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Three-dimensional Memory Device With Via Structures Surrounded By Perforated Dielectric Moat Structure And Methods Of Making The Same App 20210210424 - OTSU; Yoshitaka ;   et al. | 2021-07-08 |
Three-dimensional Memory Device Containing Through-array Contact Via Structures Between Dielectric Barrier Walls And Methods Of Making The Same App 20200402905 - OTSU; Yoshitaka ;   et al. | 2020-12-24 |
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A Three-dimensional Memory Device Having A Backside Contact Via Structure With A Laterally Bulging Portion At A Level Of Source Contact Layer App 20200357815 - Iwai; Takaaki ;   et al. | 2020-11-12 |
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Method of manufacturing semiconductor device on which a plurality of types of transistors are mounted Grant 8,039,358 - Terahara , et al. October 18, 2 | 2011-10-18 |
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Method For Manufacturing Semiconductor Device And Semiconductor Device Manufacturing System App 20090197355 - Terahara; Masanori | 2009-08-06 |
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Semiconductor device fabrication method Grant 6,979,610 - Terahara , et al. December 27, 2 | 2005-12-27 |
Semiconductor device fabrication method App 20040092082 - Terahara, Masanori ;   et al. | 2004-05-13 |