Terada; Tsunehiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Terada; Tsunehiko.The latest application filed is for "stretchable conductive film for textiles".

Company Profile

5.8.6

Terada; Tsunehiko - Kyoto JP
Terada; Tsunehiko - Osaka JP
Terada; Tsunehiko - Ikeda JP
Terada; Tsunehiko - Higashiosaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stretchable conductive film for textiles Grant 10,864,701 - Takahashi , et al. December 15, 2	2020-12-15
Silver chloride paste Grant 10,629,325 - Shinohara , et al.	2020-04-21
Stretchable Conductive Film For Textiles App 20200086606 - TAKAHASHI; Akio ; et al.	2020-03-19
Bioelectrode And Method For Producing Bioelectrode App 20190320923 - SHINOHARA; Keisho ; et al.	2019-10-24
Silver Chloride Paste App 20190139670 - SHINOHARA; Keisho ; et al.	2019-05-09
Electromagnetic Wave Shielding Film App 20190098742 - TAKAHASHI; Akio ; et al.	2019-03-28
Stretchable cable and stretchable circuit board Grant 10,178,766 - Takahashi , et al. J	2019-01-08
Stretchable Cable And Stretchable Circuit Board App 20180070446 - TAKAHASHI; Akio ; et al.	2018-03-08
Conductive Composition And Conductive Sheet Containing The Same App 20170194073 - TAKAHASHI; Akio ; et al.	2017-07-06
Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield Grant 5,981,043 - Murakami , et al. November 9, 1	1999-11-09
Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield Grant 5,736,070 - Murakami , et al. April 7, 1	1998-04-07
Printed circuit board with enhanced EMI suppression Grant 5,341,274 - Nakatani , et al. August 23, 1	1994-08-23
Printed circuit board capable of preventing electromagnetic interference Grant 4,801,489 - Nakagawa , et al. January 31, 1	1989-01-31
Conductive copper paste composition Grant 4,789,411 - Eguchi , et al. December 6, 1	1988-12-06

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