| Patent | Date |
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Neural Network Inference Circuit Employing Dynamic Memory Sleep
App 20220291739 - Ko; Jung ; et al. | 2022-09-15 |
Mitigating Overfitting In Training Machine Trained Networks
App 20220292359 - Teig; Steven L. | 2022-09-15 |
Device storing multiple sets of parameters for machine-trained network
Grant 11,429,861 - Teig , et al. August 30, 2 | 2022-08-30 |
Using quinary weights with neural network inference circuit designed for ternary weights
Grant 11,403,530 - Ko , et al. August 2, 2 | 2022-08-02 |
Direct-Bonded Native Interconnects And Active Base Die
App 20220238339 - DeLaCruz; Javier A. ; et al. | 2022-07-28 |
Using lookup table to represent neural network activation function
Grant 11,361,213 - Duong , et al. June 14, 2 | 2022-06-14 |
Mitigating overfitting in training machine trained networks
Grant 11,348,006 - Teig May 31, 2 | 2022-05-31 |
Neural network inference circuit employing dynamic memory sleep
Grant 11,347,297 - Ko , et al. May 31, 2 | 2022-05-31 |
Computation of neural network node
Grant 11,341,397 - Duong , et al. May 24, 2 | 2022-05-24 |
Three Dimensional Circuit Implementing Machine Trained Network
App 20220108161 - Teig; Steven L. ; et al. | 2022-04-07 |
Time-multiplexed dot products for neural network inference circuit
Grant 11,295,200 - Ko , et al. April 5, 2 | 2022-04-05 |
Direct-bonded native interconnects and active base die
Grant 11,289,333 - Delacruz , et al. March 29, 2 | 2022-03-29 |
3d Processor
App 20220068890 - Teig; Steven L. ; et al. | 2022-03-03 |
Using Batches Of Training Items For Training A Network
App 20220051002 - Sather; Eric A. ; et al. | 2022-02-17 |
Splitting neural network filters for implementation by neural network inference circuit
Grant 11,250,326 - Ko , et al. February 15, 2 | 2022-02-15 |
Machine-trained network detecting context-sensitive wake expressions for a digital assistant
Grant 11,250,840 - Teig February 15, 2 | 2022-02-15 |
Non-dot product computations on neural network inference circuit
Grant 11,222,257 - Ko , et al. January 11, 2 | 2022-01-11 |
Weight value decoder of neural network inference circuit
Grant 11,210,586 - Duong , et al. December 28, 2 | 2021-12-28 |
Neural network inference circuit
Grant 11,205,115 - Duong , et al. December 21, 2 | 2021-12-21 |
Three dimensional circuit implementing machine trained network
Grant 11,176,450 - Teig , et al. November 16, 2 | 2021-11-16 |
Computation of neural network node by neural network inference circuit
Grant 11,170,289 - Duong , et al. November 9, 2 | 2021-11-09 |
Using batches of training items for training a network
Grant 11,163,986 - Sather , et al. November 2, 2 | 2021-11-02 |
Differential correction map for GNSS
Grant 11,163,069 - Kroeger , et al. November 2, 2 | 2021-11-02 |
3D processor having stacked integrated circuit die
Grant 11,152,336 - Teig , et al. October 19, 2 | 2021-10-19 |
Video denoising using neural networks with spatial and temporal features
Grant 11,151,695 - Mihal , et al. October 19, 2 | 2021-10-19 |
Training network with discrete weight values
Grant 11,113,603 - Teig , et al. September 7, 2 | 2021-09-07 |
Reduced Dot Product Computation Circuit
App 20210263995 - Duong; Kenneth ; et al. | 2021-08-26 |
3d Chip Sharing Data Bus
App 20210202445 - DeLaCruz; Javier A. ; et al. | 2021-07-01 |
Stacked Ic Structure With Orthogonal Interconnect Layers
App 20210202387 - Mohammed; Ilyas ; et al. | 2021-07-01 |
Encoding of weight values stored on neural network inference circuit
Grant 11,049,013 - Duong , et al. June 29, 2 | 2021-06-29 |
Machine Learning Through Multiple Layers Of Novel Machine Trained Processing Nodes
App 20210182689 - Teig; Steven L. | 2021-06-17 |
Device storing ternary weight parameters for machine-trained network
Grant 11,017,295 - Teig , et al. May 25, 2 | 2021-05-25 |
