Teshima; Yasuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Teshima; Yasuhiro.The latest application filed is for "working machine and positional deviation data acquisition method".
- Teshima; Yasuhiro - Toyota JP
- TESHIMA; Yasuhiro - Toyota-shi JP
- Teshima; Yasuhiro - Kawasaki JP
- Teshima, Yasuhiro - Kanagawa JP
- Teshima; Yasuhiro - Oyama JP
| Patent | Date |
|---|---|
| Working machine and positional deviation data acquisition method Grant 9,778,647 - Teshima , et al. October 3, 2 | 2017-10-03 |
| Working Machine And Positional Deviation Data Acquisition Method App 20150355626 - TESHIMA; Yasuhiro | 2015-12-10 |
| Integrated circuit component and mounting method thereof Grant 7,375,429 - Teshima , et al. May 20, 2 | 2008-05-20 |
| Integrated circuit component and mounting method thereof App 20060108607 - Teshima; Yasuhiro ; et al. | 2006-05-25 |
| SFP module mounting structure Grant 7,044,763 - Inoue , et al. May 16, 2 | 2006-05-16 |
| BWB transmission wiring design system Grant 6,883,157 - Matsumoto , et al. April 19, 2 | 2005-04-19 |
| Method of surface mounting a connector and connector Grant 6,655,990 - Terauchi , et al. December 2, 2 | 2003-12-02 |
| BWB transmission wiring design system App 20030217349 - Matsumoto, Hideaki ; et al. | 2003-11-20 |
| Press-fit Pin Connection Checking Method And System App 20020104683 - Teshima, Yasuhiro ; et al. | 2002-08-08 |
| Method of surface mounting a connector and connector App 20020076979 - Terauchi, Hideaki ; et al. | 2002-06-20 |
| Method of surface mounting a connector Grant 6,081,998 - Terauchi , et al. July 4, 2 | 2000-07-04 |
| Wiring board and semiconductor device Grant 6,038,135 - Higashiguchi , et al. March 14, 2 | 2000-03-14 |
| Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device Grant 5,828,128 - Higashiguchi , et al. October 27, 1 | 1998-10-27 |
| Wiring substrate and semiconductor device Grant 5,783,865 - Higashiguchi , et al. July 21, 1 | 1998-07-21 |
| Semiconductor device and semiconductor device mounting board Grant 5,760,469 - Higashiguchi , et al. June 2, 1 | 1998-06-02 |
| Mask for printing solder paste Grant 5,593,080 - Teshima , et al. January 14, 1 | 1997-01-14 |
| Heating furnace in combination with electronic circuit modules Grant 5,413,164 - Teshima , et al. May 9, 1 | 1995-05-09 |
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