Terai; Hidetomi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Terai; Hidetomi.The latest application filed is for "tissue engineering of three-dimensional vascularized using microfabricated polymer assembly technology".
- Terai; Hidetomi - Osaka JP
| Patent | Date |
|---|---|
| Multilayer device for tissue engineering Grant 7,371,400 - Borenstein , et al. May 13, 2 | 2008-05-13 |
| Tissue engineering of three-dimensional vascularized using microfabricated polymer assembly technology App 20020182241 - Borenstein, Jeffrey T. ; et al. | 2002-12-05 |
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