Reduced dot product computation circuit
Grant 11,003,736 - Duong , et al. May 11, 2 | 2021-05-11 |
3D chip sharing power interconnect layer
Grant 10,978,348 - DeLaCruz , et al. April 13, 2 | 2021-04-13 |
Reduced-area circuit for dot product computation
Grant 10,977,338 - Duong , et al. April 13, 2 | 2021-04-13 |
3d Chip With Shared Clock Distribution Network
App 20210104436 - DeLaCruz; Javier ; et al. | 2021-04-08 |
Time borrowing between layers of a three dimensional chip stack
Grant 10,970,627 - Teig , et al. April 6, 2 | 2021-04-06 |
Stacked IC structure with system level wiring on multiple sides of the IC die
Grant 10,950,547 - Mohammed , et al. March 16, 2 | 2021-03-16 |
Machine learning through multiple layers of novel machine trained processing nodes
Grant 10,936,951 - Teig March 2, 2 | 2021-03-02 |
Quantizing Neural Networks Using Shifting And Scaling
App 20210034982 - Sather; Eric A. ; et al. | 2021-02-04 |
Quantizing Neural Networks Using Approximate Quantization Function
App 20210034955 - Sather; Eric A. ; et al. | 2021-02-04 |
Face-to-face mounted IC dies with orthogonal top interconnect layers
Grant 10,892,252 - Nequist , et al. January 12, 2 | 2021-01-12 |
3D chip with shared clock distribution network
Grant 10,886,177 - DeLaCruz , et al. January 5, 2 | 2021-01-05 |
Device Disaggregation For Improved Performance
App 20200403006 - Delacruz; Javier A. ; et al. | 2020-12-24 |
Differential correction map for GNSS
Grant 10,871,578 - Kroeger , et al. December 22, 2 | 2020-12-22 |
Machine learning through multiple layers of novel machine trained processing nodes
Grant 10,867,247 - Teig December 15, 2 | 2020-12-15 |
Direct-Bonded Native Interconnects And Active Base Die
App 20200357641 - Delacruz; Javier A. ; et al. | 2020-11-12 |
Direct-bonded native interconnects and active base die
Grant 10,832,912 - Delacruz , et al. November 10, 2 | 2020-11-10 |
Reduced Dot Product Computation Circuit
App 20200342046 - Duong; Kenneth ; et al. | 2020-10-29 |
Time Borrowing Between Layers Of A Three Dimensional Chip Stack
App 20200293872 - Teig; Steven L. ; et al. | 2020-09-17 |
3D Chip with Shared Clock Distribution Network
App 20200294858 - DeLaCruz; Javier ; et al. | 2020-09-17 |
Self repairing neural network
Grant 10,762,420 - Teig , et al. Sep | 2020-09-01 |
Stacked IC Structure with System Level Wiring on Multiple Sides of the IC Die
App 20200273798 - Mohammed; Ilyas ; et al. | 2020-08-27 |
Reduced dot product computation circuit
Grant 10,740,434 - Duong , et al. A | 2020-08-11 |
Using Batches Of Training Items For Training A Network
App 20200250476 - Kind Code | 2020-08-06 |
Three dimensional chip structure implementing machine trained network
Grant 10,719,762 - Teig , et al. | 2020-07-21 |
3d Processor
App 20200227389 - Teig; Steven L. ; et al. | 2020-07-16 |
3D Chip Sharing Power Interconnect Layer
App 20200219771 - DeLaCruz; Javier ; et al. | 2020-07-09 |
Device disaggregation for improved performance
Grant 10,700,094 - Delacruz , et al. | 2020-06-30 |
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers
App 20200203318 - Nequist; Eric M. ; et al. | 2020-06-25 |
Direct-bonded Native Interconnects And Active Base Die
App 20200194262 - DELACRUZ; Javier A. ; et al. | 2020-06-18 |
Self healing compute array
Grant 10,684,929 - Delacruz , et al. | 2020-06-16 |
3D compute circuit with high density Z-axis interconnects
Grant 10,672,744 - Teig , et al. | 2020-06-02 |
3D processor
Grant 10,672,745 - Teig , et al. | 2020-06-02 |
3D Compute circuit with high density z-axis interconnects
Grant 10,672,743 - Teig , et al. | 2020-06-02 |
3D chip sharing power circuit
Grant 10,672,663 - DeLaCruz , et al. | 2020-06-02 |
Using batches of training items for training a network
Grant 10,671,888 - Sather , et al. | 2020-06-02 |
Time borrowing between layers of a three dimensional chip stack
