Taylor; E. Jennings

Patent Applications and Registrations

Patent applications and USPTO patent grants for Taylor; E. Jennings.The latest application filed is for "method and apparatus for electrochemical dewatering of suspensions of cellulosic nanomaterials".

Company Profile

7.40.37

Taylor; E. Jennings - Troy OH
Taylor; E. Jennings - Andover MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And Apparatus For Electrochemical Dewatering Of Suspensions Of Cellulosic Nanomaterials App 20200346953 - Hall; Timothy D. ; et al.	2020-11-05
Electrochemical mirror system and method Grant 10,684,522 - Taylor , et al.	2020-06-16
Electrochemical Mirror System And Method App 20200026138 - Taylor; E. Jennings ; et al.	2020-01-23
Pulsed Current Catalyzed Gas Diffusion Electrodes For High Rate, Efficient Co2 Conversion Reactors App 20190112720 - Skinn; Brian T. ; et al.	2019-04-18
Apparatus for recovery of material generated during electrochemical material removal in acidic electrolytes Grant 10,214,832 - Taylor , et al. Feb	2019-02-26
Apparatus For Recovery Of Material Generated During Electrochemical Material Removal In Acidic Electrolytes App 20180230621 - Taylor; E. Jennings ; et al.	2018-08-16
Electrochemical System And Method For Electropolishing Superconductive Radio Frequency Cavities App 20180178302 - Taylor; E. Jennings ; et al.	2018-06-28
Electrochemical system and method for electropolishing hollow metal bodies Grant 9,987,699 - Taylor , et al. June 5, 2	2018-06-05
Apparatus and method for recovery of material generated during electrochemical material removal in acidic electrolytes Grant 9,938,632 - Taylor , et al. April 10, 2	2018-04-10
Electrolytic system and method for filtering an aqueous particulate suspension Grant 9,546,101 - Taylor , et al. January 17, 2	2017-01-17
Apparatus And Method For Recovery Of Material Generated During Electrochemical Material Removal In Acidic Electrolytes App 20160230303 - Taylor; E. Jennings ; et al.	2016-08-11
Method and apparatus for pulsed electrochemical grinding Grant 9,403,228 - Taylor , et al. August 2, 2	2016-08-02
Method And Apparatus For Pulsed Electrochemical Grinding App 20160031026 - Taylor; E. Jennings ; et al.	2016-02-04
Electrolytic System And Method For Filtering An Aqueous Particulate Suspension App 20150291455 - Taylor; E. Jennings ; et al.	2015-10-15
Electrolytic system and method for filtering an aqueous particulate suspension Grant 9,095,808 - Taylor , et al. August 4, 2	2015-08-04
Electrochemical System And Method For Electropolishing Hollow Metal Bodies App 20150114847 - Taylor; E. Jennings ; et al.	2015-04-30
Electrochemical system and method for electropolishing superconductive radio frequency cavities Grant 9,006,147 - Taylor , et al. April 14, 2	2015-04-14
Electrochemical System And Method For Electropolishing Superconductive Radio Frequency Cavities App 20140018244 - Taylor; E. Jennings ; et al.	2014-01-16
Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit Grant 8,603,315 - Taylor , et al. December 10, 2	2013-12-10
Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating Grant 8,329,006 - Gebhart , et al. December 11, 2	2012-12-11
Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating Grant 8,226,804 - Gebhart , et al. July 24, 2	2012-07-24
Electrolytic System And Method For Concentrating An Aqueous Particulate Suspenson App 20120091002 - Taylor; E. Jennings ; et al.	2012-04-19
Electrolytic System And Method For Filtering An Aqueous Particulate Suspension App 20120091000 - Taylor; E. Jennings ; et al.	2012-04-19
Electrochemical System And Method For Machining Strongly Passivating Metals App 20110303553 - Inman; Maria E. ; et al.	2011-12-15
Electroplating Cell With Hydrodynamics Facilitating More Uniform Deposition On A Workpiece With Through Holes During Plating App 20110209991 - Gebhart; Lawrence E. ; et al.	2011-09-01
Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes Grant 7,947,161 - Gebhart , et al. May 24, 2	2011-05-24
Electrochemical Etching And Polishing Of Conductive Substrates App 20110017608 - Taylor; E. Jennings ; et al.	2011-01-27
Electroplating Cell With Hydrodynamics Facilitating More Uniform Deposition Across A Workpiece During Plating App 20090205953 - Gebhart; Lawrence E. ; et al.	2009-08-20
Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating Grant 7,553,401 - Gebhart , et al. June 30, 2	2009-06-30
Electroplating Cell With Hydrodynamics Facilitating More Uniform Deposition On A Workpiece With Through Holes During Plating App 20080035475 - Gebhart; Lawrence E. ; et al.	2008-02-14
Tin And Tin Alloy Electroplating Method With Controlled Internal Stress And Grain Size Of The Resulting Deposit App 20070158204 - Taylor; E. Jennings ; et al.	2007-07-12
Electrochemical etching of circuitry for high density interconnect electronic modules App 20060207888 - Taylor; E. Jennings ; et al.	2006-09-21
Electrolytic etching of metal layers Grant 7,022,216 - Taylor , et al. April 4, 2	2006-04-04
Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating App 20050205429 - Gebhart, Lawrence E. ; et al.	2005-09-22
Electrochemical etching of circuitry for high density interconnect electronic modules App 20050145506 - Taylor, E. Jennings ; et al.	2005-07-07
Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates Grant 6,878,259 - Taylor , et al. April 12, 2	2005-04-12
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes Grant 6,863,793 - Taylor , et al. March 8, 2	2005-03-08
Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields Grant 6,827,833 - Taylor , et al. December 7, 2	2004-12-07
Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes Grant 6,750,144 - Taylor June 15, 2	2004-06-15
Electrolytic etching of metal layers App 20040011666 - Taylor, E. Jennings ; et al.	2004-01-22
Electrolytic etching of metal layers App 20040004006 - Taylor, E. Jennings ; et al.	2004-01-08
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes Grant 6,652,727 - Taylor , et al. November 25, 2	2003-11-25
Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes App 20030178315 - Taylor, E. Jennings	2003-09-25
Sequential electromachining and electropolishing of metals and the like using modulated electric fields Grant 6,558,231 - Taylor May 6, 2	2003-05-06
Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields App 20030075450 - Taylor, E. Jennings ; et al.	2003-04-24
Electrodeposition of metals for forming three-dimensional microstructures Grant 6,551,485 - Taylor April 22, 2	2003-04-22
Electrodeposition of metals in small recesses using modulated electric fields Grant 6,524,461 - Taylor , et al. February 25, 2	2003-02-25
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes App 20030010642 - Taylor, E. Jennings ; et al.	2003-01-16
Electrodeposition of metals in small recesses using modulated electric fields App 20020056645 - Taylor, E. Jennings ; et al.	2002-05-16
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes App 20020038764 - Taylor, E. Jennings ; et al.	2002-04-04
Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates App 20020033341 - Taylor, E. Jennings ; et al.	2002-03-21
Electroplating Of Metals Using Pulsed Reverse Current For Control Of Hydrogen Evolution App 20010054557 - TAYLOR, E. JENNINGS ; et al.	2001-12-27
Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates Grant 6,319,384 - Taylor , et al. November 20, 2	2001-11-20
Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes Grant 6,309,528 - Taylor , et al. October 30, 2	2001-10-30
Electrodeposition of metals in small recesses using modulated electric fields Grant 6,303,014 - Taylor , et al. October 16, 2	2001-10-16
Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating Grant 6,210,555 - Taylor , et al. April 3, 2	2001-04-03
Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates Grant 6,203,684 - Taylor , et al. March 20, 2	2001-03-20
Electrodeposition of catalytic metals using pulsed electric fields Grant 6,080,504 - Taylor , et al. June 27, 2	2000-06-27
Method of removing metal salts from solution by electrolysis an electrode closely associated with an ion exchange resin Grant 5,804,057 - Zhou , et al. September 8, 1	1998-09-08
Electrode for peroxide generator and method for preparing it Grant 5,695,622 - Fraser , et al. December 9, 1	1997-12-09
Process for making peroxide Grant 5,647,968 - Fraser , et al. July 15, 1	1997-07-15
Electrolysis of electroactive species using pulsed current Grant 5,599,437 - Taylor , et al. February 4, 1	1997-02-04
Electrochemical peroxide generator Grant 5,565,073 - Fraser , et al. October 15, 1	1996-10-15

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