Tetreault; Real
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tetreault; Real.The latest application filed is for "transfer molding of integrated circuit packages".
- Tetreault; Real - Granby CA
| Patent | Date |
|---|---|
| Transfer molding of integrated circuit packages Grant 6,988,882 - Boyaud , et al. January 24, 2 | 2006-01-24 |
| Transfer molding of integrated circuit packages App 20050275091 - Boyaud, Marie-France ; et al. | 2005-12-15 |
| Transfer molding of integrated circuit packages Grant 6,956,296 - Boyaud , et al. October 18, 2 | 2005-10-18 |
| Assembly of opto-electronic module with improved heat sink Grant 6,822,875 - Chan , et al. November 23, 2 | 2004-11-23 |
| Transfer holding of integrated circuit packages App 20040071805 - Boyaud, Marie-France ; et al. | 2004-04-15 |
| Transfer molding of integrated circuit packages Grant 6,656,773 - Boyaud , et al. December 2, 2 | 2003-12-02 |
| Assembly of opto-electronic module with improved heat sink App 20030059176 - Chan, Benson ; et al. | 2003-03-27 |
| Assembly of opto-electronic module with improved heat sink Grant 6,508,595 - Chan , et al. January 21, 2 | 2003-01-21 |
| Transfer molding of integrated circuit packages App 20020192876 - Boyaud, Marie-France ; et al. | 2002-12-19 |
| Transfer molding method for forming integrated circuit package Grant 6,309,575 - Boutin , et al. October 30, 2 | 2001-10-30 |
| Integrated circuit chip package Grant 5,939,778 - Boutin , et al. August 17, 1 | 1999-08-17 |
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