Terui; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Terui; Makoto.The latest application filed is for "liquid ejection head substrate and method for producing liquid ejection head substrate".

Company Profile

6.71.79

Terui; Makoto - Yokohama JP
Terui; Makoto - Yokohama-shi JP
Terui; Makoto - Ogaki JP
Terui; Makoto - Ogaki-shi JP
Terui; Makoto - Yamanashi N/A JP
Terui; Makoto - Tokyo JP
Terui; Makoto - Kanagawa JP
Terui; Makoto - Jamannshi JP
Terui; Makoto - Yamana JP
Terui; Makoto - Yamanachi JP
Terui, Makoto - Yamana shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printing apparatus, liquid absorbing apparatus, control method Grant 10,471,750 - Hirokawa , et al. Nov	2019-11-12
Liquid Ejection Head Substrate And Method For Producing Liquid Ejection Head Substrate App 20190263124 - Takahashi; Kenji ; et al.	2019-08-29
Porous Body Belt, Method Of Producing The Same, And Ink Jet Recording Apparatus App 20190091992 - Yagyu; Mineto ; et al.	2019-03-28
Porous Body Belt, Method Of Producing The Same, And Ink Jet Recording Apparatus App 20190093266 - Yagyu; Mineto ; et al.	2019-03-28
Printing Apparatus And Printing Method Thereof App 20190009515 - Deguchi; Kyosuke ; et al.	2019-01-10
Printing Apparatus, Liquid Absorbing Apparatus, Control Method App 20190009589 - Hirokawa; Ryosuke ; et al.	2019-01-10
Wiring board with cavity for built-in electronic component and method for manufacturing the same Grant 9,832,878 - Shimizu , et al. November 28, 2	2017-11-28
Wiring board with built-in electronic component and method for manufacturing the same Grant 9,723,728 - Shimizu , et al. August 1, 2	2017-08-01
Printed wiring board, method for manufacturing the same and semiconductor device Grant 9,706,663 - Sakamoto , et al. July 11, 2	2017-07-11
Liquid discharge head and method for manufacturing the same Grant 9,623,655 - Uyama , et al. April 18, 2	2017-04-18
Wiring substrate and method for manufacturing the same Grant 9,613,893 - Terui , et al. April 4, 2	2017-04-04
Printed wiring board and method for manufacturing printed wiring board Grant 9,532,468 - Kunieda , et al. December 27, 2	2016-12-27
Wiring board and method for manufacturing the same Grant 9,431,347 - Kunieda , et al. August 30, 2	2016-08-30
Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board Grant 9,433,085 - Shizuno , et al. August 30, 2	2016-08-30
Wiring board and method for manufacturing the same Grant 9,425,159 - Terui , et al. August 23, 2	2016-08-23
Liquid-discharging head and method of producing the same Grant 9,393,781 - Terui , et al. July 19, 2	2016-07-19
Liquid Discharge Head And Method For Manufacturing The Same App 20160152027 - Uyama; Masaya ; et al.	2016-06-02
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160073515 - SHIMIZU; Keisuke ; et al.	2016-03-10
Printed Wiring Board, Method For Manufacturing The Same And Semiconductor Device App 20160066422 - Sakamoto; Hajime ; et al.	2016-03-03
Wiring Board With Cavity For Built-in Electronic Component And Method For Manufacturing The Same App 20160044789 - SHIMIZU; Keisuke ; et al.	2016-02-11
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160037647 - Shimizu; Keisuke ; et al.	2016-02-04
Wiring Substrate And Method For Manufacturing The Same App 20160020164 - TERUI; Makoto ; et al.	2016-01-21
Wiring Board And Method For Manufacturing The Same App 20150264817 - TERUI; Makoto ; et al.	2015-09-17
Liquid ejection head and method for manufacturing same Grant 9,102,150 - Higuchi , et al. August 11, 2	2015-08-11
Wiring board and method for manufacturing the same Grant 9,066,435 - Terui , et al. June 23, 2	2015-06-23
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20150136459 - KUNIEDA; Masatoshi ; et al.	2015-05-21
Combined Printed Wiring Board And Method For Manufacturing The Same App 20150060127 - Terui; Makoto ; et al.	2015-03-05
Combined Printed Wiring Board And Method For Manufacturing The Same App 20150060124 - TERUI; Makoto ; et al.	2015-03-05
Liquid Ejection Head And Method For Manufacturing Same App 20150022590 - Higuchi; Hiroshi ; et al.	2015-01-22
Wiring Board And Method For Manufacturing The Same App 20140360759 - Kunieda; Masatoshi ; et al.	2014-12-11
Wiring Board And Method For Manufacturing The Same App 20140360767 - TERUI; Makoto ; et al.	2014-12-11
