loadpatents
Patent applications and USPTO patent grants for Theuss; Horst.The latest application filed is for "radio-frequency devices and methods for producing radio-frequency devices".
Patent | Date |
---|---|
Magnetic-field sensor package with integrated passive component Grant 11,422,144 - Schindler , et al. August 23, 2 | 2022-08-23 |
Radio-frequency Devices And Methods For Producing Radio-frequency Devices App 20220247089 - HARTNER; Walter ;   et al. | 2022-08-04 |
Hermetically Sealed Housing With A Semiconductor Component And Method For Manufacturing Thereof App 20220172971 - SCHALLER; Rainer Markus ;   et al. | 2022-06-02 |
Apparatus And Method For In-situ Calibration Of A Photoacoustic Sensor App 20220155261 - Kolb; Stefan ;   et al. | 2022-05-19 |
Multi-purpose non-linear semiconductor package assembly line Grant 11,302,668 - Meyer , et al. April 12, 2 | 2022-04-12 |
Pressure sensor module having a sensor chip and passive devices within a housing Grant 11,287,344 - Vaupel , et al. March 29, 2 | 2022-03-29 |
Hermetically sealed housing with a semiconductor component and method for manufacturing thereof Grant 11,289,353 - Schaller , et al. March 29, 2 | 2022-03-29 |
Apparatus and method for in-situ calibration of a photoacoustic sensor Grant 11,275,059 - Kolb , et al. March 15, 2 | 2022-03-15 |
Low profile transducer module Grant 11,267,698 - Theuss , et al. March 8, 2 | 2022-03-08 |
Photoacoustic Sensors and Associated Production Methods App 20220065773 - Theuss; Horst ;   et al. | 2022-03-03 |
Photoacoustic sensor module and assembly Grant 11,255,824 - Schaller , et al. February 22, 2 | 2022-02-22 |
Sensor Devices Having Sensor And Mems Microphone And Associated Methods App 20220009438 - SCHALLER; Rainer Markus ;   et al. | 2022-01-13 |
MEMS sensor package systems and methods Grant 11,192,777 - Winkler , et al. December 7, 2 | 2021-12-07 |
Magnetic-sensor Device And Method For Producing Same App 20210341555 - THEUSS; Horst ;   et al. | 2021-11-04 |
Sensor Devices With Gas-permeable Cover And Associated Production Methods App 20210323812 - SCHALLER; Rainer Markus ;   et al. | 2021-10-21 |
Photo-acoustic gas sensor with optimal reference path length Grant 11,143,626 - Theuss October 12, 2 | 2021-10-12 |
Packaged Semiconductor Device And Method For Fabricating A Packaged Semiconductor Device App 20210313275 - THEUSS; Horst | 2021-10-07 |
Wafer Arrangement For Gas Sensor App 20210285866 - KOLB; Stefan ;   et al. | 2021-09-16 |
Detector module for a photo-acoustic gas sensor Grant 11,105,776 - Theuss , et al. August 31, 2 | 2021-08-31 |
Wafer arrangement for gas sensor Grant 11,092,538 - Kolb , et al. August 17, 2 | 2021-08-17 |
Photoacoustic gas sensor Grant 11,067,542 - Dehe , et al. July 20, 2 | 2021-07-20 |
Inductive Angle And/or Position Sensor App 20210190543 - AUSSERLECHNER; Udo ;   et al. | 2021-06-24 |
Photoacoustic Sensors And Mems Devices App 20210181151 - SCHALLER; Rainer Markus ;   et al. | 2021-06-17 |
Semiconductor Component And Method For Producing Same App 20210087054 - VAUPEL; Mathias ;   et al. | 2021-03-25 |
Semiconductor component and method for producing same Grant 10,947,109 - Vaupel , et al. March 16, 2 | 2021-03-16 |
Flat Lead Package Formation Method App 20210043603 - Meyer; Thorsten ;   et al. | 2021-02-11 |
Stressed decoupled micro-electro-mechanical system sensor Grant 10,870,575 - Theuss , et al. December 22, 2 | 2020-12-22 |
Semiconductor Devices Comprising Planar Waveguide Transmission Lines App 20200388583 - THEUSS; Horst | 2020-12-10 |
Pressure Sensor Module Having A Sensor Chip And Passive Devices Within A Housing App 20200370983 - Vaupel; Mathias ;   et al. | 2020-11-26 |
Wafer Arrangement For Gas Sensor App 20200355602 - KOLB; Stefan ;   et al. | 2020-11-12 |
Magnetic-field Sensor Package With Integrated Passive Component App 20200341023 - SCHINDLER; Manfred ;   et al. | 2020-10-29 |
Sonic sensors and packages Grant 10,802,124 - Elian , et al. October 13, 2 | 2020-10-13 |
Molded lead frame sensor package Grant 10,781,095 - Dangelmaier , et al. Sept | 2020-09-22 |
Photoacoustic gas sensor package Grant 10,782,270 - Theuss , et al. Sept | 2020-09-22 |
Wafer arrangement Grant 10,753,858 - Kolb , et al. A | 2020-08-25 |
Methods Including Panel Bonding Acts And Electronic Devices Including Cavities App 20200249149 - Kind Code | 2020-08-06 |
Photo-acoustic Gas Sensor With Optimal Reference Path Length App 20200225194 - THEUSS; Horst | 2020-07-16 |
Multi-Purpose Non-Linear Semiconductor Package Assembly Line App 20200203310 - Meyer; Thorsten ;   et al. | 2020-06-25 |
Molded Lead Frame Sensor Package App 20200189908 - DANGELMAIER; Jochen ;   et al. | 2020-06-18 |
Packages for microelectromechanical system (MEMS) mirror and methods of manufacturing the same Grant 10,678,046 - Ghahremani , et al. | 2020-06-09 |
Pressure sensor module having a sensor chip and passive devices within a housing Grant 10,677,675 - Vaupel , et al. | 2020-06-09 |
