TERAKI; Shin
Patent Applications and Registrations
Patent applications and USPTO patent grants for TERAKI; Shin.The latest application filed is for "resin composition for film, film, film with base material, metal/resin laminate body, resin cured product, semiconductor device,".
- TERAKI; Shin - Niigata JP
- Teraki; Shin - Niigata-ken JP
- Teraki; Shin - Niigata-shi JP
| Patent | Date |
|---|---|
| Resin Composition For Film, Film, Film With Base Material, Metal/resin Laminate Body, Resin Cured Product, Semiconductor Device, App 20190160785 - KOMATSU; Fumikazu ; et al. | 2019-05-30 |
| Shield method for electronic component enclosure and shield material Grant 8,015,690 - Ueno , et al. September 13, 2 | 2011-09-13 |
| Thermosetting Resin Composition And Uncured Film Comprising The Same App 20090239992 - Yamada; Toshiaki ; et al. | 2009-09-24 |
| Shield method for electronic component enclosure and shield material App 20090223711 - Ueno; Yoshikazu ; et al. | 2009-09-10 |
| Epoxy Resin Composition App 20080020231 - Yamada; Toshiaki ; et al. | 2008-01-24 |
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