Wiring Board And Method For Manufacturing The Same App 20140347837 - KARIYA; Takashi ; et al.	2014-11-27
Electronic Component, Method For Manufacturing The Same And Method For Manufacturing Multilayer Printed Wiring Board App 20140311780 - SHIZUNO; Yoshinori ; et al.	2014-10-23
Wiring Board And Method For Manufacturing The Same App 20140231990 - OUCHI; Shinji ; et al.	2014-08-21
Wiring board and method for manufacturing the same Grant 8,759,691 - Ouchi , et al. June 24, 2	2014-06-24
Wiring board and method for manufacturing the same Grant 8,755,196 - Ouchi , et al. June 17, 2	2014-06-17
Wiring Board And Method For Manufacturing The Same App 20140102768 - SHIZUNO; Yoshinori ; et al.	2014-04-17
Wiring Board And Method For Manufacturing The Same App 20130256000 - TERUI; Makoto ; et al.	2013-10-03
Wiring Board And Method For Manufacturing The Same App 20130258625 - Terui; Makoto ; et al.	2013-10-03
Semiconductor device manufacturing method Grant 8,409,930 - Terui , et al. April 2, 2	2013-04-02
Liquid ejection head and manufacturing method thereof Grant 8,205,967 - Uyama , et al. June 26, 2	2012-06-26
Wiring Board And Method For Manufacturing The Same App 20120008295 - OUCHI; Shinji ; et al.	2012-01-12
Wiring Board And Method For Manufacturing The Same App 20120006592 - Ouchi; Shinji ; et al.	2012-01-12
Method for manufacturing liquid discharge head Grant 8,092,700 - Terui January 10, 2	2012-01-10
Method for manufacturing a filter substrate, inkjet recording head, and method for manufacturing the inkjet recording head Grant 8,021,562 - Kato , et al. September 20, 2	2011-09-20
Semiconductor apparatus with decoupling capacitor Grant 8,018,055 - Terui , et al. September 13, 2	2011-09-13
Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams Grant 7,998,555 - Ushijima , et al. August 16, 2	2011-08-16
Semiconductor Device Manufacturing Method App 20110171779 - Terui; Makoto ; et al.	2011-07-14
Ink jet recording head including beams dividing supply ports Grant 7,934,810 - Hayakawa , et al. May 3, 2	2011-05-03
Semiconductor device and manufacturing method thereof Grant 7,932,597 - Terui , et al. April 26, 2	2011-04-26
Semiconductor device and manufacturing method thereof Grant 7,928,546 - Ohno , et al. April 19, 2	2011-04-19
Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device Grant 7,926,909 - Hayakawa , et al. April 19, 2	2011-04-19
Beam, Ink Jet Recording Head Having Beams, And Method For Manufacturing Ink Jet Recording Head Having Beams App 20110027530 - Ushijima; Takashi ; et al.	2011-02-03
Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams Grant 7,833,608 - Ushijima , et al. November 16, 2	2010-11-16
Semiconductor apparatus with decoupling capacitor App 20100207244 - Terui; Makoto ; et al.	2010-08-19
Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture Grant 7,753,495 - Hayakawa , et al. July 13, 2	2010-07-13
Semiconductor apparatus with decoupling capacitor Grant 7,714,434 - Terui , et al. May 11, 2	2010-05-11
Semiconductor device Grant 7,696,630 - Terui April 13, 2	2010-04-13
Method for fabricating a semiconductor device having a heat radiation layer Grant 7,696,009 - Terui , et al. April 13, 2	2010-04-13
Method of producing a semiconductor device having a magnetic layer formed thereon Grant 7,687,283 - Terui March 30, 2	2010-03-30
Semiconductor device and fabrication method thereof App 20100025710 - Yamada; Shigeru ; et al.	2010-02-04
Fabrication method for chip size package and non-chip size package semiconductor devices Grant 7,632,711 - Terui December 15, 2	2009-12-15
Liquid Ejection Head And Manufacturing Method Thereof App 20090212008 - Uyama; Masaya ; et al.	2009-08-27
Semiconductor Device Fabricating Method App 20090203171 - TAKEMASA; Kengo ; et al.	2009-08-13
Ink Jet Recording Head And Manufacture Method For The Same App 20090160913 - Hayakawa; Kazuhiro ; et al.	2009-06-25
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements Grant 7,545,036 - Terui , et al. June 9, 2	2009-06-09
Semiconductor apparatus with decoupling capacitor App 20090096063 - Terui; Makoto ; et al.	2009-04-16
Ink jet recording head having structural members in ink supply port Grant 7,517,058 - Hayakawa , et al. April 14, 2	2009-04-14
Semiconductor device and method for fabricating the same Grant 7,511,351 - Anzai , et al. March 31, 2	2009-03-31