Photoacoustic Sensor Module And Assembly App 20200150095 - SCHALLER; Rainer Markus ;   et al. | 2020-05-14 |
MEMS sound transducer element and method for producing a MEMS sound transducer element Grant 10,616,703 - Steiert , et al. | 2020-04-07 |
Apparatus And Method For In-situ Calibration Of A Photoacoustic Sensor App 20200103376 - KOLB; Stefan ;   et al. | 2020-04-02 |
Photoacoustic Gas Sensor App 20200080972 - Dehe; Alfons ;   et al. | 2020-03-12 |
Detector Module For A Photo-acoustic Gas Sensor App 20200057031 - Theuss; Horst ;   et al. | 2020-02-20 |
Multi-purpose non-linear semiconductor package assembly line Grant 10,566,309 - Meyer , et al. Feb | 2020-02-18 |
Sensor Devices And Methods For Manufacturing The Same App 20200053483 - Theuss; Horst | 2020-02-13 |
Photoacoustic Gas Sensor Package App 20200018731 - THEUSS; Horst ;   et al. | 2020-01-16 |
Apparatus and method for in-situ calibration of a photoacoustic sensor Grant 10,527,589 - Kolb , et al. J | 2020-01-07 |
Stressed Decoupled Micro-electro-mechanical System Sensor App 20200002159 - THEUSS; Horst ;   et al. | 2020-01-02 |
Transducer package with integrated sealing Grant 10,519,030 - Elian , et al. Dec | 2019-12-31 |
Laminate package of chip on carrier and in cavity Grant 10,522,433 - Hoegerl , et al. Dec | 2019-12-31 |
Package with component connected at carrier level Grant 10,515,879 - Schindler , et al. Dec | 2019-12-24 |
Photoacoustic gas sensor device and a method for analyzing gas Grant 10,495,612 - Dehe , et al. De | 2019-12-03 |
Wafer Arrangement App 20190323947 - Kolb; Stefan ;   et al. | 2019-10-24 |
Integrated photo-acoustic gas sensor module Grant 10,451,543 - Mueller , et al. Oc | 2019-10-22 |
Implantable vessel fluid sensor Grant 10,433,736 - Karlovsky , et al. O | 2019-10-08 |
Packages For Microelectromechanical System (mems) Mirror And Methods Of Manufacturing The Same App 20190293923 - GHAHREMANI; Cyrus ;   et al. | 2019-09-26 |
Packaged Semiconductor Devices And Methods For Producing Packaged Semiconductor Devices App 20190270636 - Schaller; Rainer Markus ;   et al. | 2019-09-05 |
Gas sensor Grant 10,365,208 - Kolb , et al. July 30, 2 | 2019-07-30 |
Semiconductor Devices Comprising Metallizations Composed Of Porous Copper And Associated Production Methods App 20190221533 - THEUSS; Horst ;   et al. | 2019-07-18 |
Hermetically Sealed Housing With A Semiconductor Component And Method For Manufacturing Thereof App 20190131154 - SCHALLER; Rainer Markus ;   et al. | 2019-05-02 |
Semiconductor Component And Method For Producing Same App 20190106321 - VAUPEL; Mathias ;   et al. | 2019-04-11 |
Photo-acoustic gas sensor module having light emitter and detector units Grant 10,241,088 - Theuss , et al. | 2019-03-26 |
Low Profile Transducer Module App 20190039882 - Theuss; Horst ;   et al. | 2019-02-07 |
Pressure Sensor Module Having A Sensor Chip And Passive Devices Within A Housing App 20180364123 - Vaupel; Mathias ;   et al. | 2018-12-20 |
Package With Component Connected At Carrier Level App 20180350727 - Schindler; Manfred ;   et al. | 2018-12-06 |
Low profile transducer module Grant 10,138,115 - Theuss , et al. Nov | 2018-11-27 |
MEMS device Grant 10,125,012 - Fuergut , et al. November 13, 2 | 2018-11-13 |
Method of forming a protective coating for a packaged semiconductor device Grant 10,118,816 - Elian , et al. November 6, 2 | 2018-11-06 |
Implantable device and implantable system comprising the same Grant 10,117,621 - Berger , et al. November 6, 2 | 2018-11-06 |
GMR sensor within molded magnetic material employing non-magnetic spacer Grant 10,107,875 - Elian , et al. October 23, 2 | 2018-10-23 |
Sensor arrangement, battery cell and energy system Grant 10,107,867 - Elian , et al. October 23, 2 | 2018-10-23 |
Mems Sound Transducer Element And Method For Producing A Mems Sound Transducer Element App 20180295458 - Steiert; Matthias ;   et al. | 2018-10-11 |
Chip arrangement and a method for manufacturing the same Grant 10,097,918 - Spoettl , et al. October 9, 2 | 2018-10-09 |
Pressure sensor module having a sensor chip and passive devices within a housing Grant 10,060,819 - Vaupel , et al. August 28, 2 | 2018-08-28 |
Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals Grant 9,998,812 - Elian , et al. June 12, 2 | 2018-06-12 |
Pre-mold for a microphone assembly and method of producing the same Grant 9,986,354 - Mueller , et al. May 29, 2 | 2018-05-29 |
Insulated die Grant 9,978,720 - Theuss , et al. May 22, 2 | 2018-05-22 |
Mems Sensor Package Systems And Methods App 20180127267 - Winkler; Bernhard ;   et al. | 2018-05-10 |
Multi-die pressure sensor package Grant 9,952,110 - Beer , et al. April 24, 2 | 2018-04-24 |
Multi-Purpose Non-Linear Semiconductor Package Assembly Line App 20180096966 - Meyer; Thorsten ;   et al. | 2018-04-05 |
Magnetic sensor device comprising a ring-shaped magnet and a sensor chip in a common package Grant 9,927,498 - Elian , et al. March 27, 2 | 2018-03-27 |
