Tellkamp; John P

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tellkamp; John P.The latest application filed is for "chip attachment layer having traverse-aligned conductive filler particles".

Company Profile

0.14.15

Tellkamp; John P - Rockwall TX US
TELLKAMP; John P. - Rockwall TX
Tellkamp; John P - Denison TX
Tellkamp; John P. - Denison TX
Tellkamp; John P. - Sherman TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged electronic device having metal comprising self-healing die attach material Grant 8,378,506 - Wainerdi , et al. February 19, 2	2013-02-19
Chip Attachment Layer Having Traverse-Aligned Conductive Filler Particles App 20120107552 - TELLKAMP; John P.	2012-05-03
Semiconductor device having grooved leads to confine solder wicking Grant 8,129,227 - Tellkamp March 6, 2	2012-03-06
Packaged Electronic Device Having Metal Comprising Self-Healing Die Attach Material App 20110227233 - WAINERDI; James C. ; et al.	2011-09-22
Packaged electronic device having metal comprising self-healing die attach material Grant 7,972,905 - Wainerdi , et al. July 5, 2	2011-07-05
Packaged Electronic Device Having Metal Comprising Self-healing Die Attach Material App 20100264553 - WAINERDI; JAMES C. ; et al.	2010-10-21
Composite metal column for mounting semiconductor device Grant 7,550,852 - Tellkamp , et al. June 23, 2	2009-06-23
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Grant 7,413,934 - Tellkamp August 19, 2	2008-08-19
Leadframes for Improved Moisture Reliability and Enhanced Solderability of Semiconductor Devices App 20080014757 - Tellkamp; John P.	2008-01-17
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Grant 7,256,481 - Tellkamp August 14, 2	2007-08-14
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices App 20070120233 - Tellkamp; John P.	2007-05-31
Composite metal column for mounting semiconductor device App 20070018304 - Tellkamp; John P. ; et al.	2007-01-25
Composite metal column for mounting semiconductor device Grant 7,125,789 - Tellkamp , et al. October 24, 2	2006-10-24
Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices Grant 7,095,121 - Tellkamp August 22, 2	2006-08-22
Method for the thermal testing of a thermal path to an integrated circuit App 20060156080 - Tellkamp; John P. ; et al.	2006-07-13
Anti-corrosion overcoat cover tape Grant 7,044,304 - Tellkamp , et al. May 16, 2	2006-05-16
Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices Grant 7,012,018 - Tellkamp March 14, 2	2006-03-14
Aluminum leadframes for semiconductor devices and method of fabrication Grant 6,933,177 - Tellkamp August 23, 2	2005-08-23
Aluminum leadframes for semiconductor devices and method of fabrication App 20040188810 - Tellkamp, John P.	2004-09-30
Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices App 20040164421 - Tellkamp, John P.	2004-08-26
Composite metal column for mounting semiconductor device App 20040135251 - Tellkamp, John P. ; et al.	2004-07-15
Aluminum leadframes with two nickel layers Grant 6,747,343 - Tellkamp June 8, 2	2004-06-08
Anti-corrosion overcoat cover tape App 20040040886 - Tellkamp, John P. ; et al.	2004-03-04
Sacrificial anode for corrosion protection of semiconductor metallization during sawing Grant 6,692,633 - Tellkamp February 17, 2	2004-02-17
Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices App 20030214037 - Tellkamp, John P.	2003-11-20
Aluminum leadframes for semiconductor devices and method of fabrication App 20030107112 - Tellkamp, John P.	2003-06-12
Sacrificial anode for corrosion protection of semiconductor metallization during sawing App 20020081776 - Tellkamp, John P.	2002-06-27
Semiconductor leadframes comprising silver plating App 20020047186 - Tellkamp, John P.	2002-04-25

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.