Grant 10,607,136 - Teig , et al. | 2020-03-31 |
3D chip sharing power interconnect layer
Grant 10,600,691 - DeLaCruz , et al. | 2020-03-24 |
3D chip sharing data bus circuit
Grant 10,600,780 - DeLaCruz , et al. | 2020-03-24 |
3D chip sharing data bus
Grant 10,600,735 - DeLaCruz , et al. | 2020-03-24 |
Probabilistic loss function for training network with triplets
Grant 10,592,732 - Sather , et al. | 2020-03-17 |
3D chip with shielded clock lines
Grant 10,593,667 - DeLaCruz , et al. | 2020-03-17 |
Mitigating overfitting in training machine trained networks
Grant 10,586,151 - Teig | 2020-03-10 |
3D chip sharing clock interconnect layer
Grant 10,586,786 - DeLaCruz , et al. | 2020-03-10 |
Face-to-face mounted IC dies with orthogonal top interconnect layers
Grant 10,580,757 - Nequist , et al. | 2020-03-03 |
Stacked IC structure with system level wiring on multiple sides of the IC die
Grant 10,580,735 - Mohammed , et al. | 2020-03-03 |
Device Disaggregation For Improved Performance
App 20200051999 - Delacruz; Javier A. ; et al. | 2020-02-13 |
Differential Correction Map for GNSS
App 20200025937 - KROEGER; Brian ; et al. | 2020-01-23 |
Direct-bonded native interconnects and active base die
Grant 10,522,352 - Delacruz , et al. Dec | 2019-12-31 |
Differential Correction Map for GNSS
App 20190391276 - KROEGER; Brian ; et al. | 2019-12-26 |
3D Compute Circuit with High Density Z-Axis Interconnects
App 20190123023 - Teig; Steven L. ; et al. | 2019-04-25 |
3D Processor
App 20190123024 - Teig; Steven L. ; et al. | 2019-04-25 |
3D Compute Circuit with High Density Z-Axis Interconnects
App 20190123022 - Teig; Steven L. ; et al. | 2019-04-25 |
Three Dimensional Circuit Implementing Machine Trained Network
App 20190042929 - Teig; Steven L. ; et al. | 2019-02-07 |
Self Repairing Neural Network
App 20190042377 - Teig; Steven L. ; et al. | 2019-02-07 |
Time Borrowing Between Layers Of A Three Dimensional Chip Stack
App 20190042912 - Teig; Steven L. ; et al. | 2019-02-07 |
Three Dimensional Chip Structure Implementing Machine Trained Network
App 20190043832 - Teig; Steven L. ; et al. | 2019-02-07 |
3D Chip Sharing Clock Interconnect Layer
App 20180350775 - DeLaCruz; Javier ; et al. | 2018-12-06 |
3D Chip with Shielded Clock Lines
App 20180331095 - DeLaCruz; Javier ; et al. | 2018-11-15 |
3D Chip Sharing Power Circuit
App 20180330993 - DeLaCruz; Javier ; et al. | 2018-11-15 |
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers
App 20180331072 - Nequist; Eric M. ; et al. | 2018-11-15 |
3D Chip Sharing Power Interconnect Layer
App 20180330992 - DeLaCruz; Javier ; et al. | 2018-11-15 |
3D Chip Sharing Data Bus
App 20180331038 - DeLaCruz; Javier ; et al. | 2018-11-15 |
Stacked IC Structure with System Level Wiring on Multiple Sides of the IC Die
App 20180331037 - Mohammed; Ilyas ; et al. | 2018-11-15 |
3D Chip Sharing Data Bus Circuit
App 20180331094 - DeLaCruz; Javier ; et al. | 2018-11-15 |
Self Healing Compute Array
App 20180173600 - DELACRUZ; Javier A. ; et al. | 2018-06-21 |
Direct-bonded native interconnects and active base die
App 20180102251 - DELACRUZ; Javier A. ; et al. | 2018-04-12 |
Configurable machine learning assemblies for autonomous operation in personal devices
App 20180025268 - TEIG; Steven L. ; et al. | 2018-01-25 |
Method And Apparatus For Conformationally Analyzing Molecular Fragments
App 20010056329 - SMELLIE, ANDREW S. ; et al. | 2001-12-27 |
Computer graphics system for selectively modelling molecules and investigating the chemical and physical properties thereof
Grant 5,555,366 - Teig , et al. September 10, 1 | 1996-09-10 |
Computer graphics system for selectively modelling molecules and investigating the chemical and physical properties thereof
Grant 5,386,507 - Teig , et al. January 31, 1 | 1995-01-31 |
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