Liquid-discharging Head And Method Of Producing The Same App 20090040266 - Terui; Makoto ; et al.	2009-02-12
Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof Grant 7,482,202 - Terui January 27, 2	2009-01-27
Manufacturing method of ink jet recording head and ink jet recording head manufactured by manufacturing method Grant 7,462,500 - Terui December 9, 2	2008-12-09
Semiconductor apparatus with decoupling capacitor Grant 7,459,765 - Terui , et al. December 2, 2	2008-12-02
Method of manufacturing substrate for ink jet recording head and method of manufacturing recording head using substrate manufactured by this method Grant 7,452,474 - Komuro , et al. November 18, 2	2008-11-18
Method For Manufacturing A Filter Substrate, Inkjet Recording Head, And Method For Manufacturing The Inkjet Recording Head App 20080277379 - Kato; Masataka ; et al.	2008-11-13
Method For Manufacturing Liqid Discharge Head App 20080245766 - Terui; Makoto	2008-10-09
Semiconductor Device And Manufacturing Method Thereof App 20080237846 - Terui; Makoto ; et al.	2008-10-02
Method for manufacturing a filter substrate, inkjet recording head, and method for manufacturing the inkjet recording head Grant 7,416,285 - Kato , et al. August 26, 2	2008-08-26
Ink-jet Recording Head, Method For Manufacturing Ink-jet Recording Head, And Semiconductor Device App 20080165222 - Hayakawa; Kazuhiro ; et al.	2008-07-10
Ink jet recording head and producing method therefor Grant 7,380,915 - Terui June 3, 2	2008-06-03
Semiconductor device App 20080099930 - Terui; Makoto	2008-05-01
Semiconductor Device Including A Plurality Of Circuit Element Chips And A Manufacturing Method Thereof App 20080090330 - TERUI; Makoto	2008-04-17
Semiconductor device and manufacturing method thereof App 20080054426 - Ohno; Morifumi ; et al.	2008-03-06
Beam, Ink Jet Recording Head Having Beams, And Method For Manufacturing Ink Jet Recording Head Having Beams App 20080032073 - USHIJIMA; TAKASHI ; et al.	2008-02-07
Substrate processing method and ink jet recording head substrate manufacturing method Grant 7,323,115 - Hayakawa , et al. January 29, 2	2008-01-29
Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof Grant 7,321,163 - Terui January 22, 2	2008-01-22
Semiconductor apparatus with decoupling capacitor App 20070296069 - Terui; Makoto ; et al.	2007-12-27
Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams Grant 7,275,813 - Ushijima , et al. October 2, 2	2007-10-02
Semiconductor chip package Grant 7,211,883 - Oka , et al. May 1, 2	2007-05-01
Semiconductor apparatus with decoupling capacitor Grant 7,173,335 - Terui , et al. February 6, 2	2007-02-06
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements App 20070021089 - Terui; Makoto ; et al.	2007-01-25
Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof App 20060246674 - Terui; Makoto	2006-11-02
Ink jet recording head and manufacture method for the same App 20060214995 - Hayakawa; Kazuhiro ; et al.	2006-09-28
Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof Grant 7,102,227 - Terui September 5, 2	2006-09-05
Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture App 20060191862 - Hayakawa; Kazuhiro ; et al.	2006-08-31
Semiconductor device App 20060157845 - Terui; Makoto	2006-07-20
Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing Grant 7,078,265 - Terui , et al. July 18, 2	2006-07-18
Semiconductor chip package Grant 7,075,177 - Oka , et al. July 11, 2	2006-07-11
Semiconductor package and method of fabricating same Grant 7,067,357 - Terui , et al. June 27, 2	2006-06-27
Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture Grant 7,063,799 - Hayakawa , et al. June 20, 2	2006-06-20
Ink jet recording head and producing method therefor App 20060098050 - Terui; Makoto	2006-05-11
Method for manufacturing a filter substrate, inkjet recording head, and method for manufacturing the inkjet recording head App 20060092246 - Kato; Masataka ; et al.	2006-05-04
Semiconductor device and method for fabricating the same Grant 7,026,699 - Anzai , et al. April 11, 2	2006-04-11
Semiconductor chip with passive element in a wiring region of the chip Grant 7,012,339 - Terui March 14, 2	2006-03-14
Semiconductor device and method of producing the same App 20060038245 - Terui; Makoto	2006-02-23
