TATSUMI; Noriyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for TATSUMI; Noriyuki.The latest application filed is for "silicon device structure, and sputtering target used for forming the same".

Company Profile

0.6.9

TATSUMI; Noriyuki - Kasumigaura-shi JP
Tatsumi; Noriyuki - Kasumigaura N/A JP
Tatsumi; Noriyuki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon Device Structure, And Sputtering Target Used For Forming The Same App 20130126345 - TATSUMI; Noriyuki ; et al.	2013-05-23
Silicon device structure, and sputtering target used for forming the same Grant 8,410,581 - Tatsumi , et al. April 2, 2	2013-04-02
Interconnecting Structure Production Method, And Interconnecting Structure App 20120248611 - TATSUMI; Noriyuki	2012-10-04
Interconnecting structure production method, and interconnecting structure Grant 8,227,347 - Tatsumi July 24, 2	2012-07-24
Wiring structure and method for fabricating the same Grant 8,173,905 - Tatsumi , et al. May 8, 2	2012-05-08
Silicon Device Structure, And Sputtering Target Used For Forming The Same App 20120007077 - TATSUMI; Noriyuki ; et al.	2012-01-12
Cu-Ga ALLOY MATERIAL, SPUTTERING TARGET, METHOD OF MAKING Cu-Ga ALLOY MATERIAL, Cu-In-Ga-Se ALLOY FILM, AND METHOD OF MAKING Cu-In-Ga-Se ALLOY FILM App 20110284372 - HIRAMOTO; Yuichi ; et al.	2011-11-24
Sputtering Target Material App 20110139615 - TATSUMI; Noriyuki ; et al.	2011-06-16
Wiring structure and method for fabricating the same Grant 7,884,010 - Tatsumi , et al. February 8, 2	2011-02-08
Interconnecting Structure Production Method, And Interconnecting Structure App 20100264415 - TATSUMI; Noriyuki	2010-10-21
Wiring structure and method for fabricating the same App 20100096172 - Tatsumi; Noriyuki ; et al.	2010-04-22
Wiring structure and method for fabricating the same App 20100096755 - Tatsumi; Noriyuki ; et al.	2010-04-22
Copper Sputtering Target Material And Sputtering Method App 20100000857 - TONOGI; Tatsuya ; et al.	2010-01-07
Process for depositing oxide film on metallic substrate by heat plasma flash evaporation method Grant 5,453,306 - Tatsumi , et al. September 26, 1	1995-09-26

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.