MEMS sensor package systems and methods Grant 9,884,757 - Winkler , et al. February 6, 2 | 2018-02-06 |
Molded cavity package with embedded conductive layer and enhanced sealing Grant 9,868,632 - Chiang , et al. January 16, 2 | 2018-01-16 |
Semiconductor component comprising magnetic field sensor Grant 9,859,332 - Theuss , et al. January 2, 2 | 2018-01-02 |
Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces Grant 9,818,665 - Elian , et al. November 14, 2 | 2017-11-14 |
Laminate package of chip on carrier and in cavity App 20170316994 - HOEGERL; Juergen ;   et al. | 2017-11-02 |
Micromechanical semiconductor sensing device Grant 9,790,086 - Kalz , et al. October 17, 2 | 2017-10-17 |
Transducer package with integrated sealing App 20170283246 - ELIAN; Klaus ;   et al. | 2017-10-05 |
Multi-Die Pressure Sensor Package App 20170284880 - Beer; Sebastian ;   et al. | 2017-10-05 |
Molded chip package and method of manufacturing the same Grant 9,780,061 - Gabler , et al. October 3, 2 | 2017-10-03 |
Molded Cavity Package with Embedded Conductive Layer and Enhanced Sealing App 20170275159 - Chiang; Chau Fatt ;   et al. | 2017-09-28 |
Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery Grant 9,748,611 - Elian , et al. August 29, 2 | 2017-08-29 |
Sensor device and method Grant 9,728,652 - Elian , et al. August 8, 2 | 2017-08-08 |
Integrated Photo-acoustic Gas Sensor Module App 20170212036 - Mueller; Thomas ;   et al. | 2017-07-27 |
Module and method of manufacturing a module Grant 9,691,687 - Kehrer , et al. June 27, 2 | 2017-06-27 |
Chip packages and methods for manufacturing a chip package Grant 9,666,452 - Mayer , et al. May 30, 2 | 2017-05-30 |
Chip arrangement and a method of manufacturing a chip arrangement Grant 9,653,405 - Theuss , et al. May 16, 2 | 2017-05-16 |
Sonic Sensors And Packages App 20170108583 - Elian; Klaus ;   et al. | 2017-04-20 |
Method of Forming a Protective Coating for a Packaged Semiconductor Device App 20170101308 - Elian; Klaus ;   et al. | 2017-04-13 |
Photoacoustic Gas Sensor Device And A Method For Analyzing Gas App 20170074834 - Dehe; Alfons ;   et al. | 2017-03-16 |
Apparatus comprising and a method for manufacturing an embedded MEMS device Grant 9,593,009 - Fuergut , et al. March 14, 2 | 2017-03-14 |
Apparatus and Method for In-Situ Calibration of a Photoacoustic Sensor App 20170067859 - KOLB; Stefan ;   et al. | 2017-03-09 |
Method Of Forming A Protective Coating For A Packaged Semiconductor Device App 20170057815 - Elian; Klaus ;   et al. | 2017-03-02 |
Semiconductor devices and methods for manufacturing semiconductor devices Grant 9,576,872 - Mueller , et al. February 21, 2 | 2017-02-21 |
Micromechanical semiconductor sensing device Grant 9,567,211 - Kalz , et al. February 14, 2 | 2017-02-14 |
Semiconductor device for emitting frequency-adjusted infrared light Grant 9,570,659 - Dehe , et al. February 14, 2 | 2017-02-14 |
Method of forming a protective coating for a packaged semiconductor device Grant 9,561,953 - Elian , et al. February 7, 2 | 2017-02-07 |
Sonic sensors and packages Grant 9,557,417 - Elian , et al. January 31, 2 | 2017-01-31 |
Current sensor device Grant 9,553,208 - Beer , et al. January 24, 2 | 2017-01-24 |
Insulated die App 20170011982 - THEUSS; Horst ;   et al. | 2017-01-12 |
Micromechanical Semiconductor Sensing Device App 20170003180 - Kalz; Franz-Peter ;   et al. | 2017-01-05 |
Method for making a sensor device using a graphene layer Grant 9,536,953 - Elian , et al. January 3, 2 | 2017-01-03 |
Electronic device with large back volume for electromechanical transducer Grant 9,521,499 - Theuss December 13, 2 | 2016-12-13 |
Photoacoustic gas sensor device and a method for analyzing gas Grant 9,513,261 - Dehe , et al. December 6, 2 | 2016-12-06 |
Implantable Device And Implantable System Comprising The Same App 20160317095 - Berger; Jan ;   et al. | 2016-11-03 |
Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector Units App 20160313288 - Theuss; Horst ;   et al. | 2016-10-27 |
Gas Sensor App 20160282259 - Kolb; Stefan ;   et al. | 2016-09-29 |
Molded Semiconductor Package Having Enhanced Local Adhesion Characteristics App 20160282212 - Beer; Sebastian ;   et al. | 2016-09-29 |
Sensor arrangement Grant 9,448,130 - Vaupel , et al. September 20, 2 | 2016-09-20 |
Sensor apparatus and method for producing a sensor apparatus Grant 9,446,944 - Ernst , et al. September 20, 2 | 2016-09-20 |
Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals Grant 9,432,759 - Elian , et al. August 30, 2 | 2016-08-30 |
Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals App 20160241953 - Elian; Klaus ;   et al. | 2016-08-18 |
Implantable Vessel Fluid Sensor App 20160220125 - Karlovsky; Kamil ;   et al. | 2016-08-04 |
Semiconductor component of semiconductor chip size with flip-chip-like external contacts Grant 9,385,008 - Kiendl , et al. July 5, 2 | 2016-07-05 |
Sensor package Grant 9,379,033 - Wombacher , et al. June 28, 2 | 2016-06-28 |
