Terunuma; Ichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Terunuma; Ichiro.The latest application filed is for "crimp terminal".

Company Profile

0.7.8

Terunuma; Ichiro - Tokyo JP
Terunuma; Ichiro - Yachiyo JP
Terunuma, Ichiro - Yachiyo-shi JP
Terunuma, Ichiro - Sakura-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Crimp terminal Grant 10,128,581 - Seshimo , et al. November 13, 2	2018-11-13
Crimp Terminal App 20170141488 - SESHIMO; Yuya ; et al.	2017-05-18
Method of manufacturing a rigid printed wiring board Grant 8,091,218 - Momota , et al. January 10, 2	2012-01-10
Bending-Type Rigid Printed Wiring Board and Process for Producing the Same App 20100294544 - Momota; Atsushi ; et al.	2010-11-25
Junction box and connector Grant 7,001,187 - Terunuma , et al. February 21, 2	2006-02-21
Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof Grant 6,921,869 - Terunuma , et al. July 26, 2	2005-07-26
Junction box, connector, and connecting terminal for use in the box and connector Grant 6,905,346 - Momota , et al. June 14, 2	2005-06-14
Junction box and connector App 20050054222 - Terunuma, Ichiro ; et al.	2005-03-10
Junction box and connector Grant 6,736,648 - Terunuma , et al. May 18, 2	2004-05-18
Junction box Grant 6,707,689 - Momota , et al. March 16, 2	2004-03-16
Junction box App 20030076650 - Momota, Atsushi ; et al.	2003-04-24
Junction box and connector App 20030077926 - Terunuma, Ichiro ; et al.	2003-04-24
Junction box, connector, and connecting terminal for use in the box and connector App 20030077927 - Momota, Atsushi ; et al.	2003-04-24
Interlayer connection structure of multilayer wiring board, method of manufacturing flexible printed circuit board and method of forming land thereof App 20030056978 - Terunuma, Ichiro ; et al.	2003-03-27
Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween App 20010015347 - Terunuma, Ichiro ; et al.	2001-08-23

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