Patent | Date |
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High temperature electrostatic chuck bonding adhesive Grant 11,264,261 - Sun , et al. March 1, 2 | 2022-03-01 |
Method of processing a substrate support assembly Grant 10,557,202 - Boyd, Jr. , et al. Feb | 2020-02-11 |
Real time monitoring with closed loop chucking force control Grant 10,460,916 - Boyd, Jr. , et al. Oc | 2019-10-29 |
Pixilated cooling, temperature controlled substrate support assembly Grant 10,403,534 - Parkhe , et al. Sep | 2019-09-03 |
Real Time Monitoring With Closed Loop Chucking Force Control App 20180330926 - BOYD, JR.; Wendell Glenn ;   et al. | 2018-11-15 |
Electrostatic chuck with external flow adjustments for improved temperature distribution Grant 10,121,688 - Busche , et al. November 6, 2 | 2018-11-06 |
Substrate Support Assembly Having A Plasma Resistant Protective Layer App 20180151401 - Sun; Jennifer Y. ;   et al. | 2018-05-31 |
Substrate support assembly having a plasma resistant protective layer Grant 9,916,998 - Sun , et al. March 13, 2 | 2018-03-13 |
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods Grant 9,875,923 - Boyd, Jr. , et al. January 23, 2 | 2018-01-23 |
Electrostatic Chuck With External Flow Adjustments For Improved Temperature Distribution App 20170213754 - Busche; Matthew J. ;   et al. | 2017-07-27 |
Method Of Processing A Substrate Support Assembly App 20170167018 - BOYD, JR.; Wendell Glen ;   et al. | 2017-06-15 |
Control Systems Employing Deflection Sensors To Control Clamping Forces Applied By Electrostatic Chucks, And Related Methods App 20170103911 - BOYD, JR.; Wendell ;   et al. | 2017-04-13 |
Electrostatic chuck with external flow adjustments for improved temperature distribution Grant 9,622,375 - Busche , et al. April 11, 2 | 2017-04-11 |
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods Grant 9,558,981 - Boyd, Jr. , et al. January 31, 2 | 2017-01-31 |
High temperature electrostatic chuck bonding adhesive Grant 9,520,314 - Sun , et al. December 13, 2 | 2016-12-13 |
Electrostatic chuck with internal flow adjustments for improved temperature distribution Grant 9,520,315 - Parkhe , et al. December 13, 2 | 2016-12-13 |
Electrostatic Chuck With External Flow Adjustments For Improved Temperature Distribution App 20150187625 - Busche; Matthew J. ;   et al. | 2015-07-02 |
Electrostatic Chuck With Internal Flow Adjustments For Improved Temperature Distribution App 20150187626 - Parkhe; Vijay D. ;   et al. | 2015-07-02 |
Pixilated Cooling, Temperature Controlled Substrate Support Assembly App 20150129165 - PARKHE; Vijay D. ;   et al. | 2015-05-14 |
Single-body electrostatic chuck Grant 8,941,969 - Thach , et al. January 27, 2 | 2015-01-27 |
Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber Grant 8,871,312 - Sun , et al. October 28, 2 | 2014-10-28 |
Single-body Electrostatic Chuck App 20140177123 - Thach; Senh ;   et al. | 2014-06-26 |
Method of producing a plasma-resistant thermal oxide coating Grant 8,758,858 - Sun , et al. June 24, 2 | 2014-06-24 |
Substrate Support Assembly Having A Plasma Resistant Protective Layer App 20140154465 - Sun; Jennifer Y. ;   et al. | 2014-06-05 |
High Temperature Electrostatic Chuck With Real-time Heat Zone Regulating Capability App 20130284374 - LUBOMIRSKY; Dmitry ;   et al. | 2013-10-31 |
Plasma-resistant ceramics with controlled electrical resistivity Grant 8,367,227 - Sun , et al. February 5, 2 | 2013-02-05 |
Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber App 20130022838 - Sun; Jennifer Y. ;   et al. | 2013-01-24 |
Wet clean process for recovery of anodized chamber parts Grant 8,231,736 - Sun , et al. July 31, 2 | 2012-07-31 |
Plasma resistant coatings for plasma chamber components Grant 8,206,829 - Sun , et al. June 26, 2 | 2012-06-26 |
Method of producing a plasma-resistant thermal oxide coating App 20120125488 - Sun; Jennifer Y. ;   et al. | 2012-05-24 |
Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating Grant 8,129,029 - Sun , et al. March 6, 2 | 2012-03-06 |
Clean, dense yttrium oxide coating protecting semiconductor processing apparatus Grant 8,067,067 - Sun , et al. November 29, 2 | 2011-11-29 |
Gas Distribution Showerhead With Coating Material For Semiconductor Processing App 20110198034 - Sun; Jennifer ;   et al. | 2011-08-18 |
High Temperature Electrostatic Chuck Bonding Adhesive App 20100156054 - Sun; Jennifer Y. ;   et al. | 2010-06-24 |
Filled Polymer Composition For Etch Chamber Component App 20100140222 - Sun; Jennifer Y. ;   et al. | 2010-06-10 |
Self-passivating plasma resistant material for joining chamber components Grant 7,718,029 - Sun , et al. May 18, 2 | 2010-05-18 |
