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name:-0.0041429996490479
name:-0.010077953338623
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TERAI; YUKA Patent Filings

TERAI; YUKA

Patent Applications and Registrations

Patent applications and USPTO patent grants for TERAI; YUKA.The latest application filed is for "solid-state imaging element and method for manufacturing same".

Company Profile
0.9.3
  • TERAI; YUKA - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Solid-state Imaging Element And Method For Manufacturing Same
App 20130242149 - TERAI; YUKA ;   et al.
2013-09-19
Solid-state Imaging Device
App 20130075851 - TERAI; Yuka ;   et al.
2013-03-28
System and method for operation verification of semiconductor integrated circuit
Grant 7,171,640 - Terai , et al. January 30, 2
2007-01-30
System and method for operation verification of semiconductor integrated circuit
App 20060010407 - Terai; Yuka ;   et al.
2006-01-12
Apparatus and method for forming thin film
Grant 5,863,338 - Yamada , et al. January 26, 1
1999-01-26
Method of fabricating a semiconductor device
Grant 5,693,557 - Hirao , et al. December 2, 1
1997-12-02
Method of fabricating a semiconductor device
Grant 5,661,068 - Hirao , et al. August 26, 1
1997-08-26
Semiconductor device and process
Grant 5,633,211 - Imai , et al. May 27, 1
1997-05-27
Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture
Grant 5,576,247 - Yano , et al. November 19, 1
1996-11-19
Apparatus and method for forming thin film
Grant 5,501,739 - Yamada , et al. March 26, 1
1996-03-26
Method of fabricating capacitor or contact for semiconductor device by forming uneven oxide film and reacting silicon with metal containing gas
Grant 5,474,949 - Hirao , et al. December 12, 1
1995-12-12
Method for manufacturing a semiconductor device using a heat treatment according to a temperature profile that prevents grain or particle precipitation during reflow
Grant 5,314,848 - Yasui , et al. May 24, 1
1994-05-24

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