Teng; Seng Kiong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Teng; Seng Kiong.The latest application filed is for "power bar design for lead frame-based packages".
- Teng; Seng Kiong - Shah Alam N/A MY
- Teng; Seng Kiong - Segamat MY
- Teng; Seng Kiong - Kemuning Utama MY
| Patent | Date |
|---|---|
| Power bar design for lead frame-based packages Grant 9,177,834 - Foong , et al. November 3, 2 | 2015-11-03 |
| Coated lead frame bond finger Grant 9,129,951 - Teng , et al. September 8, 2 | 2015-09-08 |
| Power Bar Design For Lead Frame-based Packages App 20150235924 - Foong; Chee Seng ; et al. | 2015-08-20 |
| Dual Corner Top Gate Molding App 20150118802 - Low; Boon Yew ; et al. | 2015-04-30 |
| Coated Lead Frame Bond Finger App 20150108623 - Teng; Seng Kiong ; et al. | 2015-04-23 |
| Hybrid lead frame and ball grid array package Grant 8,987,881 - Teng , et al. March 24, 2 | 2015-03-24 |
| Hybrid Lead Frame And Ball Grid Array Package App 20150014834 - Teng; Seng Kiong ; et al. | 2015-01-15 |
| Lead frame with power bar for semiconductor device Grant 8,933,547 - Yap , et al. January 13, 2 | 2015-01-13 |
| Method of assembling semiconductor device with heat spreader Grant 8,012,799 - Ibrahim , et al. September 6, 2 | 2011-09-06 |
| Lead Frame And Semiconductor Package Manufactured Therewith App 20110204498 - Au; Yin Kheng ; et al. | 2011-08-25 |
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