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name:-0.019379854202271
name:-0.0045270919799805
name:-0.007594108581543
THIBADO; Jonathan W. Patent Filings

THIBADO; Jonathan W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for THIBADO; Jonathan W..The latest application filed is for "removable and low insertion force connector system".

Company Profile
6.4.21
  • THIBADO; Jonathan W. - Beaverton OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Removable And Low Insertion Force Connector System
App 20210400813 - THIBADO; Jonathan W. ;   et al.
2021-12-23
System Device Aggregation In A Liquid Cooling Environment
App 20210385971 - GORIUS; Aaron ;   et al.
2021-12-09
Diminished Printed Circuit Board (pcb) Warpage
App 20210120663 - THIBADO; Jonathan W. ;   et al.
2021-04-22
Top-side Connector Interface For Processor Packaging
App 20210120668 - Aoki; Russell S. ;   et al.
2021-04-22
Top-side connector interface for processor packaging
Grant 10,880,994 - Aoki , et al. December 29, 2
2020-12-29
Reflowable Grid Array As Standby Heater For Reliability
App 20200229309 - THIBADO; Jonathan W. ;   et al.
2020-07-16
Reflowable Grid Array With High Speed Flex Cables
App 20200227362 - THIBADO; Jonathan W. ;   et al.
2020-07-16
Reflowable Grid Array To Support Grid Heating
App 20200229294 - THIBADO; Jonathan W. ;   et al.
2020-07-16
Reflow Grid Array To Support Late Attach Of Components
App 20200205299 - Thibado; Jonathan W. ;   et al.
2020-06-25
Rework grid array interposer with direct power
Grant 10,211,120 - Aoki , et al. Feb
2019-02-19
Connector Interface For Processor Packaging
App 20180352649 - Aoki; Russell S. ;   et al.
2018-12-06
Cpu Package Substrates With Removable Memory Mechanical Interfaces
App 20180007791 - Prakash; Mani ;   et al.
2018-01-04
Top-side Connector Interface For Processor Packaging
App 20170354031 - Aoki; Russell S. ;   et al.
2017-12-07
CPU package substrates with removable memory mechanical interfaces
Grant 9,832,876 - Prakash , et al. November 28, 2
2017-11-28
Rework grid array interposer with direct power
App 20170186661 - Aoki; Russell S. ;   et al.
2017-06-29
Bulk Solder Removal On Processor Packaging
App 20170179066 - Aoki; Russell S. ;   et al.
2017-06-22
Electronic assembly that includes a plurality of electronic packages
Grant 9,603,276 - Llapitan , et al. March 21, 2
2017-03-21
Socket That Engages A Plurality Of Electronic Packages
App 20160190716 - Liu; Kuang ;   et al.
2016-06-30
Electronic Assembly That Includes A Plurality Of Electronic Packages
App 20160190717 - Llapitan; David J. ;   et al.
2016-06-30
Cpu Package Substrates With Removable Memory Mechanical Interfaces
App 20160183374 - Prakash; Mani ;   et al.
2016-06-23
Brush for cleaning/scrubbing a substrate
App 20040040575 - Tregub, Alexander II ;   et al.
2004-03-04

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