Tay; Seok Kim

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tay; Seok Kim.The latest application filed is for "semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus".

Company Profile

13.9.25

Tay; Seok Kim - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially Grant 11,452,212 - Tuominen , et al. September 20, 2	2022-09-20
Component carrier and method of manufacturing a component carrier Grant 11,445,601 - Tuominen , et al. September 13, 2	2022-09-13
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus App 20220256686 - Tuominen; Mikael ; et al.	2022-08-11
Semi-Flex Component Carrier With Dielectric Material Having High Elongation and Low Young Modulus App 20220159828 - Tuominen; Mikael ; et al.	2022-05-19
Component carrier with embedded large die Grant 11,330,706 - Tay , et al. May 10, 2	2022-05-10
Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus Grant 11,291,119 - Tuominen , et al. March 29, 2	2022-03-29
Semi-flex component carrier with dielectric material having high elongation and low young modulus Grant 11,284,508 - Tuominen , et al. March 22, 2	2022-03-22
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer App 20220078923 - Tay; Seok Kim ; et al.	2022-03-10
Component Carrier With Well-Defined Outline Sidewall Cut by Short Laser Pulse and/or Green Laser App 20220061162 - Tay; Seok Kim ; et al.	2022-02-24
Semi-Flexible Component Carrier With Stepped Layer Structure App 20220039259 - Xin; Nick ; et al.	2022-02-03
Component carrier with through hole extending through multiple dielectric layers Grant 11,160,165 - Tuominen , et al. October 26, 2	2021-10-26
Component Carrier With Embedded Component Exposed by Blind Hole App 20210243889 - Tuominen; Mikael ; et al.	2021-08-05
Electronic package comprising a decoupling layer structure Grant 11,083,081 - Tuominen , et al. August 3, 2	2021-08-03
Component Carrier Having Component Covered With Ultra-Thin Transition Layer App 20210227702 - Tuominen; Mikael ; et al.	2021-07-22
Component Carrier and Method of Manufacturing a Component Carrier App 20210204399 - Tuominen; Mikael ; et al.	2021-07-01
Component Carrier With Low Shrinkage Dielectric Material App 20210202355 - Tuominen; Mikael ; et al.	2021-07-01
Arrangement With Central Carrier And Two Opposing Layer Stacks, Component Carrier and Manufacturing Method App 20210202427 - Tuominen; Mikael ; et al.	2021-07-01
Manufacturing holes in component carrier material Grant 11,039,535 - Tay , et al. June 15, 2	2021-06-15
AI-based Automatic Judgment Unit for Quality Classification of Semifinished Component Carriers of a Panel Based on Automatic Optical Inspection App 20210158499 - Tay; Seok Kim ; et al.	2021-05-27
User Interface for Judgment Concerning Quality Classification of Displayed Arrays of Component Carriers App 20210158508 - Nickkholgh; Amin ; et al.	2021-05-27
Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric App 20210161012 - Ismail; Ismadi Bin ; et al.	2021-05-27
Component Carrier With Embedded Component And Horizontally Elongated Via App 20210127478 - Feng; Gin ; et al.	2021-04-29
Component Carrier With Electrically Conductive Layer Structures Having Windows Defined By a Conformal Mask and Tapering at Least Partially App 20210127496 - Tuominen; Mikael ; et al.	2021-04-29
Component Carrier With Through Hole Extending Through Multiple Dielectric Layers App 20210100095 - Tuominen; Mikael ; et al.	2021-04-01
Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric Grant 10,966,318 - Ismail , et al. March 30, 2	2021-03-30
Traceability of Subsequent Layer Structure Manufacturing of Main Body for Component Carriers by means of Laterally and Verticially Displaced Information Carrying Structures App 20210084752 - Tay; Seok Kim ; et al.	2021-03-18
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus App 20210045249 - Tuominen; Mikael ; et al.	2021-02-11
Semi-Flex Component Carrier With Dielectric Material Having High Elongation and low Young Modulus App 20210045235 - Tuominen; Mikael ; et al.	2021-02-11
Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectri App 20200253053 - Kind Code	2020-08-06
Component Carrier With Through Hole Filled With Extra Plating Structure Between Sidewalls and Plated Bridge Structure App 20200253062 - Kind Code	2020-08-06
Manufacturing Holes In Component Carrier Material App 20200253051 - Kind Code	2020-08-06
Electronic Package Comprising a Decoupling Layer Structure App 20200163206 - Tuominen; Mikael ; et al.	2020-05-21
Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished Product App 20200163223 - Mok; Jeesoo ; et al.	2020-05-21
Component Carrier With Embedded Large Die App 20200163205 - Tay; Seok Kim ; et al.	2020-05-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.