Templeton, Jr.; Thomas H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Templeton, Jr.; Thomas H..The latest application filed is for "enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board".

Company Profile

0.15.0

Templeton, Jr.; Thomas H. - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board Grant 7,145,085 - Keating , et al. December 5, 2	2006-12-05
Reinforced micromodule Grant 6,239,976 - Templeton , et al. May 29, 2	2001-05-29
Leadframe with power and ground planes Grant RE36,907 - Templeton, Jr. , et al. October 10, 2	2000-10-10
Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module Grant 6,058,017 - Horejs, Jr. , et al. May 2, 2	2000-05-02
Package integrated circuit having thermal enhancement and reduced footprint size Grant 5,874,321 - Templeton, Jr. , et al. February 23, 1	1999-02-23
Packaged integrated circuit having thermal enhancement and reduced footprint size Grant 5,766,975 - Templeton, Jr. , et al. June 16, 1	1998-06-16
Plastic integrated circuit card with reinforcement structure separated from integrated circuit module by card Grant 5,682,295 - Horejs, Jr. , et al. October 28, 1	1997-10-28
Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module Grant 5,682,294 - Horejs, Jr. , et al. October 28, 1	1997-10-28
Integrated circuit card having a reinforcement structure and an integrated circuit module disposed on opposing surfaces Grant 5,682,293 - Horejs, Jr. , et al. October 28, 1	1997-10-28
Plastic integrated circuit card with reinforcement structure located over integrated circuit module for protecting same Grant 5,682,296 - Horejs, Jr. , et al. October 28, 1	1997-10-28
Plastic integrated circuit card with reinforcement structure outer to the card and protecting integrated circuit module Grant 5,673,179 - Horejs, Jr. , et al. September 30, 1	1997-09-30
Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module Grant 5,581,445 - Horejs, Jr. , et al. December 3, 1	1996-12-03
Electrical interconnection for structure including electronic and/or electromagnetic devices Grant 5,519,201 - Templeton, Jr. , et al. May 21, 1	1996-05-21
Leadframe with power and ground planes Grant 5,457,340 - Templeton, Jr. , et al. October 10, 1	1995-10-10
Electrically tested and burned-in semiconductor die and method for producing same Grant 5,448,165 - Hodge , et al. September 5, 1	1995-09-05

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