Terayama; Yoshimi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Terayama; Yoshimi.The latest application filed is for "electrical connections using deforming compression".
- Terayama; Yoshimi - Odawara JP
| Patent | Date |
|---|---|
| Electrical connections using deforming compression Grant 6,015,081 - Okabayashi , et al. January 18, 2 | 2000-01-18 |
| Printed circuit board having an embedded capacitor Grant 5,973,929 - Arakawa , et al. October 26, 1 | 1999-10-26 |
| Printed circuit board Grant 5,912,597 - Inagawa , et al. June 15, 1 | 1999-06-15 |
| Electrical connecting member Grant 5,860,818 - Sakaki , et al. January 19, 1 | 1999-01-19 |
| Method for forming an electrical circuit member Grant 5,819,406 - Yoshizawa , et al. October 13, 1 | 1998-10-13 |
| Method of manufacturing electrical connecting member Grant 5,600,884 - Kondo , et al. February 11, 1 | 1997-02-11 |
| Process for preparing electrical connecting member Grant 5,379,515 - Kondo , et al. January 10, 1 | 1995-01-10 |
| Electric circuit apparatus Grant 5,283,468 - Kondo , et al. February 1, 1 | 1994-02-01 |
| Method of producing electrical connection members Grant 5,216,807 - Yoshizawa , et al. * June 8, 1 | 1993-06-08 |
| Process for preparing electrical connecting member Grant 5,145,552 - Yoshizawa , et al. September 8, 1 | 1992-09-08 |
| Process for preparing electrical connecting member Grant 5,135,606 - Kato , et al. August 4, 1 | 1992-08-04 |
| Method of producing electrical connection members Grant 4,926,549 - Yoshizawa , et al. May 22, 1 | 1990-05-22 |
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