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Patent applications and USPTO patent grants for Teng; Seng Kiong.The latest application filed is for "power bar design for lead frame-based packages".
Patent | Date |
---|---|
Power bar design for lead frame-based packages Grant 9,177,834 - Foong , et al. November 3, 2 | 2015-11-03 |
Coated lead frame bond finger Grant 9,129,951 - Teng , et al. September 8, 2 | 2015-09-08 |
Power Bar Design For Lead Frame-based Packages App 20150235924 - Foong; Chee Seng ;   et al. | 2015-08-20 |
Dual Corner Top Gate Molding App 20150118802 - Low; Boon Yew ;   et al. | 2015-04-30 |
Coated Lead Frame Bond Finger App 20150108623 - Teng; Seng Kiong ;   et al. | 2015-04-23 |
Hybrid lead frame and ball grid array package Grant 8,987,881 - Teng , et al. March 24, 2 | 2015-03-24 |
Hybrid Lead Frame And Ball Grid Array Package App 20150014834 - Teng; Seng Kiong ;   et al. | 2015-01-15 |
Lead frame with power bar for semiconductor device Grant 8,933,547 - Yap , et al. January 13, 2 | 2015-01-13 |
Method of assembling semiconductor device with heat spreader Grant 8,012,799 - Ibrahim , et al. September 6, 2 | 2011-09-06 |
Lead Frame And Semiconductor Package Manufactured Therewith App 20110204498 - Au; Yin Kheng ;   et al. | 2011-08-25 |
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