loadpatents
name:-0.051422119140625
name:-0.0033338069915771
name:-0.00043892860412598
TESSERA RESEARCH LLC Patent Filings

TESSERA RESEARCH LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for TESSERA RESEARCH LLC.The latest application filed is for "high io substrates and interposers without vias".

Company Profile
0.2.52
  • TESSERA RESEARCH LLC - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
High Io Substrates And Interposers Without Vias
App 20130068516 - Mohammed; Ilyas		2013-03-21
Semiconductor Chip Package Assembly And Method For Making Same
App 20120313238 - Sato; Hiroaki ;   et al.		2012-12-13
Semiconductor Chip Package Assembly And Method For Making Same
App 20120286416 - Sato; Hiroaki ;   et al.		2012-11-15
Three-dimensional System-in-a-package
App 20120273933 - Oganesian; Vage ;   et al.		2012-11-01
Interposer Having Molded Low Cte Dielectric
App 20120267751 - Haba; Belgacem ;   et al.		2012-10-25
Multi-chip Module With Stacked Face-down Connected Dies
App 20120267777 - Haba; Belgacem ;   et al.		2012-10-25
Reinforced Fan-out Wafer-level Package
App 20120268899 - Haba; Belgacem ;   et al.		2012-10-25
Vias In Porous Substrates
App 20120267789 - Mohammed; Ilyas ;   et al.		2012-10-25
Bsi Image Sensor Package With Variable Light Transmission For Even Reception Of Different Wavelengths
App 20120199924 - Oganesian; Vage ;   et al.		2012-08-09
High Density Three-dimensional Integrated Capacitors
App 20120181658 - Mohammed; Ilyas ;   et al.		2012-07-19
Dual Wafer Spin Coating
App 20120152433 - Oganesian; Vage ;   et al.		2012-06-21
Void-free Wafer Bonding Using Channels
App 20120153426 - Oganesian; Vage ;   et al.		2012-06-21
Simultaneous Wafer Bonding And Interconnect Joining
App 20120153488 - Oganesian; Vage ;   et al.		2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts
App 20120155049 - Haba; Belgacem ;   et al.		2012-06-21
Compliant Interconnects In Wafers
App 20120146210 - Oganesian; Vage ;   et al.		2012-06-14
Interconnect Structure
App 20120145442 - Gupta; Debabrata ;   et al.		2012-06-14
High Density Three-dimensional Integrated Capacitors
App 20120146182 - Oganesian; Vage ;   et al.		2012-06-14
Pin Attachment
App 20120146206 - Haba; Belgacem ;   et al.		2012-06-14
Stacked Microelectronic Assembly Having Interposer Connecting Active Chips
App 20120139094 - Haba; Belgacem ;   et al.		2012-06-07
Stacked Microelectronic Assembly With Tsvs Formed In Stages With Plural Active Chips
App 20120139124 - Oganesian; Vage ;   et al.		2012-06-07
Stacked Microelectronic Assemby With Tsvs Formed In Stages And Carrier Above Chip
App 20120139082 - Oganesian; Vage ;   et al.		2012-06-07
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Vias Connected To The Central Contacts
App 20120126389 - Desai; Kishor ;   et al.		2012-05-24
Conductive Pads Defined By Embedded Traces
App 20120119367 - Haba; Belgacem		2012-05-17
No Flow Underfill
App 20120104595 - Haba; Belgacem ;   et al.		2012-05-03
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics
App 20120092832 - Haba; Belgacem ;   et al.		2012-04-19
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl
App 20120068338 - Haba; Belgacem ;   et al.		2012-03-22
Stacked Chip Assembly Having Vertical Vias
App 20120068352 - Oganesian; Vage ;   et al.		2012-03-22
Tsop With Impedance Control
App 20120068317 - Haba; Belgacem ;   et al.		2012-03-22
Multi-function And Shielded 3d Interconnects
App 20120068327 - Oganesian; Vage ;   et al.		2012-03-22
Stacked Multi-die Packages With Impedance Control
App 20120068361 - Haba; Belgacem		2012-03-22
Staged Via Formation From Both Sides Of Chip
App 20120068330 - Oganesian; Vage ;   et al.		2012-03-22
Metal Can Impedance Control Structure
App 20120068365 - Haba; Belgacem ;   et al.		2012-03-22
Chip Assembly Having Via Interconnects Joined By Plating
App 20120068351 - Oganesian; Vage ;   et al.		2012-03-22
Microelectronic Packages With Nanoparticle Joining
App 20120025365 - Haba; Belgacem		2012-02-02
Microelectronic Elements With Rear Contacts Connected With Via First Or Via Middle Structures
App 20120018863 - Oganesian; Vage ;   et al.		2012-01-26
Methods Of Forming Semiconductor Elements Using Micro-abrasive Particle Stream
App 20120018893 - Oganesian; Vage ;   et al.		2012-01-26
Microelectronic Elements Having Metallic Pads Overlying Vias
App 20120018868 - Oganesian; Vage ;   et al.		2012-01-26
Non-lithographic Formation Of Three-dimensional Conductive Elements
App 20120018894 - Oganesian; Vage ;   et al.		2012-01-26
Active Chip On Carrier Or Laminated Chip Having Microelectronic Element Embedded Therein
App 20120018895 - Oganesian; Vage ;   et al.		2012-01-26
Microelectronic Elements With Post-assembly Planarization
App 20120020026 - Oganesian; Vage ;   et al.		2012-01-26
Stackable Molded Microelectronic Packages
App 20120013000 - Haba; Belgacem		2012-01-19
Stackable Molded Microelectronic Packages With Area Array Unit Connectors
App 20120013001 - Haba; Belgacem		2012-01-19
Microelectronic Packages With Dual Or Multiple-etched Flip-chip Connectors
App 20120007232 - Haba; Belgacem		2012-01-12
Microelectronic Assembly With Joined Bond Elements Having Lowered Inductance
App 20110285020 - Haba; Belgacem ;   et al.		2011-11-24
Microelectronic assembly with joined bond elements having lowered inductance
Grant 8,008,785 - Haba , et al. August 30, 2		2011-08-30
Microelectronic Assembly With Bond Elements Having Lowered Inductance
App 20110147928 - Haba; Belgacem ;   et al.		2011-06-23
Microelectronic Assembly With Joined Bond Elements Having Lowered Inductance
App 20110147953 - Haba; Belgacem ;   et al.		2011-06-23
Microelectronic Assembly With Impedance Controlled Wirebond And Conductive Reference Element
App 20110101535 - Haba; Belgacem ;   et al.		2011-05-05
Microelectronic Assembly With Impedance Controlled Wirebond And Conductive Reference Element
App 20110095408 - Haba; Belgacem ;   et al.		2011-04-28
Microelectronic assembly with impedance controlled wirebond and conductive reference element
Grant 7,923,851 - Haba , et al. April 12, 2		2011-04-12
Curable Resins And Articles Made Therefrom
App 20100314591 - Roitman; Daniel ;   et al.		2010-12-16
Microelectronic Assembly With Impedance Controlled Wirebond And Reference Wirebond
App 20100232128 - Haba; Belgacem ;   et al.		2010-09-16
Microelectronic Assembly With Impedance Controlled Wirebond And Conductive Reference Element
App 20100230828 - Haba; Belgacem ;   et al.		2010-09-16
Wafer level edge stacking
App 20090316378 - Haba; Belgacem ;   et al.		2009-12-24

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