Tay; Martin Tiong We
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tay; Martin Tiong We.The latest application filed is for "printhead assembly with profiled exterior surface".
- Tay; Martin Tiong We - Balmain AU
| Patent | Date |
|---|---|
| Printhead Assembly With Profiled Exterior Surface App 20110025778 - Karppinen; Vesa ; et al. | 2011-02-03 |
| Printhead with exterior surface profiled for wiping maintenance station Grant 7,832,838 - Karppinen , et al. November 16, 2 | 2010-11-16 |
| Fabrication Of A Printhead Integrated Circuit Attachment Film By Photopatterning App 20090233050 - Lee; Seung Jin ; et al. | 2009-09-17 |
| Printhead With Exterior Surface Profiled For Wiping Maintenance Station App 20090179963 - Karppinen; Vesa ; et al. | 2009-07-16 |
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