loadpatents
name:-0.26583313941956
name:-0.65480899810791
name:-0.074562072753906
THEIL; Jeremy Alfred Patent Filings

THEIL; Jeremy Alfred

Patent Applications and Registrations

Patent applications and USPTO patent grants for THEIL; Jeremy Alfred.The latest application filed is for "low temperature bonded structures".

Company Profile
9.7.14
  • THEIL; Jeremy Alfred - Mountain View CA
  • Theil; Jeremy Alfred - MountainView CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Low Temperature Bonded Structures
App 20220165692 - UZOH; Cyprian Emeka ;   et al.
2022-05-26
Low temperature bonded structures
Grant 11,244,916 - Uzoh , et al. February 8, 2
2022-02-08
Molded Direct Bonded And Interconnected Stack
App 20220020729 - GAO; Guilian ;   et al.
2022-01-20
Interconnect Structures
App 20220013456 - Uzoh; Cyprian Emeka ;   et al.
2022-01-13
Interconnect structures
Grant 11,158,573 - Uzoh , et al. October 26, 2
2021-10-26
Molded direct bonded and interconnected stack
Grant 11,158,606 - Gao , et al. October 26, 2
2021-10-26
Bonding Surfaces For Microelectronics
App 20210287910 - Theil; Jeremy Alfred
2021-09-16
Bonding surfaces for microelectronics
Grant 11,056,348 - Theil July 6, 2
2021-07-06
Chemical Mechanical Polishing For Hybrid Bonding
App 20210066233 - Fountain, JR.; Gaius Gillman ;   et al.
2021-03-04
Low Temperature Bonded Structures
App 20200381389 - UZOH; Cyprian Emeka ;   et al.
2020-12-03
Chemical mechanical polishing for hybrid bonding
Grant 10,840,205 - Fountain, Jr. , et al. November 17, 2
2020-11-17
Low temperature bonded structures
Grant 10,790,262 - Uzoh , et al. September 29, 2
2020-09-29
Interconnect Structures
App 20200126906 - UZOH; Cyprian Emeka ;   et al.
2020-04-23
Low Temperature Bonded Structures
App 20200051937 - UZOH; Cyprian Emeka ;   et al.
2020-02-13
Molded Direct Bonded And Interconnected Stack
App 20200013754 - GAO; Guilian ;   et al.
2020-01-09
Low Temperature Bonded Structures
App 20190319007 - UZOH; Cyprian Emeka ;   et al.
2019-10-17
Bonding Surfaces For Microelectronics
App 20190311911 - THEIL; Jeremy Alfred
2019-10-10
Chemical Mechanical Polishing For Hybrid Bonding
App 20190096842 - FOUNTAIN, JR.; Gaius Gillman ;   et al.
2019-03-28
Scented material dispense system for a hand-held device
Grant 7,152,758 - Fazzio , et al. December 26, 2
2006-12-26
Solid-state spectrophotomer
App 20060138312 - Butterworth; Mark Melvin ;   et al.
2006-06-29
Scented material dispense system for a hand-held device
App 20060037970 - Fazzio; Ronald Shane ;   et al.
2006-02-23

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed