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Patent applications and USPTO patent grants for Thermal Solution Resources, LLC.The latest application filed is for "in mold electronic printed circuit board encapsulation and assembly".
Patent | Date |
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In mold electronic printed circuit board encapsulation and assembly Grant 11,112,103 - Davis , et al. September 7, 2 | 2021-09-07 |
In Mold Electronic Printed Circuit Board Encapsulation And Assembly App 20190093874 - Davis; Terry G. ;   et al. | 2019-03-28 |
In mold electronic printed circuit board encapsulation and assembly Grant 10,156,352 - Davis , et al. Dec | 2018-12-18 |
LED lamps with enhanced wireless communication Grant 9,603,226 - Sagal , et al. March 21, 2 | 2017-03-21 |
LED Lamps with Enhanced Wireless Communication App 20160255705 - Sagal; E. Mikhail ;   et al. | 2016-09-01 |
LED lamps with enhanced wireless communication Grant 9,332,621 - Sagal , et al. May 3, 2 | 2016-05-03 |
In Mold Electronic Printed Circuit Board Encapsulation And Assembly App 20160084490 - DAVIS; Terry G. ;   et al. | 2016-03-24 |
LED Lamps with Enhanced Wireless Communication App 20140292194 - Sagal; E. Mikhail ;   et al. | 2014-10-02 |
Overmolded LED light assembly and method of manufacture Grant 8,827,508 - Sagal September 9, 2 | 2014-09-09 |
Thermally Conductive Thermoplastic Compositions App 20120319031 - Li; Xiangyang ;   et al. | 2012-12-20 |
Overmolded LED Light Assembly and Method of Manufacture App 20110095690 - Sagal; E. Mikhail | 2011-04-28 |
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