Tessera Interconnect Materials, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tessera Interconnect Materials, Inc..The latest application filed is for "microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer".

Company Profile

0.9.17

Tessera Interconnect Materials, Inc. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic Substrate Or Element Having Conductive Pads And Metal Posts Joined Thereto Using Bond Layer App 20130186944 - Haba; Belgacem ; et al.	2013-07-25
Interconnection Element For Electric Circuits App 20130119012 - Endo; Kimitaka	2013-05-16
Bump structure formed from using removable mandrel Grant 8,119,516 - Endo February 21, 2	2012-02-21
Method for manufacturing multilayer wiring board Grant 8,112,881 - Shimizu , et al. February 14, 2	2012-02-14
Structure And Method Of Making Interconnect Element, And Multilayer Wiring Board Including The Interconnect Element App 20110252637 - Endo; Kimitaka ; et al.	2011-10-20
Structure and method of making interconnect element, and multilayer wiring board including the interconnect element Grant 7,923,828 - Endo , et al. April 12, 2	2011-04-12
Structure And Method Of Making Interconnect Element Having Metal Traces Embedded In Surface Of Dielectric App 20110057324 - Kotake; Hideki ; et al.	2011-03-10
Methods of making microelectronic assemblies Grant 7,721,422 - Iijima , et al. May 25, 2	2010-05-25
Chip Capacitor Embedded Pwb App 20100071944 - Endo; Kimitaka	2010-03-25
Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer App 20100044860 - Haba; Belgacem ; et al.	2010-02-25
Interconnection element for electric circuits App 20090188706 - Endo; Kimitaka	2009-07-30
Manufacturing method for wiring circuit substrate Grant 7,546,681 - Iijima , et al. June 16, 2	2009-06-16
Process for forming a bump structure and bump structure App 20090121351 - Endo; Kimitaka	2009-05-14
Multilayer wiring board for an electronic device Grant 7,505,281 - Iijima , et al. March 17, 2	2009-03-17
Multilayer wiring board for an electronic device App 20080296254 - Iijima; Tomoo ; et al.	2008-12-04
Member for Interconnecting Wiring Films and Method for Producing the Same App 20080264678 - lijima; Tomoo ; et al.	2008-10-30
Structure and method of making interconnect element having metal traces embedded in surface of dielectric App 20080169568 - Kotake; Hideki ; et al.	2008-07-17
Structure and method of making interconnect element having metal traces embedded in surface of dielectric App 20080136041 - Kotake; Hideki ; et al.	2008-06-12
Method of manufacturing a multi-layer wiring board using a metal member having a rough surface App 20080128288 - Hashimoto; Yukio ; et al.	2008-06-05
Multilayer wiring board for an electronic device Grant 7,342,802 - Iijima , et al. March 11, 2	2008-03-11
Apparatus and method for distributing a liquid onto a surface of an item App 20070221329 - Sakuma; Kazuo ; et al.	2007-09-27
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate Grant 7,238,603 - Iijima , et al. July 3, 2	2007-07-03
Multilayer wiring board for an electronic device App 20070121305 - Iijima; Tomoo ; et al.	2007-05-31
Manufacturing method for wiring circuit substrate App 20060258139 - Iijima; Tomoo ; et al.	2006-11-16
Manufacturing method for wiring circuit substrate Grant 7,096,578 - Iijima , et al. August 29, 2	2006-08-29

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