Tay; Wee Boon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tay; Wee Boon.The latest application filed is for "an electrical connection structure and an electronic device including the same".

Company Profile

4.6.7

Tay; Wee Boon - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
An Electrical Connection Structure And An Electronic Device Including The Same App 20220173020 - Tay; Wee Boon ; et al.	2022-06-02
Topside-cooled semiconductor package with molded standoff Grant 11,239,127 - Myers , et al. February 1, 2	2022-02-01
Topside-cooled Semiconductor Package With Molded Standoff App 20210398867 - MYERS; Edward ; et al.	2021-12-23
Interconnect clip with angled contact surface and raised bridge Grant 11,183,451 - Lee , et al. November 23, 2	2021-11-23
Semiconductor Package And Method For Fabricating The Same App 20210313294 - Chiang; Chau Fatt ; et al.	2021-10-07
Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier Grant 10,978,378 - Bemmerl , et al. April 13, 2	2021-04-13
Interconnect Clip with Angled Contact Surface and Raised Bridge Technical Field App 20210074667 - Lee; Chai Chee ; et al.	2021-03-11
Interconnect Clip with Angled Contact Surface and Raised Bridge App 20210074628 - Lee; Chai Chee ; et al.	2021-03-11
Encapsulated Leadless Package Having an at Least Partially Exposed Interior Sidewall of a Chip Carrier App 20190189542 - Bemmerl; Thomas ; et al.	2019-06-20
Semiconductor chip package having contact pins at short side edges Grant 10,037,934 - Otremba , et al. July 31, 2	2018-07-31
Strip testing of semiconductor devices Grant 9,728,492 - See , et al. August 8, 2	2017-08-08
Semiconductor device including a solder barrier Grant 9,640,459 - Tay , et al. May 2, 2	2017-05-02
Semiconductor Chip Package Having Contact Pins at Short Side Edges App 20160233149 - Otremba; Ralf ; et al.	2016-08-11

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