loadpatents
Patent applications and USPTO patent grants for Tawara; Satoshi.The latest application filed is for "room temperature bonding apparatus".
Patent | Date |
---|---|
Room temperature bonding apparatus Grant 9,005,390 - Tsuno , et al. April 14, 2 | 2015-04-14 |
Room temperature bonding machine and room temperature bonding method Grant 8,985,175 - Kinouchi , et al. March 24, 2 | 2015-03-24 |
Room temperature bonding apparatus Grant 8,906,175 - Kinouchi , et al. December 9, 2 | 2014-12-09 |
Room temperature bonding apparatus Grant 8,857,487 - Tsuno , et al. October 14, 2 | 2014-10-14 |
Wafer bonding apparatus Grant 8,578,993 - Tawara November 12, 2 | 2013-11-12 |
Room Temperature Bonding Apparatus App 20120285624 - TSUNO; Takeshi ;   et al. | 2012-11-15 |
Room Temperature Bonding Apparatus App 20110277904 - Kinouchi; Masato ;   et al. | 2011-11-17 |
Wafer Bonding Apparatus App 20110209832 - Tawara; Satoshi | 2011-09-01 |
Room Temperature Bonding Machine And Room Temperature Bonding Method App 20110083801 - Kinouchi; Masato ;   et al. | 2011-04-14 |
Room Temperature Bonding Apparatus App 20110011536 - Tsuno; Takeshi ;   et al. | 2011-01-20 |
Method Of Manufacturing Microstructure And Manufacturing System For The Same App 20070256774 - Tsuno; Takeshi ;   et al. | 2007-11-08 |
Manufacturing system for microstructure App 20050229737 - Tsuno, Takeshi ;   et al. | 2005-10-20 |
Method of manufacturing microstructure and manufacturing system for the same App 20050233064 - Tsuno, Takeshi ;   et al. | 2005-10-20 |
Grinding apparatus using fluid servomotor Grant 6,783,430 - Tawara August 31, 2 | 2004-08-31 |
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