Terakado; Yoshimitsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Terakado; Yoshimitsu.The latest application filed is for "workpiece holding device for a bonding apparatus".
- Terakado; Yoshimitsu - Hachioji JP
- Terakado, Yoshimitsu - Hachioji-shi JP
- Terakado; Yoshimitsu - Tokyo JP
| Patent | Date |
|---|---|
| Workpiece holding device for a bonding apparatus Grant 6,645,346 - Mii , et al. November 11, 2 | 2003-11-11 |
| Workpiece holding device for a bonding apparatus App 20020105130 - Mii, Tatsunari ; et al. | 2002-08-08 |
| Wire bonding apparatus App 20020023942 - Terakado, Yoshimitsu ; et al. | 2002-02-28 |
| Wire bonding apparatus App 20010002032 - Terakado, Yoshimitsu ; et al. | 2001-05-31 |
| Spool holder structure for a wire bonder App 20010002038 - Terakado, Yoshimitsu ; et al. | 2001-05-31 |
| Wire bonding apparatus App 20010002031 - Mochida, Tooru ; et al. | 2001-05-31 |
| Wire bonding method and apparatus Grant 5,221,037 - Terakado , et al. June 22, 1 | 1993-06-22 |
| Method and apparatus for forming a ball at a bonding wire end Grant 5,214,259 - Terakado , et al. May 25, 1 | 1993-05-25 |
| Wire bonding method Grant 5,192,018 - Terakado , et al. March 9, 1 | 1993-03-09 |
| Detection method for wire bonding failures Grant 5,058,797 - Terakado , et al. October 22, 1 | 1991-10-22 |
| Device for detecting height of bonding surface Grant 5,046,655 - Ohashi , et al. September 10, 1 | 1991-09-10 |
| Method of wire bonding Grant 4,932,584 - Yamazaki , et al. June 12, 1 | 1990-06-12 |
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