Teng; Hung-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for Teng; Hung-An.The latest application filed is for "substrateless integrated circuit packages and methods of forming same".

Company Profile

1.10.10

Teng; Hung-An - Taoyuan TW
Teng; Hung-An - Taoyuan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrateless integrated circuit packages and methods of forming same Grant 10,290,604 - Huang , et al.	2019-05-14
Bump structure for yield improvement Grant 10,056,347 - Chiu , et al. August 21, 2	2018-08-21
Substrateless Integrated Circuit Packages and Methods of Forming Same App 20180114770 - Huang; Lin-Chih ; et al.	2018-04-26
Substrateless integrated circuit packages and methods of forming same Grant 9,842,825 - Huang , et al. December 12, 2	2017-12-12
Bump Structure for Yield Improvement App 20170133346 - Chiu; Tzu-Wei ; et al.	2017-05-11
Through silicon via keep out zone formation method and system Grant 9,640,490 - Hsieh , et al. May 2, 2	2017-05-02
Bump structure for yield improvement Grant 9,553,053 - Chiu , et al. January 24, 2	2017-01-24
Integrated Circuit Packages and Methods of Forming Same App 20160071816 - Huang; Lin-Chih ; et al.	2016-03-10
Through Silicon Via Keep Out Zone Formation Method and System App 20150270230 - Hsieh; Cheng-Chieh ; et al.	2015-09-24
Through silicon via keep out zone formation method and system Grant 9,054,166 - Hsieh , et al. June 9, 2	2015-06-09
Package Device Including An Opening In A Flexible Substrate And Methods Of Forming The Same App 20140264803 - Lin; Tsung-Shu ; et al.	2014-09-18
Package device including an opening in a flexible substrate and methods of forming the same Grant 8,836,094 - Lin , et al. September 16, 2	2014-09-16
Through Silicon Via Keep Out Zone Formation Method and System App 20140045332 - Hsieh; Cheng-Chieh ; et al.	2014-02-13
Bump Structure for Yield Improvement App 20140027900 - Chiu; Tzu-Wei ; et al.	2014-01-30
Through silicon via keep out zone formation along different crystal orientations Grant 8,604,619 - Hsieh , et al. December 10, 2	2013-12-10
Through Silicon Via Keep Out Zone Formation Method and System App 20130049220 - Hsieh; Cheng-Chieh ; et al.	2013-02-28

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