TENDOU; Kazuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for TENDOU; Kazuyoshi.The latest application filed is for "curable composition for forming elastic resin layer".

Company Profile

0.3.5

TENDOU; Kazuyoshi - Chiyoda-ku Tokyo
Tendou; Kazuyoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Curable Composition For Forming Elastic Resin Layer App 20190241694 - SHIBATA; Tomoaki ; et al.	2019-08-08
Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same Grant 7,982,322 - Tsuchida , et al. July 19, 2	2011-07-19
Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler Grant 7,981,977 - Tendou , et al. July 19, 2	2011-07-19
Epoxy resin molding material for sealing and electronic component Grant 7,675,185 - Tendou , et al. March 9, 2	2010-03-09
Liquid Resin Composition For Electronic Part Sealing, And Electronic Part Apparatus Utilizing The Same App 20100014263 - Tsuchida; Satoru ; et al.	2010-01-21
Liquid Resin Composition for Electronic Components and Electronic Component Device App 20090273070 - Tendou; Kazuyoshi ; et al.	2009-11-05
Epoxy Resin Molding Material for Sealing, and Electronic Component Device App 20090247670 - Hamada; Mitsuyoshi ; et al.	2009-10-01
Epoxy Resin Molding Material for Sealing and Electronic Component App 20070254986 - Tendou; Kazuyoshi ; et al.	2007-11-01

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