Tee; Chua Chee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tee; Chua Chee.The latest application filed is for "method of forming a high k metallic dielectric layer".
- Tee; Chua Chee - Singapore SG
| Patent | Date |
|---|---|
| Method of forming a high K metallic dielectric layer Grant 6,764,914 - See , et al. July 20, 2 | 2004-07-20 |
| Method of forming a high K metallic dielectric layer App 20030104673 - See, Alex ; et al. | 2003-06-05 |
| Method of forming of high K metallic dielectric layer Grant 6,492,242 - See , et al. December 10, 2 | 2002-12-10 |
| Method to fabricate RF inductors with minimum area Grant 6,387,747 - Cha , et al. May 14, 2 | 2002-05-14 |
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