Teraoka; Yasuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Teraoka; Yasuhiro.The latest application filed is for "tape automated bonding packaged semiconductor device incorporating a heat sink".
- Teraoka; Yasuhiro - Itami JP
| Patent | Date |
|---|---|
| Tape automated bonding packaged semiconductor device incorporating a heat sink Grant 5,157,478 - Ueda , et al. October 20, 1 | 1992-10-20 |
| Carrier tape including molten resin flow path element for resin packaged semiconductor devices Grant 5,064,706 - Ueda , et al. November 12, 1 | 1991-11-12 |
| Package structure for semiconductor device Grant 4,839,713 - Teraoka , et al. June 13, 1 | 1989-06-13 |
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