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Semiconductor device and manufacturing method thereof
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Capping Layer Overlying Dielectric Structure To Increase Reliability
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Semiconductor Interconnection Structure And Methods Of Forming The Same
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Semiconductor Structure and Method Making the Same
App 20220262726 - Huang; Hsin-Yen ; et al. | 2022-08-18 |
Dielectric Capping Structure Overlying A Conductive Structure To Increase Stability
App 20220254678 - Huang; Hsin-Yen ; et al. | 2022-08-11 |
Metal Oxide Composite As Etch Stop Layer
App 20220246468 - Cheng; Kai-Fang ; et al. | 2022-08-04 |
Semiconductor Devices With Air Gate Spacer And Air Gate Cap
App 20220238693 - Chuang; Cheng-Chi ; et al. | 2022-07-28 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220223465 - HUANG; Hsin-Yen ; et al. | 2022-07-14 |
Capping layer overlying dielectric structure to increase reliability
Grant 11,355,430 - Lo , et al. June 7, 2 | 2022-06-07 |
Interconnect Structure
App 20220157711 - Lee; Shao-Kuan ; et al. | 2022-05-19 |
Thermal Interconnect Structure For Thermal Management Of Electrical Interconnect Structure
App 20220157690 - Lee; Shao-Kuan ; et al. | 2022-05-19 |
Semiconductor structure and method making the same
Grant 11,328,991 - Huang , et al. May 10, 2 | 2022-05-10 |
Dielectric capping structure overlying a conductive structure to increase stability
Grant 11,322,395 - Huang , et al. May 3, 2 | 2022-05-03 |
Metal oxide composite as etch stop layer
Grant 11,315,828 - Cheng , et al. April 26, 2 | 2022-04-26 |
Semiconductor devices with air gate spacer and air gate cap
Grant 11,302,798 - Chuang , et al. April 12, 2 | 2022-04-12 |
Semiconductor Devices with Air Gate Spacer and Air Gate Cap
App 20210376111 - Chuang; Cheng-Chi ; et al. | 2021-12-02 |
Forming interlayer dielectric material by spin-on metal oxide deposition
Grant 11,049,811 - Teng , et al. June 29, 2 | 2021-06-29 |
Capping Layer Overlying Dielectric Structure To Increase Reliability
App 20210193566 - Lo; Ting-Ya ; et al. | 2021-06-24 |
Dielectric Capping Structure Overlying A Conductive Structure To Increase Stability
App 20210193505 - Huang; Hsin-Yen ; et al. | 2021-06-24 |
Semiconductor Device And Manufacturing Method Thereof
App 20210134666 - HUANG; Hsin-Yen ; et al. | 2021-05-06 |
Semiconductor device and manufacturing method thereof
Grant 10,867,847 - Huang , et al. December 15, 2 | 2020-12-15 |
Semiconductor Structure and Method Making the Same
App 20200328152 - Huang; Hsin-Yen ; et al. | 2020-10-15 |
Semiconductor structure and method making the same
Grant 10,700,000 - Huang , et al. | 2020-06-30 |
Metal Oxide Composite as Etch Stop Layer
App 20200058546 - Cheng; Kai-Fang ; et al. | 2020-02-20 |
Forming Interlayer Dielectric Material by Spin-On Metal Oxide Deposition
App 20190131240 - Teng; Chi-Lin ; et al. | 2019-05-02 |
Semiconductor device and manufacturing method thereof
Grant 10,211,097 - Huang , et al. Feb | 2019-02-19 |
Forming interlayer dielectric material by spin-on metal oxide deposition
Grant 10,163,797 - Teng , et al. Dec | 2018-12-25 |
Semiconductor Device And Manufacturing Method Thereof
App 20180350669 - HUANG; Hsin-Yen ; et al. | 2018-12-06 |
Semiconductor device structure
Grant 10,090,245 - Cheng , et al. October 2, 2 | 2018-10-02 |
Self-Aligned Interconnection Structure and Method
App 20180076132 - Tsai; Jung-Hsun ; et al. | 2018-03-15 |
Semiconductor Device Structure
App 20180033730 - CHENG; Kai-Fang ; et al. | 2018-02-01 |
Protecting layer in a semiconductor structure
Grant 9,859,152 - Teng , et al. January 2, 2 | 2018-01-02 |
Self-aligned interconnection structure and method
Grant 9,818,690 - Tsai , et al. November 14, 2 | 2017-11-14 |
Semiconductor device structure and method for forming the same
Grant 9,799,603 - Cheng , et al. October 24, 2 | 2017-10-24 |
Semiconductor Structure And Method Making The Same
App 20170256491 - Huang; Hsin-Yen ; et al. | 2017-09-07 |
Semiconductor Device Structure And Method For Forming The Same
App 20170213791 - CHENG; Kai-Fang ; et al. | 2017-07-27 |
Semiconductor Device And Manufacturing Method Thereof
App 20170194242 - HUANG; Hsin-Yen ; et al. | 2017-07-06 |
Semiconductor structure and method making the same
Grant 9,659,857 - Huang , et al. May 23, 2 | 2017-05-23 |
Self-Aligned Interconnection Structure and Method
App 20170125340 - Tsai; Jung-Hsun ; et al. | 2017-05-04 |
Forming Interlayer Dielectric Material By Spin-on Metal Oxide Deposition
App 20170103949 - Teng; Chi-Lin ; et al. | 2017-04-13 |
Protecting Layer in a Semiconductor Structure
App 20160300760 - Teng; Chi-Lin ; et al. | 2016-10-13 |
Protecting layer in a semiconductor structure
Grant 9,373,579 - Teng , et al. June 21, 2 | 2016-06-21 |
Interconnect structure including a continuous conductive body
Grant 9,281,263 - Lee , et al. March 8, 2 | 2016-03-08 |
Semiconductor devices and methods of forming same
Grant 9,165,822 - Huang , et al. October 20, 2 | 2015-10-20 |
Semiconductor Structure and Method Making the Same
App 20150171007 - HUANG; Hsin-Yen ; et al. | 2015-06-18 |
Semiconductor Devices and Methods of Forming Same
App 20140252624 - Huang; Hsin-Yen ; et al. | 2014-09-11 |
Interconnect Structure Including A Continuous Conductive Body
App 20140225261 - Lee; Ming Han ; et al. | 2014-08-14 |
Protecting Layer In A Semiconductor Structure
App 20140167229 - Teng; Chi-Lin ; et al. | 2014-06-19 |
Copper etch scheme for copper interconnect structure
Grant 8,735,278 - Lee , et al. May 27, 2 | 2014-05-27 |
Novel Copper Etch Scheme for Copper Interconnect Structure
App 20140021611 - Lee; Ming Han ; et al. | 2014-01-23 |
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