Teh; Pheak Ti
Patent Applications and Registrations
Patent applications and USPTO patent grants for Teh; Pheak Ti.The latest application filed is for "conductive polygon power and ground interconnects for integrated-circuit packages".
- Teh; Pheak Ti - Tanjung Bungah MY
- Teh; Pheak Ti - Jitra N/A MY
| Patent | Date |
|---|---|
| Conductive Polygon Power And Ground Interconnects For Integrated-circuit Packages App 20210183758 - Bin Abdullah; Mohd Muhaiyiddin ; et al. | 2021-06-17 |
| Integrated circuit package substrates having a common die dependent region and methods for designing the same Grant 9,780,040 - Tan , et al. October 3, 2 | 2017-10-03 |
| Integrated circuit package with a universal lead frame Grant 9,337,240 - Lee , et al. May 10, 2 | 2016-05-10 |
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