Microphone Module and Method of Manufacturing Thereof App 20160167947 - Hoegerl; Juergen ;   et al. | 2016-06-16 |
Pressure Sensor Module Having A Sensor Chip And Passive Devices Within A Housing App 20160169763 - Vaupel; Mathias ;   et al. | 2016-06-16 |
Pressure sensor package with integrated sealing Grant 9,366,593 - Vaupel , et al. June 14, 2 | 2016-06-14 |
Lead frame based MEMS sensor structure Grant 9,346,667 - Ghahremani , et al. May 24, 2 | 2016-05-24 |
Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals Grant 9,332,330 - Elian , et al. May 3, 2 | 2016-05-03 |
Chip-packaging module for a chip and a method for forming a chip-packaging module Grant 9,324,586 - Theuss April 26, 2 | 2016-04-26 |
Sonic Sensors And Packages App 20160103219 - Elian; Klaus ;   et al. | 2016-04-14 |
Chip package including a microphone structure and a method of manufacturing the same Grant 9,290,379 - Theuss March 22, 2 | 2016-03-22 |
Semiconductor Component Comprising Magnetic Field Sensor App 20160064451 - THEUSS; Horst ;   et al. | 2016-03-03 |
Low Profile Transducer Module App 20160043664 - Theuss; Horst ;   et al. | 2016-02-11 |
Sonic sensors and packages Grant 9,239,386 - Elian , et al. January 19, 2 | 2016-01-19 |
Magnetic Sensor Device With Ring-shaped Magnet App 20150355291 - Elian; Klaus ;   et al. | 2015-12-10 |
Sensor module and battery elements Grant 9,209,497 - Elian , et al. December 8, 2 | 2015-12-08 |
Lead Frame Based Mems Sensor Structure App 20150344294 - Ghahremani; Cyrus ;   et al. | 2015-12-03 |
Molded chip package and method of manufacturing the same App 20150340307 - GABLER; Franz ;   et al. | 2015-11-26 |
Sensor module Grant 9,177,879 - Theuss , et al. November 3, 2 | 2015-11-03 |
Sensor Apparatus And Method For Producing A Sensor Apparatus App 20150307344 - ERNST; Georg ;   et al. | 2015-10-29 |
Apparatus having a back-bias magnet and a semiconductor chip element Grant 9,164,156 - Elian , et al. October 20, 2 | 2015-10-20 |
Method for Making a Sensor Device Using a Graphene Layer App 20150287788 - Elian; Klaus ;   et al. | 2015-10-08 |
Method of Packaging a Semiconductor Chip Using a 3D Printing Process and Semiconductor Package Having Angled Surfaces App 20150249043 - Elian; Klaus ;   et al. | 2015-09-03 |
Sensor package and method of manufacturing thereof Grant 9,121,885 - Elian , et al. September 1, 2 | 2015-09-01 |
Electronic array and chip package Grant 9,111,772 - Strutz , et al. August 18, 2 | 2015-08-18 |
Sensor Arrangement, Battery Cell And Energy System App 20150226810 - Elian; Klaus ;   et al. | 2015-08-13 |
Micromechanical Semiconductor Sensing Device App 20150217994 - Kalz; Franz-Peter ;   et al. | 2015-08-06 |
Electronic Array And Chip Package App 20150214297 - Strutz; Volker ;   et al. | 2015-07-30 |
Microelectromechanical accelerometer with wireless transmission capabilities Grant 9,075,078 - Theuss July 7, 2 | 2015-07-07 |
Semiconductor component comprising magnetic field sensor Grant 9,076,717 - Theuss , et al. July 7, 2 | 2015-07-07 |
Method for making a sensor device using a graphene layer Grant 9,070,615 - Elian , et al. June 30, 2 | 2015-06-30 |
Semiconductor Devices and Methods for Manufacturing Semiconductor Devices App 20150170987 - Mueller; Thomas ;   et al. | 2015-06-18 |
Sensor Arrangement, Energy System And Method App 20150132614 - Elian; Klaus ;   et al. | 2015-05-14 |
Micromechanical semiconductor sensing device Grant 9,021,887 - Kalz , et al. May 5, 2 | 2015-05-05 |
Pressure sensor package having a stacked die arrangement Grant 9,013,013 - Beer , et al. April 21, 2 | 2015-04-21 |
Chip package and a method of manufacturing the same Grant 9,013,014 - Winkler , et al. April 21, 2 | 2015-04-21 |
Semiconductor Device For Emitting Frequency-adjusted Infrared Light App 20150102372 - Dehe; Alfons ;   et al. | 2015-04-16 |
Photoacoustic Gas Sensor Device And A Method For Analyzing Gas App 20150101395 - Dehe; Alfons ;   et al. | 2015-04-16 |
Pressure Sensor Package with Integrated Sealing App 20150090042 - Vaupel; Mathias ;   et al. | 2015-04-02 |
Transducer arrangement comprising a transducer die and method of covering a transducer die App 20150090030 - THEUSS; Horst | 2015-04-02 |
Microelectromechanical system Grant 8,991,253 - Theuss March 31, 2 | 2015-03-31 |
Current Sensor Device App 20150076636 - Beer; Gottfried ;   et al. | 2015-03-19 |
Sensor arrangement App 20150059454 - VAUPEL; Mathias ;   et al. | 2015-03-05 |
MEMS Device App 20150061045 - Fuergut; Edward ;   et al. | 2015-03-05 |
Semiconductor package and method for fabricating the same Grant 8,952,489 - Elian , et al. February 10, 2 | 2015-02-10 |
Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device App 20150028436 - Fuergut; Edward ;   et al. | 2015-01-29 |
Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals App 20150023523 - Elian; Klaus ;   et al. | 2015-01-22 |
Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals App 20150024807 - Elian; Klaus ;   et al. | 2015-01-22 |
Weight Detection By Tire Pressure Sensing App 20150019165 - Theuss; Horst ;   et al. | 2015-01-15 |