Plasma Resistant Coatings For Plasma Chamber Components App 20100119843 - SUN; JENNIFER Y. ;   et al. | 2010-05-13 |
Ceramic coating comprising yttrium which is resistant to a reducing plasma App 20090214825 - Sun; Jennifer Y. ;   et al. | 2009-08-27 |
Erosion resistant yttrium comprising metal with oxidized coating for plasma chamber components App 20090162647 - Sun; Jennifer Y. ;   et al. | 2009-06-25 |
Corrosion-resistant gas distribution plate for plasma processing chamber App 20090087615 - Sun; Jennifer Y. ;   et al. | 2009-04-02 |
Wet Clean Process For Recovery Of Anodized Chamber Parts App 20090056745 - SUN; JENNIFER Y. ;   et al. | 2009-03-05 |
Plasma-resistant ceramics with controlled electrical resistivity App 20090036292 - Sun; Jennifer Y. ;   et al. | 2009-02-05 |
Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate Grant 7,479,304 - Sun , et al. January 20, 2 | 2009-01-20 |
Low temperature aerosol deposition of a plasma resistive layer Grant 7,479,464 - Sun , et al. January 20, 2 | 2009-01-20 |
Method of coating semiconductor processing apparatus with protective yttrium-containing coatings App 20080213496 - Sun; Jennifer Y. ;   et al. | 2008-09-04 |
Low Temperature Aerosol Deposition Of A Plasma Resistive Layer App 20080108225 - SUN; JENNIFER Y. ;   et al. | 2008-05-08 |
Self-passivating Plasma Resistant Material For Joining Chamber Components App 20080029211 - SUN; JENNIFER Y. ;   et al. | 2008-02-07 |
Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination Grant 7,220,937 - Hofman , et al. May 22, 2 | 2007-05-22 |
Semiconductor processing apparatus including plasma-resistant, welded aluminum structures Grant 7,055,732 - Thach , et al. June 6, 2 | 2006-06-06 |
Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus Grant 7,048,814 - Lin , et al. May 23, 2 | 2006-05-23 |
Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus Grant 7,033,447 - Lin , et al. April 25, 2 | 2006-04-25 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Grant 6,949,203 - Hsieh , et al. September 27, 2 | 2005-09-27 |
Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate App 20050056218 - Sun, Jennifer Y. ;   et al. | 2005-03-17 |
Clean, dense yttrium oxide coating protecting semiconductor processing apparatus App 20050037193 - Sun, Jennifer Y. ;   et al. | 2005-02-17 |
Process kit for erosion resistance enhancement App 20050016684 - Sun, Jennifer Y. ;   et al. | 2005-01-27 |
Electrochemically roughened aluminum semiconductor chamber surfaces App 20040224171 - Sun, Jennifer Y. ;   et al. | 2004-11-11 |
Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber Grant 6,795,292 - Grimard , et al. September 21, 2 | 2004-09-21 |
Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers Grant 6,776,873 - Sun , et al. August 17, 2 | 2004-08-17 |
Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination App 20040149699 - Hofman, Daniel J. ;   et al. | 2004-08-05 |
High temperature electrical connector Grant 6,736,668 - Kholodenko , et al. May 18, 2 | 2004-05-18 |
Actively-controlled electrostatic chuck heater App 20040081439 - Kholodenko, Arnold ;   et al. | 2004-04-29 |
Semiconductor processing apparatus including plasma-resistant, welded aluminum structures App 20040041004 - Thach, Senh ;   et al. | 2004-03-04 |
Plasma-resistant, welded aluminum structures for use in semiconductor apparatus Grant 6,659,331 - Thach , et al. December 9, 2 | 2003-12-09 |
Halogen-resistant, anodized aluminium for use in semiconductor processing apparatus App 20030205479 - Lin, Yixing ;   et al. | 2003-11-06 |
Plasma processing chamber having magnetic assembly and method App 20030192646 - Wu, Robert W. ;   et al. | 2003-10-16 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene App 20030164354 - Hsieh, Chang-Lin ;   et al. | 2003-09-04 |
Plasma-resistant, welded aluminum structures for use in semiconductor apparatus App 20030160085 - Thach, Senh ;   et al. | 2003-08-28 |
Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus App 20030150530 - Lin, Yixing ;   et al. | 2003-08-14 |
Electrochemically roughened aluminum semiconductor processing apparatus surfaces App 20030047464 - Sun, Jennifer Y. ;   et al. | 2003-03-13 |
Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber App 20020171994 - Grimard, Dennis ;   et al. | 2002-11-21 |
Method and apparatus for thermal control of a semiconductor substrate Grant 6,466,426 - Mok , et al. October 15, 2 | 2002-10-15 |
Connectors For An Eletrostatic Chuck App 20020022403 - CHENG, WING L. ;   et al. | 2002-02-21 |
Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas App 20010024349 - Shamoulian, Shamouil ;   et al. | 2001-09-27 |
Connectors for an electrostatic chuck and combination thereof Grant 6,151,203 - Shamouilian , et al. November 21, 2 | 2000-11-21 |