Grant 8,883,027 - Yoon , et al. November 11, 2	2014-11-11
Processes And Systems For Engineering A Copper Surface For Selective Metal Deposition App 20140322446 - Dordi; Yezdi ; et al.	2014-10-30
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Post-deposition cleaning methods for substrates with cap layers Grant 8,790,465 - Kolics , et al. July 29, 2	2014-07-29
Processes and systems for engineering a copper surface for selective metal deposition Grant 8,771,804 - Dordi , et al. July 8, 2	2014-07-08
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide Grant 8,747,960 - Dordi , et al. June 10, 2	2014-06-10
Controlled gas mixing for smooth sidewall rapid alternating etch process Grant 8,691,698 - Xu , et al. April 8, 2	2014-04-08
Simultaneous electroless plating of two substrates Grant 8,622,020 - Thie , et al. January 7, 2	2014-01-07
Porous dielectrics K value restoration by thermal treatment and or solvent treatment Grant 8,603,913 - Li , et al. December 10, 2	2013-12-10
Post-deposition Cleaning Methods And Formulations For Substrates With Cap Layers App 20130323410 - KOLICS; Artur ; et al.	2013-12-05
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Controlled Gas Mixing For Smooth Sidewall Rapid Alternating Etch Process App 20130203256 - Xu; Qing ; et al.	2013-08-08
Method and apparatus for material deposition Grant 8,490,573 - Dordi , et al. July 23, 2	2013-07-23
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Post-deposition cleaning methods and formulations for substrates with cap layers Grant 8,404,626 - Kolics , et al. March 26, 2	2013-03-26
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Processes and Systems for Engineering a Barrier Surface for Copper Deposition App 20120269987 - Dordi; Yezdi ; et al.	2012-10-25
Processes and systems for engineering a barrier surface for copper deposition Grant 8,241,701 - Dordi , et al. August 14, 2	2012-08-14
Methods and systems for barrier layer surface passivation Grant 8,133,812 - Dordi , et al. March 13, 2	2012-03-13
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Interconnect Structure And Method Of Manufacturing A Damascene Structure App 20110306203 - Dordi; Yezdi ; et al.	2011-12-15
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Interconnect structure and method of manufacturing a damascene structure Grant 8,026,605 - Dordi , et al. September 27, 2	2011-09-27
Method and Apparatus for Material Deposition App 20110081779 - Dordi; Yezdi ; et al.	2011-04-07
Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency Grant 7,909,934 - Boyd , et al. March 22, 2	2011-03-22
Thermal methods for cleaning post-CMP wafers Grant 7,884,017 - Wang , et al. February 8, 2	2011-02-08
Method for electroless depositing a material on a surface of a wafer Grant 7,875,554 - Dordi , et al. January 25, 2	2011-01-25
Electroless Plating Method and Apparatus App 20110011335 - Thie; William ; et al.	2011-01-20
Electroless plating method and apparatus Grant 7,829,152 - Thie , et al. November 9, 2	2010-11-09
Apparatus for Applying a Plating Solution for Electroless Deposition App 20100239767 - Dordi; Yezdi ; et al.	2010-09-23
Apparatus for applying a plating solution for electroless deposition Grant 7,752,996 - Dordi , et al. July 13, 2	2010-07-13
Thermal Methods For Cleaning Post-cmp Wafers App 20100136788 - Wang; Zhonghui Alex ; et al.	2010-06-03
Methods For Removing A Metal Oxide From A Substrate App 20100108491 - Yoon; Hyungsuk Alexander ; et al.	2010-05-06
Thermal methods for cleaning post-CMP wafers Grant 7,709,400 - Wang , et al. May 4, 2	2010-05-04
Apparatus for the removal of a metal oxide from a substrate and methods therefor Grant 7,662,253 - Yoon , et al. February 16, 2	2010-02-16
Methods And Systems For Barrier Layer Surface Passivation App 20100009535 - Dordi; Yezdi ; et al.	2010-01-14
Self assembled monolayer for improving adhesion between copper and barrier layer App 20090304914 - Nalla; Praveen ; et al.	2009-12-10
Methods and systems for barrier layer surface passivation Grant 7,592,259 - Dordi , et al. September 22, 2	2009-09-22
Method and apparatus for semiconductor wafer planarization Grant 7,582,565 - Redeker , et al. September 1, 2	2009-09-01
Post-deposition Cleaning Methods And Formulations For Substrates With Cap Layers App 20090162537 - KOLICS; Artur ; et al.	2009-06-25
Thermal methods for cleaning post-CMP wafers App 20080280456 - Wang; Zhonghui Alex ; et al.	2008-11-13
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Method and Apparatus for Semiconductor Wafer Planarization App 20080166885 - Redeker; Fred C. ; et al.	2008-07-10
Method and Apparatus for Material Deposition App 20080153291 - Dordi; Yezdi ; et al.	2008-06-26
Self-limiting plating method App 20080152823 - Boyd; John ; et al.	2008-06-26
Interconnect structure and method of manufacturing a damascene structure App 20080142971 - Dordi; Yezdi ; et al.	2008-06-19
Methods and systems for barrier layer surface passivation App 20080146025 - Dordi; Yezdi ; et al.	2008-06-19
Method and apparatus for semiconductor wafer planarization Grant 7,368,017 - Redeker , et al. May 6, 2	2008-05-06
Method and apparatus for material deposition in semiconductor fabrication Grant 7,358,186 - Dordi , et al. April 15, 2	2008-04-15
Electroless Plating Method And Apparatus App 20080085370 - Thie; William ; et al.	2008-04-10
Method For Gap Fill In Controlled Ambient System App 20080057182 - Boyd; John ; et al.	2008-03-06
Controlled ambient system for interface engineering App 20080057221 - Boyd; John ; et al.	2008-03-06
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide App 20070292615 - Dordi; Yezdi ; et al.	2007-12-20
Processes and systems for engineering a barrier surface for copper deposition App 20070292603 - Dordi; Yezdi ; et al.	2007-12-20
Processes and systems for engineering a copper surface for selective metal deposition App 20070292604 - Dordi; Yezdi ; et al.	2007-12-20
Plating solutions for electroless deposition of copper Grant 7,297,190 - Dordi , et al. November 20, 2	2007-11-20
Apparatus For Applying A Plating Solution For Electroless Deposition App 20070264436 - Dordi; Yezdi ; et al.	2007-11-15
Apparatus for the removal of a metal oxide from a substrate and methods therefor App 20070072432 - Yoon; Hyungsuk Alexander ; et al.	2007-03-29
System And Method For Forming Patterned Copper Lines Through Electroless Copper Plating App 20070048447 - Lee; Alan ; et al.	2007-03-01
Method and apparatus for megasonic cleaning with reflected acoustic waves Grant 7,040,332 - Boyd , et al. May 9, 2	2006-05-09
Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency Grant 6,995,067 - Boyd , et al. February 7, 2	2006-02-07
Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency App 20060000487 - Boyd; John ; et al.	2006-01-05
Method and apparatus for semiconductor wafer planarization App 20050126932 - Redeker, Fred C. ; et al.	2005-06-16
Method and apparatus for material deposition App 20050130415 - Dordi, Yezdi ; et al.	2005-06-16
Method and apparatus for megasonic cleaning with reflected acoustic waves App 20040168706 - Boyd, John M. ; et al.	2004-09-02
Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency App 20040154637 - Boyd, John ; et al.	2004-08-12

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