Apparatus For Determining A State Of A Rechargeable Battery Or Of A Battery, A Rechargeable Battery Or A Battery, And A Method For Determining A State Of A Rechargeable Battery Or Of A Battery App 20150004451 - Elian; Klaus ;   et al. | 2015-01-01 |
Electronic device with large back volume for electromechanical transducer App 20150003659 - THEUSS; Horst | 2015-01-01 |
Pre-mold for a microphone assembly and method of producing the same App 20150001646 - MUELLER; Thomas ;   et al. | 2015-01-01 |
Semiconductor device with hollow structure Grant 8,912,638 - Theuss , et al. December 16, 2 | 2014-12-16 |
Semiconductor device Grant 8,900,715 - Theuss December 2, 2 | 2014-12-02 |
Embedded chip package, a chip package, and a method for manufacturing an embedded chip package Grant 8,901,739 - Fuergut , et al. December 2, 2 | 2014-12-02 |
Chip Package And A Method Of Manufacturing The Same App 20140332912 - Theuss; Horst | 2014-11-13 |
Chip Package And A Method Of Manufacturing The Same App 20140319627 - Winkler; Bernhard ;   et al. | 2014-10-30 |
Apparatus comprising and a method for manufacturing an embedded MEMS device Grant 8,872,288 - Fuergut , et al. October 28, 2 | 2014-10-28 |
Method for producing a component and device comprising a component Grant 8,872,314 - Theuss , et al. October 28, 2 | 2014-10-28 |
Microphone Module and Method of Manufacturing Thereof App 20140312439 - Hoegerl; Juergen ;   et al. | 2014-10-23 |
Energy harvester Grant 8,841,785 - Theuss , et al. September 23, 2 | 2014-09-23 |
Method for Making a Sensor Device Using a Graphene Layer App 20140264255 - Elian; Klaus ;   et al. | 2014-09-18 |
Chip Arrangement And A Method Of Manufacturing A Chip Arrangement App 20140231971 - Theuss; Horst ;   et al. | 2014-08-21 |
Module and Method of Manufacturing a Module App 20140231974 - Kehrer; Daniel ;   et al. | 2014-08-21 |
Chip package comprising a microphone structure and a method of manufacturing the same Grant 8,809,973 - Theuss August 19, 2 | 2014-08-19 |
Chip Package Comprising A Microphone Structure And A Method Of Manufacturing The Same App 20140203380 - Theuss; Horst | 2014-07-24 |
Chip Arrangement And A Method For Manufacturing The Same App 20140205128 - Spoettl; Thomas ;   et al. | 2014-07-24 |
Sensor Package App 20140197503 - Wombacher; Ralf ;   et al. | 2014-07-17 |
Module including a micro-electro-mechanical microphone Grant 8,767,983 - Theuss , et al. July 1, 2 | 2014-07-01 |
Method for making a sensor device using a graphene layer Grant 8,759,153 - Elian , et al. June 24, 2 | 2014-06-24 |
Sensor Module and Battery Elements App 20140170446 - Elian; Klaus ;   et al. | 2014-06-19 |
Module and method of manufacturing a module Grant 8,749,056 - Kehrer , et al. June 10, 2 | 2014-06-10 |
Embedded Chip Package, A Chip Package, And A Method For Manufacturing An Embedded Chip Package App 20140151701 - Fuergut; Edward ;   et al. | 2014-06-05 |
Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement Grant 8,729,697 - Theuss , et al. May 20, 2 | 2014-05-20 |
Semiconductor package Grant 8,722,462 - Elian , et al. May 13, 2 | 2014-05-13 |
Mems Sensor Package Systems And Methods App 20140103463 - Winkler; Bernhard ;   et al. | 2014-04-17 |
Semiconductor Package and Method for Fabricating the Same App 20140097514 - Elian; Klaus ;   et al. | 2014-04-10 |
Sensor package Grant 8,674,462 - Wombacher , et al. March 18, 2 | 2014-03-18 |
Low Stress Component Package App 20140071642 - THEUSS; Horst | 2014-03-13 |
Device and method for manufacturing a device Grant 8,669,143 - Theuss March 11, 2 | 2014-03-11 |
Sensor device and method Grant 8,652,866 - Elian , et al. February 18, 2 | 2014-02-18 |
Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device App 20140042565 - Fuergut; Edward ;   et al. | 2014-02-13 |
Pressure sensor package systems and methods Grant 8,618,620 - Winkler , et al. December 31, 2 | 2013-12-31 |
Active and adaptive tire systems Grant 8,616,049 - Jongsma , et al. December 31, 2 | 2013-12-31 |
Chip Packages And Methods For Manufacturing A Chip Package App 20130313719 - MAYER; Karl Adolf Dieter ;   et al. | 2013-11-28 |
Chip assembly Grant 8,580,612 - Theuss , et al. November 12, 2 | 2013-11-12 |
Chip Embedded Packages And Methods For Forming A Chip Embedded Package App 20130292852 - FUERGUT; Edward ;   et al. | 2013-11-07 |
Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module Grant 8,569,109 - Mengel , et al. October 29, 2 | 2013-10-29 |
Method For Producing A Component And Device Comprising A Component App 20130277864 - Theuss; Horst ;   et al. | 2013-10-24 |
Sensor module and method for manufacturing a sensor module Grant 8,559,139 - Theuss October 15, 2 | 2013-10-15 |
3-D Integrated Circuits and Methods of Forming Thereof App 20130260510 - Theuss; Horst | 2013-10-03 |
Method of manufacturing a semiconductor device Grant 8,535,983 - Hin , et al. September 17, 2 | 2013-09-17 |
