Terauchi; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Terauchi; Hideaki.The latest application filed is for "method of removing integrated circuit chip package and detachment jig therefor".

Company Profile

0.6.6

Terauchi; Hideaki - Kawasaki JP
Terauchi, Hideaki - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of removing integrated circuit chip package and detachment jig therefor Grant 7,469,457 - Ishikawa , et al. December 30, 2	2008-12-30
Method of removing integrated circuit chip package and detachment jig therefor App 20060107513 - Ishikawa; Tetsuji ; et al.	2006-05-25
Optical module and fiber sheet Grant 6,996,301 - Arima , et al. February 7, 2	2006-02-07
Fiber sheet and manufacturing method therefor Grant 6,968,097 - Arima , et al. November 22, 2	2005-11-22
Optical fiber splicer and optical fiber splicing method Grant 6,890,109 - Arima , et al. May 10, 2	2005-05-10
Method and apparatus for processing edge surfaces of optical fibers, and method and apparatus for fusion splicing optical fibers App 20050041939 - Saito, Shigeru ; et al.	2005-02-24
Optical Fiber Splicer And Optical Fiber Splicing Method App 20040264892 - Arima, Tadao ; et al.	2004-12-30
Optical module and fiber sheet App 20040042754 - Arima, Tadao ; et al.	2004-03-04
Fiber sheet and manufacturing method therefor App 20040033005 - Arima, Tadao ; et al.	2004-02-19
Method of surface mounting a connector and connector Grant 6,655,990 - Terauchi , et al. December 2, 2	2003-12-02
Method of surface mounting a connector and connector App 20020076979 - Terauchi, Hideaki ; et al.	2002-06-20
Method of surface mounting a connector Grant 6,081,998 - Terauchi , et al. July 4, 2	2000-07-04

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