Tepolt; Gary B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tepolt; Gary B..The latest application filed is for "method and apparatus for forming multi-layered vias in sequentially fabricated circuits".
- Tepolt; Gary B. - Pelham NH
- Tepolt; Gary B. - North Pelham NH
| Patent | Date |
|---|---|
| Method and apparatus for forming multi-layered vias in sequentially fabricated circuits Grant 10,453,787 - Karpman , et al. Oc | 2019-10-22 |
| Electronic module subassemblies Grant 9,693,469 - Tepolt , et al. June 27, 2 | 2017-06-27 |
| Method And Apparatus For Forming Multi-layered Vias In Sequentially Fabricated Circuits App 20160343652 - Karpman; Maurice S. ; et al. | 2016-11-24 |
| Electronic modules Grant 9,425,069 - Racz , et al. August 23, 2 | 2016-08-23 |
| Electronic Module Subassemblies And Methods For Fabricating The Same App 20150181709 - Tepolt; Gary B. ; et al. | 2015-06-25 |
| Electronic Modules App 20130329376 - Racz; Livia M. ; et al. | 2013-12-12 |
| Electronic modules and methods for forming the same Grant 8,535,984 - Racz , et al. September 17, 2 | 2013-09-17 |
| Interposers, electronic modules, and methods for forming the same Grant 8,273,603 - Racz , et al. September 25, 2 | 2012-09-25 |
| Interposers, Electronic Modules, And Methods For Forming The Same App 20120086135 - Thompson; Jeffrey C. ; et al. | 2012-04-12 |
| Electronic Modules and Methods for Forming the Same App 20110309528 - Racz; Livia M. ; et al. | 2011-12-22 |
| Electronic modules and methods for forming the same Grant 8,017,451 - Racz , et al. September 13, 2 | 2011-09-13 |
| Removal of integrated circuits from packages Grant 7,981,698 - Pryputniewicz , et al. July 19, 2 | 2011-07-19 |
| Die thinning processes and structures Grant 7,960,247 - Thompson , et al. June 14, 2 | 2011-06-14 |
| Die Thinning Processes And Structures App 20090251879 - Thompson; Jeffrey C. ; et al. | 2009-10-08 |
| Electronic Modules and Methods for Forming the Same App 20090250823 - Racz; Livia M. ; et al. | 2009-10-08 |
| Interposers, Electronic Modules, And Methods For Forming The Same App 20090250249 - Racz; Livia M. ; et al. | 2009-10-08 |
| Removal of integrated circuits from packages App 20080217773 - Pryputniewicz; Dariusz R. ; et al. | 2008-09-11 |
| Robotic wafer handler Grant 5,746,565 - Tepolt May 5, 1 | 1998-05-05 |
| Process chamber for semiconductor substrates Grant 5,611,886 - Bachman , et al. March 18, 1 | 1997-03-18 |
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