Semiconductor Packages and Methods of Formation Thereof App 20130234330 - Theuss; Horst | 2013-09-12 |
Semiconductor package with integrated inductor Grant 8,513,771 - Elian , et al. August 20, 2 | 2013-08-20 |
Sensor Device and Method App 20130187201 - Elian; Klaus ;   et al. | 2013-07-25 |
Sensor Arrangement, A Measurement Circuit, Chip-packages And A Method For Forming A Sensor Arrangement App 20130175527 - Theuss; Horst ;   et al. | 2013-07-11 |
Method for producing a component and device having a component Grant 8,482,135 - Theuss , et al. July 9, 2 | 2013-07-09 |
Micromechanical Semiconductor Sensing Device App 20130152696 - Kalz; Franz-Peter ;   et al. | 2013-06-20 |
Sensor Device And Method App 20130122660 - Elian; Klaus ;   et al. | 2013-05-16 |
Semiconductor device Grant 8,426,251 - Theuss April 23, 2 | 2013-04-23 |
Device and Method for Manufacturing a Device App 20130095609 - Theuss; Horst | 2013-04-18 |
Sonic Sensors And Packages App 20130088941 - Elian; Klaus ;   et al. | 2013-04-11 |
Apparatus Having A Back-bias Magnet And A Semiconductor Chip Element App 20130082340 - Elian; Klaus ;   et al. | 2013-04-04 |
Semiconductor device including single circuit element for soldering Grant 8,399,995 - Scharf , et al. March 19, 2 | 2013-03-19 |
Sensor Device and Method App 20130056703 - Elian; Klaus ;   et al. | 2013-03-07 |
Chip-packaging Module For A Chip And A Method For Forming A Chip-packaging Module App 20130043575 - Theuss; Horst | 2013-02-21 |
Sensor device having a structure element Grant 8,373,240 - Elian , et al. February 12, 2 | 2013-02-12 |
Semiconductor device including a magnetic sensor chip Grant 8,362,579 - Theuss , et al. January 29, 2 | 2013-01-29 |
Device and method for manufacturing a device Grant 8,350,381 - Theuss January 8, 2 | 2013-01-08 |
Method For Attaching A Metal Surface To A Carrier, A Method For Attaching A Chip To A Chip Carrier, A Chip-packaging Module And A Packaging Module App 20130001803 - Mengel; Manfred ;   et al. | 2013-01-03 |
Method of Manufacturing a Semiconductor Device App 20120309130 - Hin; Tze Yang ;   et al. | 2012-12-06 |
Semiconductor device Grant 8,323,996 - Koller , et al. December 4, 2 | 2012-12-04 |
Module and Method of Manufacturing a Module App 20120299170 - Kehrer; Daniel ;   et al. | 2012-11-29 |
Active And Adaptive Tire Systems App 20120285230 - Jongsma; Jakob ;   et al. | 2012-11-15 |
Semiconductor Device and Method of Making a Semiconductor Device App 20120273935 - Martens; Stefan ;   et al. | 2012-11-01 |
Semiconductor device including a magnetic sensor chip Grant 8,253,210 - Theuss , et al. August 28, 2 | 2012-08-28 |
Active and adaptive tire systems Grant 8,234,918 - Jongsma , et al. August 7, 2 | 2012-08-07 |
Microelectromechanical semiconductor component with cavity structure and method for producing the same Grant 8,212,344 - Beer , et al. July 3, 2 | 2012-07-03 |
Sensor Module App 20120162948 - Theuss; Horst ;   et al. | 2012-06-28 |
Semiconductor package Grant 8,207,018 - Theuss , et al. June 26, 2 | 2012-06-26 |
Sensor Device And Method App 20120126344 - Elian; Klaus ;   et al. | 2012-05-24 |
Panel, semiconductor device and method for the production thereof Grant 8,164,173 - Koller , et al. April 24, 2 | 2012-04-24 |
Microelectromechanical Sensor App 20120073371 - Theuss; Horst | 2012-03-29 |
Microelectromechanical System App 20120073372 - Theuss; Horst | 2012-03-29 |
Sensor module Grant 8,130,506 - Theuss , et al. March 6, 2 | 2012-03-06 |
Sensor device having a porous structure element Grant 8,124,953 - Elian , et al. February 28, 2 | 2012-02-28 |
Sensor Package and Method of Manufacturing Thereof App 20120038352 - Elian; Klaus ;   et al. | 2012-02-16 |
Magnetic sensor integrated circuit device and method Grant 8,106,654 - Theuss , et al. January 31, 2 | 2012-01-31 |
Pressure Sensor Package Systems And Methods App 20120012949 - Winkler; Bernhard ;   et al. | 2012-01-19 |
Fluidic electrostatic energy harvester Grant 8,098,476 - Loehndorf , et al. January 17, 2 | 2012-01-17 |
Sensor module with mold encapsulation for applying a bias magnetic field Grant 8,080,993 - Theuss , et al. December 20, 2 | 2011-12-20 |
Semiconductor Package with Integrated Inductor App 20110298088 - Elian; Klaus ;   et al. | 2011-12-08 |
Semiconductor Package App 20110241190 - Elian; Klaus ;   et al. | 2011-10-06 |
Device and Method for Manufacturing a Device App 20110241197 - Theuss; Horst | 2011-10-06 |
Semiconductor device and method Grant 8,017,942 - Mariani , et al. September 13, 2 | 2011-09-13 |
Semiconductor Device With Hollow Structure App 20110210450 - Theuss; Horst ;   et al. | 2011-09-01 |
Semiconductor Device App 20110163440 - Theuss; Horst | 2011-07-07 |
Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts App 20110147930 - Kiendl; Helmut ;   et al. | 2011-06-23 |
Gmr Sensor Within Molded Magnetic Material Employing Non-magnetic Spacer App 20110127998 - Elian; Klaus ;   et al. | 2011-06-02 |
Semiconductor device with hollow structure Grant 7,952,185 - Theuss , et al. May 31, 2 | 2011-05-31 |
