Tei; Shinsuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tei; Shinsuke.The latest application filed is for "wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device".

Company Profile

0.14.16

Tei; Shinsuke - Tokyo JP
Tei; Shinsuke - Musashimurayama JP
Tei; Shinsuke - Musashimurayama-shi JP
Tei; Shinsuke - Tachikawa JP
Tei; Shinsuke - Tachikawa-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wire bonding apparatus and manufacturing method for semiconductor apparatus Grant 11,450,640 - Tei September 20, 2	2022-09-20
Wire Bonding Apparatus, Method For Manufacture Of Semiconductor Device, And Semiconductor Device App 20220208721 - YOSHINO; Hiroaki ; et al.	2022-06-30
Wire Bonding Apparatus And Manufacturing Method For Semiconductor Apparatus App 20200203307 - TEI; Shinsuke	2020-06-25
Wire bonding method and semiconductor device Grant 8,815,732 - Mii , et al. August 26, 2	2014-08-26
Semiconductor device Grant 8,232,656 - Mii , et al. July 31, 2	2012-07-31
Method of manufacturing semiconductor device and wire bonding apparatus Grant 8,196,803 - Akiyama , et al. June 12, 2	2012-06-12
Wire Bonding Method And Semiconductor Device App 20120139129 - Mii; Tatsunari ; et al.	2012-06-07
Wire bonding apparatus and wire bonding method Grant 8,191,759 - Tei , et al. June 5, 2	2012-06-05
Wire bonding method and semiconductor device Grant 8,143,155 - Mii , et al. March 27, 2	2012-03-27
Method Of Manufacturing Semiconductor Device And Wire Bonding Apparatus App 20120055976 - Akiyama; Shinichi ; et al.	2012-03-08
Method of manufacturing semiconductor device and wire bonding apparatus Grant 8,123,108 - Akiyama , et al. February 28, 2	2012-02-28
Wire Bonding Apparatus And Wire Bonding Method App 20110278349 - Tei; Shinsuke ; et al.	2011-11-17
Method Of Manufacturing Semiconductor Device And Wire Bonding Apparatus App 20110180590 - Akiyama; Shinichi ; et al.	2011-07-28
Wire bonding method Grant 7,934,634 - Mii , et al. May 3, 2	2011-05-03
Semiconductor device App 20110079904 - Mii; Tatsunari ; et al.	2011-04-07
Wire bonding apparatus, record medium storing bonding control program, and bonding method Grant 7,857,190 - Takahashi , et al. December 28, 2	2010-12-28
Wire bonding method and semiconductor device Grant 7,851,347 - Mii , et al. December 14, 2	2010-12-14
Wire bonding apparatus, record medium storing bonding control program, and bonding method App 20100206849 - Takahashi; Kuniyuki ; et al.	2010-08-19
Wire bonding method and semiconductor device App 20100207280 - Mii; Tatsunari ; et al.	2010-08-19
Wire bonding method and semiconductor device App 20100148369 - Mii; Tatsunari ; et al.	2010-06-17
Wire bonding apparatus, record medium storing bonding control program , and bonding method App 20100133322 - Takahashi; Kuniyuki ; et al.	2010-06-03
Wire bonding apparatus, record medium storing bonding control program, and bonding method Grant 7,699,209 - Tei April 20, 2	2010-04-20
Wire bonding apparatus, record medium storing bonding control program, and bonding method Grant 7,686,204 - Takahashi , et al. March 30, 2	2010-03-30
Tail wire cutting method and bonding apparatus Grant 7,658,314 - Tei , et al. February 9, 2	2010-02-09
Wire bonding method App 20090194577 - Mii; Tatsunari ; et al.	2009-08-06
Tail wire cutting method and bonding apparatus App 20070246513 - Tei; Shinsuke ; et al.	2007-10-25
Wire bonding apparatus, record medium storing bonding control program, and bonding method App 20070187138 - Takahashi; Kuniyuki ; et al.	2007-08-16
Wire bonding apparatus, record medium storing bonding control program, and bonding method App 20070187470 - Tei; Shinsuke	2007-08-16
Wire bonding method App 20060175383 - Mii; Tatsunari ; et al.	2006-08-10

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.