TAYAGAKI; Naoya

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAYAGAKI; Naoya.The latest application filed is for "heat-expandable microspheres and application thereof".

Company Profile

3.4.5

TAYAGAKI; Naoya - Yao-shi Osaka
Tayagaki; Naoya - Yao JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat-expandable Microspheres And Application Thereof App 20210363320 - TAYAGAKI; Naoya ; et al.	2021-11-25
Hollow resin particles and application thereof Grant 10,774,192 - Tayagaki , et al. September 15, 2	2020-09-15
Rubber composition for vulcanization molding, process for manufacturing the same and application thereof Grant 10,731,020 - Tayagaki , et al.	2020-08-04
Hollow Resin Particles And Application Thereof App 20190194415 - TAYAGAKI; Naoya ; et al.	2019-06-27
Rubber Composition For Vulcanization Molding, Process For Manufacturing The Same And Application Thereof App 20180208733 - TAYAGAKI; Naoya ; et al.	2018-07-26
Heat-expandable microspheres, process for producing the same, and application thereof Grant 10,030,115 - Tayagaki , et al. July 24, 2	2018-07-24
Heat-expandable microspheres, process for producing the same, and application thereof Grant 9,663,626 - Tayagaki , et al. May 30, 2	2017-05-30
Heat-expandable Microspheres, Process For Producing The Same, And Application Thereof App 20160237234 - TAYAGAKI; Naoya ; et al.	2016-08-18
Heat-expandable Microspheres, Process For Producing The Same, And Application Thereof App 20140364521 - Tayagaki; Naoya ; et al.	2014-12-11

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