Semiconductor device having through contacts through a plastic housing composition and method for the production thereof Grant 7,944,061 - Bauer , et al. May 17, 2 | 2011-05-17 |
Semiconductor component of semiconductor chip size with flip-chip-like external contacts Grant 7,932,599 - Kiendl , et al. April 26, 2 | 2011-04-26 |
Semiconductor Package App 20110027942 - Theuss; Horst ;   et al. | 2011-02-03 |
Microelectromechanical Semiconductor Component With Cavity Structure And Method For Producing The Same App 20110012214 - Beer; Gottfried ;   et al. | 2011-01-20 |
Fluidic based variable capacitor for use in a fluidic electrostatic energy harvester Grant 7,872,851 - Lohndorf , et al. January 18, 2 | 2011-01-18 |
Fluidic Electrostatic Energy Harvester App 20110001493 - Lohndorf; Markus ;   et al. | 2011-01-06 |
Semiconductor chip module Grant 7,851,829 - Theuss December 14, 2 | 2010-12-14 |
Wafer level packaged MEMS integrated circuit Grant 7,851,925 - Theuss , et al. December 14, 2 | 2010-12-14 |
Electrical device and method Grant 7,847,387 - Kilger , et al. December 7, 2 | 2010-12-07 |
Active And Adaptive Tire Systems App 20100300191 - JONGSMA; Jakob ;   et al. | 2010-12-02 |
Semiconductor Device App 20100295140 - Theuss; Horst ;   et al. | 2010-11-25 |
Electrical device with covering Grant 7,836,764 - Theuss , et al. November 23, 2 | 2010-11-23 |
Semiconductor component and apparatus for production of a semiconductor component Grant 7,838,989 - Dangelmaier , et al. November 23, 2 | 2010-11-23 |
Semiconductor package Grant 7,830,022 - Theuss , et al. November 9, 2 | 2010-11-09 |
Semiconductor Device App 20100276769 - Theuss; Horst ;   et al. | 2010-11-04 |
Panel, Semiconductor Device and Method for the Production Thereof App 20100264523 - Koller; Adolf ;   et al. | 2010-10-21 |
Active and adaptive tire systems Grant 7,814,781 - Jongsma , et al. October 19, 2 | 2010-10-19 |
Microelectromechanical semiconductor component with cavity structure and method for producing the same Grant 7,807,506 - Beer , et al. October 5, 2 | 2010-10-05 |
Singulating semiconductor wafers to form semiconductor chips Grant 7,799,659 - Pressel , et al. September 21, 2 | 2010-09-21 |
Sensor Device And Method App 20100230766 - Elian; Klaus ;   et al. | 2010-09-16 |
Semiconductor Device App 20100221854 - Koller; Adolf ;   et al. | 2010-09-02 |
Component with chip through-contacts Grant 7,786,577 - Dangelmaier , et al. August 31, 2 | 2010-08-31 |
Curing layers of a semiconductor product using electromagnetic fields Grant 7,781,876 - Theuss , et al. August 24, 2 | 2010-08-24 |
Sensor component and method for producing a sensor component Grant 7,775,115 - Theuss , et al. August 17, 2 | 2010-08-17 |
Chip Assembly App 20100203676 - Theuss; Horst ;   et al. | 2010-08-12 |
Panel, semiconductor device and method for the production thereof Grant 7,772,693 - Koller , et al. August 10, 2 | 2010-08-10 |
Semiconductor Device Including Single Circuit Element App 20100181687 - Scharf; Thorsten ;   et al. | 2010-07-22 |
Method of forming a sensor node module Grant 7,759,135 - Theuss July 20, 2 | 2010-07-20 |
Module comprising polymer-containing electrical connecting element Grant 7,745,916 - Theuss June 29, 2 | 2010-06-29 |
Semiconductor sensor device with sensor chip and method for producing the same Grant 7,732,915 - Dangelmaier , et al. June 8, 2 | 2010-06-08 |
Semiconductor Device And Method App 20100127355 - Mariani; Franco ;   et al. | 2010-05-27 |
Semiconductor device with surface-mountable external contacts and method for manufacturing the same Grant 7,719,101 - Dangelmaier , et al. May 18, 2 | 2010-05-18 |
Sensor Node Module App 20100078832 - Theuss; Horst | 2010-04-01 |
Wafer Level Packaged Mems Integrated Circuit App 20100072626 - Theuss; Horst ;   et al. | 2010-03-25 |
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device Grant 7,659,618 - Dangelmaier , et al. February 9, 2 | 2010-02-09 |
Sensor Module App 20090313817 - Theuss; Horst ;   et al. | 2009-12-24 |
Semiconductor Device App 20090309191 - Theuss; Horst | 2009-12-17 |
Magnetic Sensor Integrated Circuit Device And Method App 20090295381 - Theuss; Horst ;   et al. | 2009-12-03 |
Energy Harvester App 20090256361 - Theuss; Horst ;   et al. | 2009-10-15 |
Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips Grant 7,598,126 - Theuss October 6, 2 | 2009-10-06 |
Sensor Module With Mold Encapsulation For Applying A Bias Magnetic Field App 20090243595 - Theuss; Horst ;   et al. | 2009-10-01 |
Active And Adaptive Tire Systems App 20090229358 - JONGSMA; Jakob ;   et al. | 2009-09-17 |
Electronic Device For Harvesting Energy App 20090212645 - Theuss; Horst | 2009-08-27 |
Method of manufacturing an integrated circuit Grant 7,579,268 - Theuss August 25, 2 | 2009-08-25 |
Semiconductor component with connecting elements and method for producing the same Grant 7,569,427 - Theuss August 4, 2 | 2009-08-04 |