Semiconductor device and method for fabricating the same App 20050263847 - Anzai, Noritaka ; et al.	2005-12-01
Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof App 20050258547 - Terui, Makoto	2005-11-24
Method of manufacturing substrate for ink jet recording head and method of manufacturing recording head using substrate manufactured by this method App 20050248623 - Komuro, Hirokazu ; et al.	2005-11-10
Semiconductor device with improved design freedom of external terminal Grant 6,952,048 - Terui October 4, 2	2005-10-04
Semiconductor chip package App 20050212108 - Oka, Takahiro ; et al.	2005-09-29
Electronic part mounting substrate, electronic part, and semiconductor device Grant 6,936,769 - Noguchi , et al. August 30, 2	2005-08-30
Electronic Part Mounting Substrate, Electronic Part, And Semiconductor Device App 20050178574 - Noguchi, Takashi ; et al.	2005-08-18
Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams App 20050140737 - Ushijima, Takashi ; et al.	2005-06-30
Manufacturing method of ink jet recording head and ink jet recording head manufactured by manufacturing method App 20050140716 - Terui, Makoto	2005-06-30
Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof App 20050093142 - Terui, Makoto	2005-05-05
Liquid ejection print head Grant 6,869,168 - Terui March 22, 2	2005-03-22
Semiconductor apparatus with decoupling capacitor App 20050056924 - Terui, Makoto ; et al.	2005-03-17
Semiconductor device with improved design freedom of external terminal App 20050006760 - Terui, Makoto	2005-01-13
Resin-molded semiconductor device that includes at least one additional electronic part Grant 6,833,607 - Anzai , et al. December 21, 2	2004-12-21
Semiconductor package and method of fabricating same Grant 6,831,354 - Terui , et al. December 14, 2	2004-12-14
Substrate processing method and ink jet recording head substrate manufacturing method App 20040238485 - Hayakawa, Kazuhiro ; et al.	2004-12-02
Semiconductor device and method for fabricating the same App 20040238929 - Anzai, Noritaka ; et al.	2004-12-02
Semiconductor apparatus with decoupling capacitor Grant 6,806,564 - Terui , et al. October 19, 2	2004-10-19
Semiconductor package and method of fabricating same App 20040183175 - Terui, Makoto ; et al.	2004-09-23
Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture App 20040174407 - Hayakawa, Kazuhiro ; et al.	2004-09-09
Method for fabricating a semiconductor device having a heat radiation layer App 20040161908 - Terui, Makoto ; et al.	2004-08-19
Semiconductor device App 20040150104 - Terui, Makoto	2004-08-05
Semiconductor apparatus with decoupling capacitor App 20040145041 - Terui, Makoto ; et al.	2004-07-29
Semiconductor apparatus with decoupling capacitor Grant 6,707,146 - Terui , et al. March 16, 2	2004-03-16
Semiconductor device App 20030205808 - Terui, Makoto ; et al.	2003-11-06
Semiconductor device App 20030189251 - Terui, Makoto ; et al.	2003-10-09
Semiconductor apparatus with decoupling capacitor Grant 6,608,375 - Terui , et al. August 19, 2	2003-08-19
Resin-molded semiconductor device App 20030102543 - Anzai, Noritaka ; et al.	2003-06-05
Semiconductor device Grant 6,538,319 - Terui March 25, 2	2003-03-25
Semiconductor chip and semiconductor device having the chip Grant 6,534,879 - Terui March 18, 2	2003-03-18
Semiconductor package and method of fabricating same App 20030030133 - Terui, Makoto ; et al.	2003-02-13
Semiconductor apparatus with decoupling capacitor App 20020195705 - Terui, Makoto ; et al.	2002-12-26
Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus Grant 6,467,884 - Murooka , et al. October 22, 2	2002-10-22
Semiconductor apparatus with decoupling capacitor App 20020145180 - Terui, Makoto ; et al.	2002-10-10
Semiconductor chip package App 20020105067 - Oka, Takahiro ; et al.	2002-08-08
Liquid ejection print head App 20020097299 - Terui, Makoto	2002-07-25
Ink-jet head, ink-jet head substrate, and a method for making the head Grant 6,390,606 - Terui , et al. May 21, 2	2002-05-21
Semiconductor chip and semiconductor device having the chip App 20010017411 - Terui, Makoto	2001-08-30
Semiconductor device App 20010008301 - Terui, Makoto	2001-07-19
Semiconductor device Grant 6,225,694 - Terui May 1, 2	2001-05-01
Semiconductor device Grant 6,060,774 - Terui May 9, 2	2000-05-09