Patent | Date |
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Palladium coating thickness measurement Grant 9,593,931 - Tench , et al. March 14, 2 | 2017-03-14 |
Palladium Coating Thickness Measurement App 20140061064 - Tench; D. Morgan ;   et al. | 2014-03-06 |
Analyte detection via electrochemically transported and generated reagent Grant 8,153,062 - Kendig , et al. April 10, 2 | 2012-04-10 |
Analyte detection via electrochemically generated reagent App 20080241932 - Kendig; Martin W. ;   et al. | 2008-10-02 |
Electrode with transparent series resistance for uniform switching of optical modulation devices Grant 7,317,566 - Tench , et al. January 8, 2 | 2008-01-08 |
Electrode With Transparent Series Resistance For Uniform Switching Of Optical Modulation Devices App 20070053046 - Tench; D. Morgan ;   et al. | 2007-03-08 |
Locally-distributed electrode and method of fabrication Grant 7,022,210 - Tench April 4, 2 | 2006-04-04 |
Semiconductor wafer plating cell assembly Grant 6,989,084 - Tench , et al. January 24, 2 | 2006-01-24 |
Reversible electrodeposition optical modulation device with conducting polymer counter electrode App 20050248825 - Warren, Leslie F. JR. ;   et al. | 2005-11-10 |
Copper bath for electroplating fine circuitry on semiconductor chips App 20050067297 - Tench, D. Morgan ;   et al. | 2005-03-31 |
Locally-switched reversible electrodeposition optical modulator Grant 6,798,556 - Tench , et al. September 28, 2 | 2004-09-28 |
Locally-switched reversible electrodeposition optical modulator App 20040150866 - Tench, D. Morgan ;   et al. | 2004-08-05 |
Optimum switching of a reversible electrochemical mirror device Grant 6,721,080 - Tench , et al. April 13, 2 | 2004-04-13 |
Optimum Switching Of A Reversible Electrochemical Mirror Device App 20040061919 - Tench, D. Morgan ;   et al. | 2004-04-01 |
Integrated circuit plating using highly-complexed copper plating baths Grant 6,709,564 - Tench , et al. March 23, 2 | 2004-03-23 |
Locally-distributed electrode and method of fabrication App 20040020767 - Tench, D. Morgan | 2004-02-05 |
Semiconductor wafer plating cathode assembly Grant 6,579,430 - Davis , et al. June 17, 2 | 2003-06-17 |
Semiconductor wafer plating cathode assembly App 20030085119 - Davis, Greg ;   et al. | 2003-05-08 |
Semiconductor wafer plating cell assembly App 20030085118 - Tench, D. Morgan ;   et al. | 2003-05-08 |
Reversible electrodeposition device with ionic liquid electrolyte Grant 6,552,843 - Tench , et al. April 22, 2 | 2003-04-22 |
Controlled plating on reactive metals Grant 6,503,343 - Tench , et al. January 7, 2 | 2003-01-07 |
Fast-switching reversible electrochemical mirror (REM) Grant 6,400,491 - Tench , et al. June 4, 2 | 2002-06-04 |
Reversible electrochemical mirror (REM) state monitoring Grant 6,301,039 - Tench October 9, 2 | 2001-10-09 |
Diffusely-reflecting reversible electrochemical mirror Grant 6,256,135 - Tench , et al. July 3, 2 | 2001-07-03 |
Reversible electrochemical mirror for modulation of reflected radiation Grant 6,166,847 - Tench , et al. December 26, 2 | 2000-12-26 |
Reversible electrochemical mirror (REM) with improved electrolytic solution Grant 6,111,685 - Tench , et al. August 29, 2 | 2000-08-29 |
Reversible electrochemical mirror Grant 5,923,456 - Tench , et al. July 13, 1 | 1999-07-13 |
Electrodeposition cell with high light transmission Grant 5,903,382 - Tench , et al. May 11, 1 | 1999-05-11 |
Photoelectrochemical fabrication of electronic circuits Grant 5,595,637 - Tench , et al. January 21, 1 | 1997-01-21 |
Apparatus for assessing solderability Grant 5,401,380 - Tench , et al. March 28, 1 | 1995-03-28 |
Method of assessing solderability Grant 5,262,022 - Tench , et al. November 16, 1 | 1993-11-16 |
Photoelectrochemical imaging system Grant 5,206,102 - Tench April 27, 1 | 1993-04-27 |
Uniform solder coating on roughened substrate Grant 5,178,965 - Tench , et al. January 12, 1 | 1993-01-12 |