Terazaki; Hiroki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Terazaki; Hiroki.The latest application filed is for "abrasive, method of polishing target member and process for producing semiconductor device".

Company Profile

2.22.19

Terazaki; Hiroki - Tsukuba JP
- Ibaraki-ken JP
Terazaki; Hiroki - Ibaraki-ken N/A JP
TERAZAKI; Hiroki - Hitachi-shi JP
Terazaki; Hiroki - Hitachi JP
Terazaki; Hiroki - Ibaraki JP
Terazaki, Hiroki - Tsukuba-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 8,900,477 - Uchida , et al. December 2, 2	2014-12-02
Abrasive, method of polishing target member and process for producing semiconductor device Grant 08616936 -	2013-12-31
Abrasive, method of polishing target member and process for producing semiconductor device Grant 8,616,936 - Yoshida , et al. December 31, 2	2013-12-31
Abrasive liquid for metal and method for polishing Grant 8,491,807 - Uchida , et al. July 23, 2	2013-07-23
Abrasive, Method Of Polishing Target Member And Process For Producing Semiconductor Device App 20120227331 - YOSHIDA; Masato ; et al.	2012-09-13
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 8,226,849 - Uchida , et al. July 24, 2	2012-07-24
Abrasive, method of polishing target member and process for producing semiconductor device Grant 8,162,725 - Yoshida , et al. April 24, 2	2012-04-24
Abrasive, method of polishing target member and process for producing semiconductor device Grant 8,137,159 - Yoshida , et al. March 20, 2	2012-03-20
Abrasive Liquid For Metal and Method for Polishing App 20120048830 - Uchida; Takeshi ; et al.	2012-03-01
Abrasive, Method of Polishing Target Member and Process for Producing Semiconductor Device App 20110312251 - Yoshida; Masato ; et al.	2011-12-22
Abrasive liquid for metal and method for polishing Grant 8,038,898 - Uchida , et al. October 18, 2	2011-10-18
Abrasive, method of polishing target member and process for producing semiconductor device Grant 7,963,825 - Yoshida , et al. June 21, 2	2011-06-21
Abrasive, method of polishing target member and process for producing semiconductor device Grant 7,871,308 - Yoshida , et al. January 18, 2	2011-01-18
Cerium oxide abrasive and method of polishing substrates Grant 7,867,303 - Yoshida , et al. January 11, 2	2011-01-11
Polishing Slurry And Method Of Polishing App 20100301265 - KURATA; Yasushi ; et al.	2010-12-02
Polishing fluid and method of polishing Grant 7,799,688 - Kurata , et al. September 21, 2	2010-09-21
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 7,799,686 - Uchida , et al. September 21, 2	2010-09-21
Cerium oxide abrasive and method of polishing substrates Grant 7,708,788 - Yoshida , et al. May 4, 2	2010-05-04
Abrasive, Method Of Polishing Target Member And Process For Producing Semiconductor Device App 20080271383 - Yoshida; Masato ; et al.	2008-11-06
Materials For Polishing Liquid For Metal, Polishing Liquid For Metal, Method For Preparation Thereof And Polishing Method Using The Same App 20080121840 - Uchida; Takeshi ; et al.	2008-05-29
Abrasive, method of polishing target member and process for producing semiconductor device App 20070266642 - Yoshida; Masato ; et al.	2007-11-22
Metal-Polishing Liquid And Polishing Method Using The Same App 20070196975 - Nomura; Yutaka ; et al.	2007-08-23
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 7,250,369 - Uchida , et al. July 31, 2	2007-07-31
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same App 20070167017 - Uchida; Takeshi ; et al.	2007-07-19
Abrasive, method of polishing target member and process for producing semiconductor device Grant 7,115,021 - Yoshida , et al. October 3, 2	2006-10-03
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same App 20060216939 - Uchida; Takeshi ; et al.	2006-09-28
Cerium Oxide Abrasive And Method Of Polishing Substrates App 20060180787 - Yoshida; Masato ; et al.	2006-08-17
Cerium Oxide Abrasive And Method Of Polishing Substrates App 20060118524 - Yoshida; Masato ; et al.	2006-06-08
Polishing fluid and method of polishing App 20050173669 - Kurata, Yasushi ; et al.	2005-08-11
Abrasive liquid for metal and method for polishing Grant 6,899,821 - Uchida , et al. May 31, 2	2005-05-31
Abrasive liquid for metal and method for polishing App 20050095860 - Uchida, Takeshi ; et al.	2005-05-05
Cerium oxide abrasive and method of polishing substrates App 20050085168 - Yoshida, Masato ; et al.	2005-04-21
Cerium oxide abrasive and method of polishing substrates Grant 6,863,700 - Yoshida , et al. March 8, 2	2005-03-08
CMP (chemical mechanical polishing) polishing liquid for metal and polishing method App 20030219982 - Kurata, Yasushi ; et al.	2003-11-27
Abrasive, method of polishing target member and process for producing semiconductor device App 20020090895 - Yoshida, Masato ; et al.	2002-07-11
Cerium Oxide abrasive and method of polishing substrates App 20020069593 - Yoshida, Masato ; et al.	2002-06-13
Abrasive liquid for metal and method for polishing App 20020017630 - Uchida, Takeshi ; et al.	2002-02-14
Abrasive, method of polishing wafer, and method of producing semiconductor device Grant 6,343,976 - Yoshida , et al. February 5, 2	2002-02-05
Cerium oxide abrasive and method of polishing substrates Grant 6,221,118 - Yoshida , et al. April 24, 2	2001-04-24

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