Semiconductor component and method for production of a semiconductor component Grant 7,566,585 - Theuss July 28, 2 | 2009-07-28 |
Module comprising a semiconductor chip comprising a movable element Grant 7,557,417 - Theuss , et al. July 7, 2 | 2009-07-07 |
Sensor Module And Method For Manufacturing A Sensor Module App 20090153138 - Theuss; Horst | 2009-06-18 |
Electrical Device And Method App 20090127638 - Kilger; Thomas ;   et al. | 2009-05-21 |
Semiconductor Package App 20090102054 - Theuss; Horst ;   et al. | 2009-04-23 |
Chip Inductor App 20090085704 - Theuss; Horst | 2009-04-02 |
Fluidic Electrostatic Energy Harvester App 20090080138 - Lohndorf; Markus ;   et al. | 2009-03-26 |
Semiconductor Device App 20090057885 - Theuss; Horst | 2009-03-05 |
Sensor Package App 20090026560 - Wombacher; Ralf ;   et al. | 2009-01-29 |
Optocoupler for converting optical signals into electrical signals and vice versa Grant 7,476,036 - Auburger , et al. January 13, 2 | 2009-01-13 |
Tire deformation detection Grant 7,472,587 - Loehndorf , et al. January 6, 2 | 2009-01-06 |
Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof App 20080315399 - Bauer; Michael ;   et al. | 2008-12-25 |
Semiconductor device with micro connecting elements and method for producing the same Grant 7,468,560 - Guengerich , et al. December 23, 2 | 2008-12-23 |
Module Including A Micro-electro-mechanical Microphone App 20080298621 - Theuss; Horst ;   et al. | 2008-12-04 |
Sensor module and method of manufacturing same Grant 7,445,959 - Theuss November 4, 2 | 2008-11-04 |
Curing Layers Of A Semiconductor Product Using Electromagnetic Fields App 20080251904 - Theuss; Horst ;   et al. | 2008-10-16 |
Electrical device with covering App 20080236278 - Theuss; Horst ;   et al. | 2008-10-02 |
Sensor Component And Method For Producing A Sensor Component App 20080227235 - Theuss; Horst ;   et al. | 2008-09-18 |
Module comprising a semiconductor chip comprising a movable element App 20080197485 - Theuss; Horst ;   et al. | 2008-08-21 |
Panel, semiconductor device and method for the production thereof App 20080191359 - Koller; Adolf ;   et al. | 2008-08-14 |
Semiconductor Chip Module App 20080185673 - Theuss; Horst | 2008-08-07 |
Semiconductor module App 20080164598 - Theuss; Horst | 2008-07-10 |
Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component Grant 7,397,111 - Jerebic , et al. July 8, 2 | 2008-07-08 |
Semiconductor Component Comprising Magnetic Field Sensor App 20080135959 - Theuss; Horst ;   et al. | 2008-06-12 |
Semiconductor device with hollow structure App 20080136009 - Theuss; Horst ;   et al. | 2008-06-12 |
Integrated magnetic sensor component Grant 7,385,394 - Auburger , et al. June 10, 2 | 2008-06-10 |
Sensor Module And Method Of Manufacturing Same App 20080128838 - Theuss; Horst | 2008-06-05 |
Module comprising polymer-containing electrical connecting element App 20080122051 - Theuss; Horst | 2008-05-29 |
Method for producing a component and device having a component App 20080036099 - Theuss; Horst ;   et al. | 2008-02-14 |
Electronic component with a housing package Grant 7,319,598 - Steiner , et al. January 15, 2 | 2008-01-15 |
Singulating Semiconductor Wafers To Form Semiconductor Chips App 20070293020 - Pressel; Klaus ;   et al. | 2007-12-20 |
Method of Manufacturing an Integrated Circuit App 20070287225 - Theuss; Horst | 2007-12-13 |
Semiconductor Component With Connecting Elements And Method For Producing The Same App 20070273046 - Theuss; Horst | 2007-11-29 |
Optocoupler for Converting Optical Signals into Electrical Signals and Vice Versa App 20070217734 - Auburger; Albert ;   et al. | 2007-09-20 |
Electronic device with cavity and a method for producing the same Grant 7,268,436 - Aigner , et al. September 11, 2 | 2007-09-11 |
Microelectromechanical semiconductor component with cavity structure and method for producing the same App 20070181979 - Beer; Gottfried ;   et al. | 2007-08-09 |
Semiconductor Device with Surface-Mountable External Contacts and Method for Manufacturing the Same App 20070170577 - Dangelmaier; Jochen ;   et al. | 2007-07-26 |
Semiconductor component and apparatus for production of a semiconductor component App 20070158860 - Dangelmaier; Jochen ;   et al. | 2007-07-12 |
Integrated magnetic sensor component App 20070145972 - Auburger; Albert ;   et al. | 2007-06-28 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier Grant 7,221,048 - Daeche , et al. May 22, 2 | 2007-05-22 |
Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts App 20070090535 - Kiendl; Helmut ;   et al. | 2007-04-26 |
Semiconductor Component And Method For Production Of A Semiconductor Component App 20070092992 - Theuss; Horst | 2007-04-26 |
Semiconductor sensor device with sensor chip and method for producing the same App 20070069354 - Dangelmaier; Jochen ;   et al. | 2007-03-29 |
Micro-optical module with housing and method for producing the same Grant 7,189,009 - Dangelmaier , et al. March 13, 2 | 2007-03-13 |
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