Thermagon, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Thermagon, Inc..The latest application filed is for "thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink".

Company Profile

0.6.5

Thermagon, Inc. - Cleveland OH
THERMAGON INC. -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink Grant 7,369,411 - Hill , et al. May 6, 2	2008-05-06
Heat spreading thermal interface structure Grant 7,078,109 - Hill , et al. July 18, 2	2006-07-18
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink App 20050073816 - Hill, Richard ; et al.	2005-04-07
Heat spreading thermal interface structure App 20050045372 - Hill, Richard F. ; et al.	2005-03-03
Heat sink and heat spreader assembly Grant 6,849,941 - Hill , et al. February 1, 2	2005-02-01
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink Grant 6,761,928 - Hill , et al. July 13, 2	2004-07-13
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink Grant 6,617,517 - Hill , et al. September 9, 2	2003-09-09
Thermal interface structure for placement between a microelectronic component package and heat sink App 20030007329 - Hill, Richard F.	2003-01-09
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink App 20020154485 - Hill, Richard F. ; et al.	2002-10-24
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink App 20020148635 - Hill, Richard F. ; et al.	2002-10-17
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink Grant 6,372,997 - Hill , et al. April 16, 2	2002-04-16

Company Registrations

CAGE Code

0ZNK1

THERMAGON, INC. .

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